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Photosensitive Polyimide (photosensitive + polyimide)
Selected AbstractsA positive-working photosensitive polyimide based on thermal cross-linking and acidolytic cleavageJOURNAL OF APPLIED POLYMER SCIENCE, Issue 4 2008Myung-Sup Jung Abstract A novel positive-working photosensitive polyimide (PSPI) based on a poly(hydroxyimide) (PHI), a crosslinking agent having vinyl ether groups, and a photoacid generator (PAG) was prepared. The PHI as a base resin of the three-component PSPI was synthesized from 4,4,-oxydiphthalic anhydride and 2,2,-bis(3-amino-4-hydroxyphenyl)hexafluoropropane through ring-opening polymerization and subsequent thermal cyclization. 2,2,-bis(4-(2-(vinyloxy)ethoxy)phenyl)propane (BPA-DEVE) was used as a vinylether compound and diphenyliodonium 5-hydroxynaphthalene-1-sulfonate was used as a PAG. The phenolic hydroxyl groups of the PHI and the vinyl ether groups of BPA-DEVE are thermally crosslinked with acetal structures during prebake step, and the crosslinked PHI becomes completely insoluble in an aqueous basic solution. Upon exposure to UV light (365 nm) and subsequent postexposure bake (PEB), a strong acid generated from the PAG cleaves the crosslinked structures, and the exposed area is effectively solubilized in the alkaline developer. The dissolution behavior of the PSPI containing each 11.5 wt % of BPA-DEVE and of the PAG was studied after UV exposure (365 nm) and PEB. It was found that the difference in dissolution rates between exposed and unexposed areas was enough to get high resolution. A fine positive pattern with a resolution of 5 ,m in a 3.7-,m-thick film was obtained from the three-component PSPI. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008 [source] Synthesis and characterization of novel photosensitive polyimide based on 5-(2,5-dioxotetrahydrofuryl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydridePOLYMERS FOR ADVANCED TECHNOLOGIES, Issue 1 2005Eun Young Chung Abstract A negative type photosensitive polyimide with alicyclic moiety (NPI) was synthesized from 5-(2,5-dioxotetrahydrofuryl)-3-methyl-3-cyclohexene-1,2-dicarboxylic anhydride and 4,4-diaminobenzophenone by one-step polymerization in m -cresol. Properties of the polyimides were characterized and a photo-crosslinking mechanism was investigated using DEPT 13C-NMR and FT-IR spectroscopy. The negative polyimide showed good photosensitivity on exposure to UV light from a mercury xenon lamp. The polyimide showed remarkable solubility difference after photo- irradiation with an exposure dose of 500,mJ/cm2. The resulting negative pattern of the photo-cured NPI exhibited 10,,m resolution. Glass transition temperature of the photo-crosslinked polyimide was about 307°C, which increased by 10°C compared to that of the polyimide before UV exposure. Transmittance of NPI after photo-irradiation was about 87% at 500,nm. Copyright © 2004 John Wiley & Sons, Ltd. [source] Synthesis and properties of poly(amic acid)s and polyimides based on 2,2,,6,6,-biphenyltetracarboxylic dianhydrideJOURNAL OF POLYMER SCIENCE (IN TWO SECTIONS), Issue 21 2006Katsuya Sakayori Abstract Poly(amic acid)s (PAAs) having the high solution stability and transmittance at 365 nm for photosensitive polyimides have been developed. PAAs with a twisted conformation in the main chains were prepared from 2,2,,6,6,-biphenyltetracarboxylic dianhydride (2,2,,6,6,-BPDA) and aromatic diamines. Imidization of PAAs was achieved by chemical treatment using trifluoroacetic anhydride. Among them, the PAA derived from 2,2,,6,6,-BPDA and 4,4,-(1,3-phenylenedioxy)dianiline was converted to the polyimide by thermal treatment. The heating at 300 °C under nitrogen did not complete thermal imidization of PAAs having glass-transition temperatures (Tg)s higher than 300 °C to the corresponding PIs. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 6385,6393, 2006 [source] | ||||||||||