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Substrate Thickness (substrate + thickness)
Selected AbstractsQuasi-static analysis of microstrip lines with variation of substrate thickness in transverse directionINTERNATIONAL JOURNAL OF RF AND MICROWAVE COMPUTER-AIDED ENGINEERING, Issue 3 2003S. Khoulji Abstract This article is devoted to the analysis of microstrip lines printed on dielectric substrates with transversely varying thickness using the quasi-static approximation and the method of lines. Discretization lines of varying length, according to the layer thickness, are used and only the Laplace wave equation has to be solved. The numerical results presented herein permit the illustration of the effect of arbitrarily curved substrate interfaces along the transverse direction on the characteristics of the microstrip structures under consideration. The behavior of the per unit length parameters of these structures as a function of the shape of these substrates' cross section is studied in depth. Furthermore, the effects of the finite metallization thickness and losses are also investigated in detail. The results that are obtained are consistent with those published in the literature. © 2003 Wiley Periodicals, Inc. Int J RF and Microwave CAE 13: 194,205, 2003. [source] Compact ultra-wide band microwave filter utilizing quarter-wave length short-circuited stubs with reduced number of viasMICROWAVE AND OPTICAL TECHNOLOGY LETTERS, Issue 9 2009Mohammad Shahrazel Razalli Abstract We present here a novel pattern with compact size of ultra-wide band microstrip filter. The filter is originally modeled from five poles quarter-wavelength short-circuited stubs. It is then, transformed into a new compact butterfly-like pattern. This new "butterfly-shaped" pattern consists of three vias instead of five vias from its original design. The prototype has shown an improvement in scattering parameters measurement compared with its original model. It delivers 112% of fractional bandwidth, magnitude of insertion loss better than 1.6 dB and return loss lower than ,8 dB. It is fabricated on RT Duroid 5880 with 2.2 dielectric constant, 0.508 mm of substrate thickness and 35 ,m copper thickness. The overall dimension of the filter is 20.7 × 15.8 mm2. © 2009 Wiley Periodicals, Inc. Microwave Opt Technol Lett 51: 2116,2119, 2009; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.24568 [source] Effects of film and substrate dimensions on warpage of film insert molded partsPOLYMER ENGINEERING & SCIENCE, Issue 6 2010Seong Yun Kim Three-dimensional flow and structural analyses were carried out for film insert injection molding to investigate warpage of film insert molded (FIM) parts with respect to variation of film and substrate thickness. Asymmetry of temperature distribution in the thickness direction was increased with increasing film thickness but decreased with increasing substrate thickness. Asymmetry of the in-mold residual stress distribution in the FIM specimen was generated by the nonuniform temperature distribution, and it was increased with increasing film thickness but reduced with increasing substrate thickness. Warpage of the ejected FIM specimen was determined by relaxation of the asymmetric in-mold residual stress distribution, and it was increased with increasing film thickness but reduced with increasing substrate thickness. Warpage of FIM specimens annealed at 80°C for 30 min showed complex behavior, and the behavior was understood by using factors such as degree of warpage of the ejected part, thermal shrinkage of the inserted film, and retardation of heat transfer. POLYM. ENG. SCI., 2010. © 2010 Society of Plastics Engineers [source] Measurement of the Debonding Resistance of Strongly Adherent Thick Coatings on Metals via In-plane Tensile Straining,ADVANCED ENGINEERING MATERIALS, Issue 5 2007S. Ryelandt When the ratio hc/hs of coating and substrate thicknesses is large enough, interfacial debonding can be induced to propagate from the root of a transverse crack under in-plane loading. An energy balance analysis accounting for the flow rule of the substrate allows translating the load for steady state debonding into an upper bound for the debonding toughness. The method is validated by FEM simulations using a cohesive zone model. [source] Thin absorbers using space-filling curve artificial magnetic conductorsMICROWAVE AND OPTICAL TECHNOLOGY LETTERS, Issue 3 2009John McVay Abstract Following our previous work, here an artificial magnetic conducting (AMC) surface, comprised of Hilbert and/or Peano space-filling curve inclusions is utilized as a thin electromagnetic absorber. Numerical results are presented to show the effects of the incident angle, conducting strip widths and substrate thicknesses on the absorbing properties of such surfaces. The performance of a fabricated thin absorber in reducing the RCS of a conducting plate is demonstrated through measurement. © 2009 Wiley Periodicals, Inc. Microwave Opt Technol Lett 51: 785,790, 2009; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.24186 [source] | |||||||||||||