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Polyimide Precursor (polyimide + precursor)

Distribution by Scientific Domains
Polymers and Materials Science100%

Selected Abstracts

Preparation and characterization of a polyimide nanofoam through grafting of labile poly(propylene glycol) oligomer

POLYMERS FOR ADVANCED TECHNOLOGIES, Issue 7 2004
Sang Hyub Han
Abstract Preparation of a polyimide nanofoam (PI-F) for microelectronic applications was carried out using a polyimide precursor synthesized from poly[(amic acid)-co-(amic ester)] and grafted with a labile poly(propylene glycol) (PPG) oligomer. Polyimide precursor was synthesized by partial esterification of poly(amic acid) (PAA) derived from pyromellitic dianhydride (PMDA) and 4,4,-oxydianiline (ODA). The precursor was then grafted with bromide-terminated poly(propylene glycol) in the presence of K2CO3 in hexamethylphosphoramide and N -methylpyrrolidone, imidized at 200°C in nitrogen and the product was subsequently decomposed in air at 300°C to eliminate the labile PPG oligomer to produce PMDA/ODA polyimide nanofoam. Nuclear magnetic resonance spectroscopy (1H-NMR) and Fourier transform infrared spectroscopy (FT-IR) techniques were used to characterize the formation of polyimide precursor and extent of grafting of PPG with polyimide. The results of thermogravimetric analysis (TGA) showed three step decomposition of nanofoam with the removal of PPG at 350°C and decomposition of polyimide at around 600°C. The polyimide nanofoams were also characterized by small angle X-ray scattering (SAXS), field-emission scanning electron microscopy (FE-SEM) and transmission electron microscopy (TEM). The morphology showed nanophase-separated structures with uniformly distributed and non-interconnected pores of 20,40,nm in size. Dynamic mechanical analysis (DMA) indicated higher storage modulus for the foamed structure compared to the pure PI with reduction in loss tangent for the former system. Copyright © 2004 John Wiley & Sons, Ltd. [source]

A simple approach toward low-dielectric polyimide nanocomposites: Blending the polyimide precursor with a fluorinated polyhedral oligomeric silsesquioxane

JOURNAL OF POLYMER SCIENCE (IN TWO SECTIONS), Issue 18 2008
Yun-Sheng Ye
Abstract This article describes a new and simple method for preparing polyimide nanocomposites that have very low dielectric constants and good thermal properties: simply through blending the polyimide precursor with a fluorinated polyhedral oligomeric silsesquioxane derivative, octakis(dimethylsiloxyhexafluoropropyl) silsesquioxane (OF). The low polarizability of OF is compatible with polyimide matrices, such that it can improve the dispersion and free volume of the resulting composites. Together, the higher free volume and lower polarizability of OF are responsible for the lower dielectric constants of the PI-OF nanocomposites. This simple method for enhancing the properties of polyimides might have potential applicability in the electronics industry. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 6296,6304, 2008 [source]

Preparation and characterization of a polyimide nanofoam through grafting of labile poly(propylene glycol) oligomer

POLYMERS FOR ADVANCED TECHNOLOGIES, Issue 7 2004
Sang Hyub Han
Abstract Preparation of a polyimide nanofoam (PI-F) for microelectronic applications was carried out using a polyimide precursor synthesized from poly[(amic acid)-co-(amic ester)] and grafted with a labile poly(propylene glycol) (PPG) oligomer. Polyimide precursor was synthesized by partial esterification of poly(amic acid) (PAA) derived from pyromellitic dianhydride (PMDA) and 4,4,-oxydianiline (ODA). The precursor was then grafted with bromide-terminated poly(propylene glycol) in the presence of K2CO3 in hexamethylphosphoramide and N -methylpyrrolidone, imidized at 200°C in nitrogen and the product was subsequently decomposed in air at 300°C to eliminate the labile PPG oligomer to produce PMDA/ODA polyimide nanofoam. Nuclear magnetic resonance spectroscopy (1H-NMR) and Fourier transform infrared spectroscopy (FT-IR) techniques were used to characterize the formation of polyimide precursor and extent of grafting of PPG with polyimide. The results of thermogravimetric analysis (TGA) showed three step decomposition of nanofoam with the removal of PPG at 350°C and decomposition of polyimide at around 600°C. The polyimide nanofoams were also characterized by small angle X-ray scattering (SAXS), field-emission scanning electron microscopy (FE-SEM) and transmission electron microscopy (TEM). The morphology showed nanophase-separated structures with uniformly distributed and non-interconnected pores of 20,40,nm in size. Dynamic mechanical analysis (DMA) indicated higher storage modulus for the foamed structure compared to the pure PI with reduction in loss tangent for the former system. Copyright © 2004 John Wiley & Sons, Ltd. [source]