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Solder Joints (solder + joint)

Distribution by Scientific Domains

Polymers and Materials Science	100%

Selected Abstracts

In Situ and Ex Situ Nanomechanical Analysis of Reactive Nanolayer Solder Joints,

ADVANCED ENGINEERING MATERIALS, Issue 8 2009
Michael Tong
The nanomechanical behavior of NiAl derived from explosively RNLs in reactive solder joints is studied using in situ nanocompression and nanoindentation. We report the direct analysis of <011> slip and discuss the role it plays in the much disputed ductility of NiAl. The hardness, modulus, and residual stress in the NiAl layer are studied by load-displacement curve analysis. [source]

High-Reliability Connection Products for Packaging Technology in Microelectronics

ADVANCED ENGINEERING MATERIALS, Issue 4 2009
Joerg Trodler
The current reliability problems related to bonding wires and solder paste are shown, and possible solutions are discussed. Five morphological categories of failure modes are identified. We set out the basic principles for specifying solder pastes, especially with regard to the powder used. The continuing trend towards miniaturization of SMT assembly production demands a commensurate reduction in powder-particle size, and the use of a compatible fluxing system. A judicious selection of the powder type can improve printing and soldering quality, and thus expand the process-operation window. Comparing wire-bonding technology with solder joints for Flip Chip applications, failure mechanisms, like Kirkendall voids, are present and will be discussed. [source]

Beurteilung von Loten und Lötverbindungen unter dem Einfluss steigender Kupfergehalte in verunreinigten bleifreien Lotbädern

MATERIALWISSENSCHAFT UND WERKSTOFFTECHNIK, Issue 1 2008
B. Wielage
Lead-free solders; phase selection; deep-etching; intermetallic compounds Abstract Zuverlässigkeit und Degradationsverhalten bleifreier Lote sind aufgrund von Widersprüchlichkeiten und notwendiger Problemlösungen nach wie vor Aspekte weiterer Untersuchungen. Die vorliegende Arbeit zeigt anhand von Phasenselektion der intermetallischen Phasen Ag3Sn und Cu6Sn5 sowie (Cu,Ni)6Sn5 und (Ni,Cu)3Sn4 morphologisch-mikrostrukturelle Zusammenhänge in Verbindung mit mechanischen Eigenschaften auf. Dazu wurden insbesondere das metallografische Tiefätzen und die instrumentierte Eindringprüfung genutzt. Die Lotlegierungen SnAg3,8CuX und SnCuXNi0,07 und deren Lötverbindungen wurden durch verschiedene Methoden komplex evaluiert. Es konnte nachgewiesen werden, dass das Zulegieren von Nickel als degradationsvermindernde Maßnahme des Kupfer-Leachings zur Versprödung der Legierung durch das Wachstum der Phase (Cu,Ni)6Sn5 führen kann. Evaluation of solders and solder joints processed in lead free solder baths with increasing copper content Reliability and degradation behavior of lead-free solders are due to contradictions and necessary problem solving remaining aspects of further investigations. This paper shows morphologic and microstructural relationships in conjunction with mechanical properties on the intermetallic phases Ag3Sn and Cu6Sn5 as well as (Cu, Ni)6Sn5 and (Ni, Cu)3Sn4. In particular, the methods of metallographic deep-etching and the instrumented indentation hardness test were applied. The solders SnAg3,8CuX and SnCuXNi0,07 and their solder joints were comprehensively evaluated by various methods. It has been shown that alloying with nickel as a method of decreasing copper-leaching can induce embrittlement by growth of the (Cu,Ni)6Sn5 phase. [source]