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Telecommunication Equipment (telecommunication + equipment)
Selected AbstractsPower quality state estimationEUROPEAN TRANSACTIONS ON ELECTRICAL POWER, Issue 1 2010Neville R. Watson Abstract Due to the size and complexity of modern electrical power networks and the cost of monitoring and telecommunication equipment, it is unfeasible to fully monitor the system state. For this reason state estimation techniques are used. With strategically placed measurements, estimation techniques can determine the parameters at unmonitored locations. Fundamental frequency state estimation is now a standard tool in modern power systems. The emission and immunity levels of modern electrical equipment are different to that of the past, and this has resulted in power quality issues have become important. Knowledge of the source and location of the disturbances is desirable so that remedial action can be taken promptly. Recent contributions have extended the concept to: harmonic state estimation (HSE) and identification of harmonic sources, transient state estimation (TSE) and voltage sag state estimation (VSSE), which are all types of power quality state estimation (PQSE). This paper provides an overview of the state-of-the-art techniques currently available for PQSE in a large electrical power system. Copyright © 2009 John Wiley & Sons, Ltd. [source] SNMP for home automationINTERNATIONAL JOURNAL OF NETWORK MANAGEMENT, Issue 4 2004Ran Giladi Home and building automation applications impose the need for convergence, or at least interoperability, of data networks with intelligent building networks. This situation entails the use of a unified management system. In this paper we extend the traditional SNMP-based network management system paradigm by creating an integrated site network management system that contains data elements, telecommunication equipment and intelligent building devices. A possible architecture based on a proxy gateway is presented and analyzed. We suggest an implementation and potential applications.,Copyright © 2004 John Wiley & Sons, Ltd. [source] Enhanced energy efficiency and reliability of telecommunication equipment with the introduction of novel air cooled thermal architecturesBELL LABS TECHNICAL JOURNAL, Issue 2 2010Domhnaill Hernon In the past, thermal management was an afterthought in the design process of a product owing to the fact that heat dissipation loads and densities were minute and did not adversely affect component reliability. In fact, it may be stated that, historically, the sole purpose of thermal management was to ensure component operation below a critical temperature thereby providing reliable equipment operation for a given time period. However, this mindset has evolved in recent years given current economic and energy concerns. Climate change concern owing to vast green house gas emissions, increasing fuel and electricity costs, and a general trend towards energy-efficiency awareness has promoted thermal management to the forefront of "green" innovation within the information and communications technology (ICT) sector. If one considers the fact that up to 50 percent of the energy budget of a data center is spent on cooling equipment and that two percent of the United States' annual electricity is consumed by telecommunications equipment, it becomes obvious that thermal management has a key role to play in the development of eco-sustainable solutions. This paper will provide an overview of the importance of thermal management for reliable component operation and highlight the research areas where improved energy efficiency can be achieved. Novel air-cooled thermal solutions demonstrating significant energy savings and improved reliability over existing technology will be presented including three dimensional (3D) monolithic heat sinks and vortex generators. © 2010 Alcatel-Lucent. [source] Thermal design of central office telecommunication equipmentBELL LABS TECHNICAL JOURNAL, Issue 3 2009Wei Ling Thermal design is in the critical path of all telecommunication equipment product development because of the steady, unabated increase in equipment power densities to satisfy the level of features, services, and performance demanded by customers. Proper thermal design contributes to the overall quality, functionality, and reliability of Alcatel-Lucent solutions and can provide a marketing advantage as a differentiator with respect to the competition. This paper describes in detail the thermal design process for a typical telecommunication equipment application in a central office environment. Experience is shared on the challenges, pitfalls, and common tools/approaches for both system-level and board-level (circuit pack) thermal design, as well as the thermal testing of prototypes. © 2009 Alcatel-Lucent. [source] Entrepreneurial Geographies: Support Networks in Three High-Technology IndustriesECONOMIC GEOGRAPHY, Issue 2 2005Martin Kenney Abstract: Using a unique database derived from prospectuses for U.S. initial public stock offerings, we examine the location of four actors (the firm's lawyers, the venture capitalists on the board of directors, the other members of the board of directors, and the lead investment banker) of the entrepreneurial support network for startup firms in three high-technology industries: semiconductors, telecommunications equipment, and biotechnology. We demonstrate that the economic geography of the biotechnology support network differs significantly from the networks in semiconductors and telecommunications equipment. Biotechnology has a far-more-dispersed entrepreneurial support network structure than do the two electronics-related industries. The case of biotechnology indicates that if the source of seeds for new firms is highly dispersed, then an industry may not experience the path-dependent clustering suggested by geographers. We argue that contrary to common belief, biotechnology and its support network do not exhibit as great a clustering as do semiconductors and telecommunications equipment and their support networks. This argument leads to an epistemological issue, namely, the lack of interindustry comparative work. This is an odd omission, since nearly all authors agree that industries are based on particular knowledge bases, yet few consider that the knowledge and the sources of it may have an impact on spatial distributions. [source] Optimization of integrated circuits placement for electric field reduction inside telecommunications equipment using Monte Carlo simulation and parallel recombinative simulated annealingMICROWAVE AND OPTICAL TECHNOLOGY LETTERS, Issue 12 2007Sotirios K. Goudos Abstract This article presents a novel approach to the modeling and reduction of electromagnetic interference (EMI) caused by radiated emissions of integrated circuits (ICs) inside rectangular metallic enclosures of telecommunications devices. This type of analysis applies for several types of modern telecommunications equipment found in high-speed networks as well as in mobile communications. A generic model of such a device is created. The ICs are modeled as small electric dipoles and their interaction with the enclosure walls is studied by using the dyadic Green's functions. The electric field on the enclosure walls is computed and its reduction is studied as optimization problem using evolutionary algorithms. Two algorithms are employed: Genetic algorithms (GAs) and parallel recombinative simulated annealing (PRSA). PRSA is a hybrid evolutionary strategy that inherits properties from both GAs and simulated annealing. Monte Carlo simulation is subsequently applied to the optimization results to derive the electric field on the metallic walls and also to perform a worst-case analysis. The applications of the above approach in early PCB design process are discussed. © 2007 Wiley Periodicals, Inc. Microwave Opt Technol Lett 49: 3049,3055, 2007; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.22893 [source] Enhanced energy efficiency and reliability of telecommunication equipment with the introduction of novel air cooled thermal architecturesBELL LABS TECHNICAL JOURNAL, Issue 2 2010Domhnaill Hernon In the past, thermal management was an afterthought in the design process of a product owing to the fact that heat dissipation loads and densities were minute and did not adversely affect component reliability. In fact, it may be stated that, historically, the sole purpose of thermal management was to ensure component operation below a critical temperature thereby providing reliable equipment operation for a given time period. However, this mindset has evolved in recent years given current economic and energy concerns. Climate change concern owing to vast green house gas emissions, increasing fuel and electricity costs, and a general trend towards energy-efficiency awareness has promoted thermal management to the forefront of "green" innovation within the information and communications technology (ICT) sector. If one considers the fact that up to 50 percent of the energy budget of a data center is spent on cooling equipment and that two percent of the United States' annual electricity is consumed by telecommunications equipment, it becomes obvious that thermal management has a key role to play in the development of eco-sustainable solutions. This paper will provide an overview of the importance of thermal management for reliable component operation and highlight the research areas where improved energy efficiency can be achieved. Novel air-cooled thermal solutions demonstrating significant energy savings and improved reliability over existing technology will be presented including three dimensional (3D) monolithic heat sinks and vortex generators. © 2010 Alcatel-Lucent. [source] | |||||||||||||