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Three-dimensional Mapping (three-dimensional + mapping)
Selected AbstractsNonfluoroscopic Three-Dimensional Mapping for Arrhythmia Ablation: Tool or Toy?JOURNAL OF CARDIOVASCULAR ELECTROPHYSIOLOGY, Issue 3 2000APICHAI KHONGPHATTHANAYOTHIN M.D. Arrhythmia Ahlation with Nonfluoroscopic 3D Mapping. Introduction: Conventional mapping and ablation rely on fluoroscopy, which can result in imprecise positioning of the ablation catheter and long fluoroscopic exposure times. We evaluated a nonfluoroscopic three-dimensional mapping system, termed CARTO, and compared the results of ablation using this technique with those of conventional mapping. Methods and Results: We compared the results of 88 arrhythmia ablations (79 patients) using CARTO with 100 ablations (94 patients) using the conventional technique. The ablations were separated into four groups: (1) AV nodal reentrant tachycardia (AVNRT); (2) atrial tachycardia/flutter; (3) ventricular tacbycardia (VT); and (4) bypass tract tachycardia. We compared the success rate, complications, and fluoroscopy and procedure times. Tbe ablation outcomes were excellent and comparable in all four types of the arrhythmias between the two techniques. Major complications included one cardiac tamponade in each group and one second-degree AV block in the conventional group. Fluoroscopy time was shorter using the CARTO technique: 10 ± 7 versus 27 ± 15 minutes for AVNRT (P < 0.01), 18 ± 17 versus 44 ± 23 minutes for atrial tachycardia and flutter (P < 0.01), 15 ± 12 versus 34 ± 31 minutes for VT (P < 0.05), and 21 ± 14 versus 53 ± 32 minutes for bypass tract tachycardia (P < 0.01). Procedure times were similar except for the bypass tract patients, wbich was shorter in the CARTO group, 4 ± 1.3 versus 5.5 ± 2.5 hours (P < 0.01). Conclusion: The electroanatomic three-dimensional mapping technique reduced fluoroscopy time and resulted in excellent outcome without increasing the procedure time. [source] Three-Dimensional Mapping of Atypical Right Atrial Flutter Late after Chest StabbingPACING AND CLINICAL ELECTROPHYSIOLOGY, Issue 3 2008DANIEL STEVEN M.D. We present the case of a female patient who previously underwent cardiac surgery for traumatic anterior right atrial perforation after a stabbing attack. Four years later the patient presented with right atrial common type flutter and isthmus ablation was performed subsequently. However, three years after isthmus ablation the patient was readmitted with atypical right atrial flutter. Electrophysiological study revealed persistent bidirectional isthmus block. Three-dimensional mapping (NavX, St. Jude Medical, St. Paul, MN, USA) demonstrated an incisional tachycardia with the critical isthmus at the border of the anterior area of scar in a close proximity to the superior tricuspid annulus. After ablation of this isthmus the patient was arrhythmia free after a follow-up of 9 months. This case illustrates that three-dimensional scar mapping may help to identify unusual isthmus sites that may be simultaneously responsible for both typical and atypical atrial flutter. [source] Three-Dimensional Atomic Force Microscopy , Taking Surface Imaging to the Next LevelADVANCED MATERIALS, Issue 26-27 2010Mehmet Z. Baykara Abstract Materials properties are ultimately determined by the nature of the interactions between the atoms that form the material. On surfaces, the site-specific spatial distribution of force and energy fields governs the phenomena encountered. This article reviews recent progress in the development of a measurement mode called three-dimensional atomic force microscopy (3D-AFM) that allows the dense, three-dimensional mapping of these surface fields with atomic resolution. Based on noncontact atomic force microscopy, 3D-AFM is able to provide more detailed information on surface properties than ever before, thanks to the simultaneous multi-channel acquisition of complementary spatial data such as local energy dissipation and tunneling currents. By illustrating the results of experiments performed on graphite and pentacene, we explain how 3D-AFM data acquisition works, what challenges have to be addressed in its realization, and what type of data can be extracted from the experiments. Finally, a multitude of potential applications are discussed, with special emphasis on chemical imaging, heterogeneous catalysis, and nanotribology. [source] A novel multi-detection technique for three-dimensional reciprocal-space mapping in grazing-incidence X-ray diffractionJOURNAL OF SYNCHROTRON RADIATION, Issue 6 2008M. Schmidbauer A new scattering technique in grazing-incidence X-ray diffraction geometry is described which enables three-dimensional mapping of reciprocal space by a single rocking scan of the sample. This is achieved by using a two-dimensional detector. The new set-up is discussed in terms of angular resolution and dynamic range of scattered intensity. As an example the diffuse scattering from a strained multilayer of self-assembled (In,Ga)As quantum dots grown on GaAs substrate is presented. [source] Light as a Controlling ToolLASER TECHNIK JOURNAL, Issue 1 2010White Light Interferometry in Quality Assurance of Photovoltaic Samples The photovoltaic industry is characterized by a permanent, substantial growing during the last years. Today improving efficiencies and reduction of manufacturing cost of solar cells is essential for the success in the competitive market. The reduction of manufacturing costs is associated with high volume manufacturing of the solar cells by perpetuation of high quality standards and requirements for small tolerances. Measurements of the topography of solar cells now start to play an important role in the quality assurance of the manufacturing process. It allows the three-dimensional mapping of a complete area with subsequent parameter extraction: so the efficiency of a solar cell depends on the wafer structure: Perfect smooth surfaces absorb less photons than surfaces with a certain, optimized roughness, whereas protecting layers should be as smooth and flat as possible. Similar to all Microsystems the structures can be investigated and compared to the target values: examples are layer thickness, widths and depths of structured lines, the volume-determination of hollows, defects, pores or abrasion/deposition rates. It also encompasses the 3D profile of printed circuit board tracks or special structures for sophisticated high efficiency photovoltaic elements. [source] | ||||||||||