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Residual Compressive Stress (residual + compressive_stress)
Selected AbstractsLaser shock peening on fatigue crack growth behaviour of aluminium alloyFATIGUE & FRACTURE OF ENGINEERING MATERIALS AND STRUCTURES, Issue 8 2004Y. TAN ABSTRACT The effect of laser shock peening (LPS) in the fatigue crack growth behaviour of a 2024-T3 aluminium alloy with various notch geometries was investigated. LPS was performed under a ,confined ablation mode' using an Nd: glass laser at a laser power density of 5 GW cm,2. A black paint coating layer and water layer was used as a sacrificial and plasma confinement layer, respectively. The shock wave propagates into the material, causing the surface layer to deform plastically, and thereby, develop a residual compressive stress at the surface. The residual compressive stress as a function of depth was measured by X-ray diffraction technique. The fatigue crack initiation life and fatigue crack growth rates of an Al alloy with different preexisting notch configurations were characterized and compared with those of the unpeened material. The results clearly show that LSP is an effective surface treatment technique for suppressing the fatigue crack growth of Al alloys with various preexisting notch configurations. [source] Fretting fatigue behaviour of shot-peened Ti-6Al-4V at room and elevated temperaturesFATIGUE & FRACTURE OF ENGINEERING MATERIALS AND STRUCTURES, Issue 9 2003H. LEE ABSTRACT Fretting fatigue behaviour of shot-peened titanium alloy, Ti-6Al-4V was investigated at room and elevated temperatures. Constant amplitude fretting fatigue tests were conducted over a wide range of maximum stresses, ,max= 333 to 666 MPa with a stress ratio of R= 0.1. Two infrared heaters, placed at the front and back of specimen, were used to heat and maintain temperature of the gage section of specimen at 260 °C. Residual stress measurements by X-ray diffraction method before and after fretting test showed that residual compressive stress was relaxed during fretting fatigue. Elevated temperature induced more residual stress relaxation, which, in turn, decreased fretting fatigue life significantly at 260 °C. Finite element analysis (FEA) showed that the longitudinal tensile stress, ,xx varied with the depth inside the specimen from contact surface during fretting fatigue and the largest ,xx could exist away from the contact surface in a certain situation. A critical plane based fatigue crack initiation model, modified shear stress range parameter (MSSR), was computed from FEA results to characterize fretting fatigue crack initiation behaviour. It showed that stress relaxation during test affected fretting fatigue life and location of crack initiation significantly. MSSR parameter also predicted crack initiation location, which matched with experimental observations and the number of cycles for crack initiation, which showed the appropriate trend with the experimental observations at both temperatures. [source] Preparation of Highly Dense PZN,PZT Thick Films by the Aerosol Deposition Method Using Excess-PbO PowderJOURNAL OF THE AMERICAN CERAMIC SOCIETY, Issue 11 2007Jong-Jin Choi Lead zinc niobate,lead zirconate titanate thick films with a thickness of 50,100 ,m were deposited on silicon and alumina substrates using the aerosol deposition method. The effects of excess lead oxide (PbO) on stress relaxation during postannealing were studied. Excess PbO content was varied from 0 to 5 mol%. The as-deposited film had a fairly dense microstructure with nanosized grains. The films deposited on silicon were annealed at temperatures of 700°C, and the films deposited on sapphire were annealed at 900°C in an electrical furnace. The annealed film was detached and cracks were generated due to the high residual compressive stress and thermal stress induced by thermal expansion coefficient mismatch. However, the film deposited using powder containing 2% of excess PbO showed no cracking or detachment from the substrate after the postannealing process. The PbO evaporation at elevated temperature during the postannealing process seemed to have reduced the residual compressive stress. The remanent polarization and relative dielectric constant of the 50 ,m thick films annealed at 900°C were 43.1 ,C/cm2 and 1400, respectively, which were comparable with the values of a bulk specimen prepared by a powder sintering process. [source] Ion-Exchanged Glass Laminates that Exhibit a Threshold StrengthJOURNAL OF THE AMERICAN CERAMIC SOCIETY, Issue 8 2007Scott P. Fillery Glass laminates, fabricated to include periodic thin layers containing biaxial compressive stresses, exhibit a threshold strength, i.e., a stress below which failure will not occur. Ion-exchange treatments in KNO3 at 350°,450°C for periods of 3,72 h were used to create residual compressive stresses at the surface of soda lime silicate glass sheets. Wafer direct bonding of the ion-exchanged glass sheets resulted in glass laminates with thin layers of compressive stress adjacent to the glass interface and perpendicular to the laminate top surface. Critical strain energy release measurements of the bonded interface were used to optimize the bonding temperature/time to avoid significant relaxation of the stress produced by ion exchange. Stress profiles, determined via the wafer curvature measurement method, showed a residual compressive stress maximum of 328 MPa for an ion exchange temperature of 450°C. The threshold flexural strength of the ion exchanged glass laminates was determined to be 112 MPa after the introduction of indentation cracks with indent loads ranging from 1 to 5 kg. In contrast to similar ceramic laminates, where cracks either propagate across the compressive layer or bifurcate within the compressive layer, the cracks in the glass laminates were deflected along the interface between the bonded sheets. [source] | ||||||||||