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Amic Acid (amic + acid)
Selected AbstractsInfluence of azobenzene units on imidization kinetic of novel poly(ester amic acid)s and polymers properties before and after cyclodehydrationJOURNAL OF APPLIED POLYMER SCIENCE, Issue 5 2010Ewa Schab-Balcerzak Abstract In this article, the imidization reaction kinetic of novel poly(ester amic acid)s with azobenzene units as side groups was studied by dynamic experiments by means of differential scanning calorimetry. Polymers differ in the number of chromophore moieties in their repeating unit and position in which azobenzene group is attached to the polymer chain. The kinetic parameters of poly(ester amic acid)s conversion to poly(ester imide)s was compared with data calculated for parent polymer, that is, without azobenzene groups. For the first time to our knowledge, the imidization kinetic of polymers with side azobenzene groups was studied. Kinetic parameters, such as the activation energy and frequency factor were estimated with the by Ozawa model [(E(O) and A(O)), respectively] and Kissinger model [(E(K) and A(K), respectively]. The values of activation energy determined with both models were in the range 167.1,198.3 kJ/mol. The lowest activation energy of imidization reaction exhibited polymer in which azobenzene units were placed between amide linkages. Polymers were characterized by FTIR, 1H-NMR, X-ray, and UV,vis methods. The glass transition temperature of resultant poly(ester imide)s was in the range of 217,237°C. The presence of chromophore units slightly decreased Tg and significantly improved their solubility and optical properties. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010 [source] Preparation of poly(amic acid) and polyimide derived from 3,3,,4,4,-benzophenonetetracarboxylic dianhydride with different diamines by microwave irradiationJOURNAL OF APPLIED POLYMER SCIENCE, Issue 2 2008Quantao Li Abstract Polycondensation-type poly(amic acid) (PAA) was synthesized with 3,3,,4,4,-benzophenonetetracarboxylic dianhydride as a dianhydride monomer and 4,4,-diaminodiphenylmethane and 4,4,-oxydianiline as diamine monomers under microwave irradiation in dimethylformamide. Then, PAA was used to make polyimide (PI) by imidization at a low temperature. The structure and performance of the polymers were characterized with Fourier transform infrared (FTIR), proton nuclear magnetic resonance (1H-NMR), viscosity, X-ray diffraction (XRD), and thermogravimetry (TG) curve analyses. The FTIR spectra of the polymers showed characteristic peaks of PI around 1779 and 1717 cm,1. The 1H-NMR spectrum of PAA indicated a singlet at 6.55 ppm assigned to NHCO and a singlet at 10.27 ppm assigned to carboxylic acid protons. The XRD spectrum demonstrated that the obtained PI had a low-order aggregation structure with a d -spacing of 0.5453 nm. The TG results revealed that the PI was thermally stable with 10% weight loss at 565°C in an N2 atmosphere. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2008 [source] Use of fluorinated maleimide and telechelic bismaleimide for original hydrophobic and oleophobic polymerized networksJOURNAL OF POLYMER SCIENCE (IN TWO SECTIONS), Issue 10 2008Aurélien Soules Abstract The syntheses of original fluorinated maleimide and telechelic bismaleimide bearing C6F13 and C6F12 groups, respectively, and their use as reactive additives in photopolymerizable formulations of telechelic poly(propylene glycol) bismaleimide (PPGBMI) are presented. Fluorinated maleimide was synthetized in five steps in 63% overall yield from C6F13C2H4I precursor, whereas the fluorinated bismaleimide was prepared in six steps in 14% overall yield from IC6F12I. These latter led to fluorinated azido and diazido intermediates that were reduced into the fluorinated amine and diamines in two steps. The condensation of amine and diamine onto maleic anhydride offered an amic acid and a diamic acid, which were subsequently cyclized into fluorinated maleimide and bismaleimide. Formulations of telechelic PPGBMI containing a low concentration of these fluorinated maleimide and bismaleimide were UV cured and the surface properties of the resulting films were investigated. A deep modification of the surface properties was noted when the monomaleimide was used. In all the cases, a selective enrichment of the fluorinated monomer at the film surface was observed. The dependence of the surface properties on the fluorinated maleimide and bismaleimide concentrations were also studied, and showed an asymptotic behavior of the contact angle with only 1.5 wt % of fluorinated maleimide additive, whatever the conditions. This monomaleimide led to better hydrophobic and oleophobic properties of the resulting material than that containing the telechelic one. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 3214,3228, 2008 [source] Synthesis and properties of poly(amic acid)s and polyimides based on 2,2,,6,6,-biphenyltetracarboxylic dianhydrideJOURNAL OF POLYMER SCIENCE (IN TWO SECTIONS), Issue 21 2006Katsuya Sakayori Abstract Poly(amic acid)s (PAAs) having the high solution stability and transmittance at 365 nm for photosensitive polyimides have been developed. PAAs with a twisted conformation in the main chains were prepared from 2,2,,6,6,-biphenyltetracarboxylic dianhydride (2,2,,6,6,-BPDA) and aromatic diamines. Imidization of PAAs was achieved by chemical treatment using trifluoroacetic anhydride. Among them, the PAA derived from 2,2,,6,6,-BPDA and 4,4,-(1,3-phenylenedioxy)dianiline was converted to the polyimide by thermal treatment. The heating at 300 °C under nitrogen did not complete thermal imidization of PAAs having glass-transition temperatures (Tg)s higher than 300 °C to the corresponding PIs. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 6385,6393, 2006 [source] Novel organosoluble and colorless poly(ether imide)s based on 3,3-bis[4-(3,4-dicarboxyphenoxy)phenyl]phthalide dianhydride and aromatic bis(ether amine)s bearing pendent trifluoromethyl groupsJOURNAL OF POLYMER SCIENCE (IN TWO SECTIONS), Issue 9 2006Chin-Ping Yang Abstract A novel series of colorless and highly organosoluble poly(ether imide)s were prepared from 3,3-bis[4-(3,4-dicarboxyphenoxy)phenyl]phthalide dianhydride with various fluorinated aromatic bis(ether amine)s via a conventional two-stage process that included ring-opening polyaddition to form the poly(amic acid)s followed by cyclodehydration to produce the polymer films. The poly(ether imide)s showed excellent solubility, with most of them dissoluble at a concentration of 10 wt % in amide polar solvents, in ether-type solvents, and even in chlorinated solvents. Their films had a cutoff wavelength between 358 and 373 nm, and the yellowness index ranged from 3.1 to 9.5. The glass-transition temperatures of the poly(ether imide) series were recorded between 237 and 297 °C, the decomposition temperatures at 10% weight loss were all above 494 °C, and the residue was more than 54% at 800 °C in nitrogen. These films showed high tensile strength and also were characterized by higher solubility, lighter color, and lower dielectric constants and moisture absorption than an analogous nonfluorinated polyimide series. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 3140,3152, 2006 [source] Synthesis of autophotosensitive hyperbranched polyimides based on 3,3,,4,4,-benzophenonetetracarboxylic dianhydride and 1,3,5-tris(4-aminophenoxy)benzene via end capping of the terminal anhydride groups by ortho -alkyl anilineJOURNAL OF POLYMER SCIENCE (IN TWO SECTIONS), Issue 13 2003Huan Chen Abstract Benzophenone-containing, anhydride-terminated hyperbranched poly(amic acid)s were end-capped by ortho -alkyl aniline in situ and then chemically imidized, yielding autophotosensitive hyperbranched polyimides. The polyimides were soluble in strong polar solvents, such as N -methyl-2-pyrrolidone, N -dimethylformamide, dimethylacetamide, and dimethyl sulfoxide. Thermogravimetric analysis revealed their excellent thermal stability, with a 5 wt % thermal loss temperature in the range of 527,548 °C and a10 wt % thermal loss temperature in the range of 562,583 °C. The strong absorption of the polyimide films in ultraviolet,visible spectra at 365 nm indicated that the hyperbranched polyimides were patternable. Highly resolved images with a line width of 6 ,m were developed by ultraviolet exposure of the polymer films. A well-defined image with lines as thin as 3 ,m was also patterned, but the lines were rounded at the edges. © 2003 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 41: 2026,2035, 2003 [source] New organosoluble polyimides with low dielectric constants derived from bis[4-(2-trifluoromethyl-4-aminophenoxy)phenyl] diphenylmethyleneMACROMOLECULAR SYMPOSIA, Issue 1 2003Der-Jang Liaw Abstract A new kink diamine with trifluoromethyl group on either side, bis[4-(2-trifluoromethyl-4-aminophenoxy)phenyl]diphenylmethane(BTFAPDM), was reacted with various aromatic dianhydrides to prepare polyimides via poly (amic acid) precursors followed by thermal or chemical imidization. Polyimides were prepared using 3,3,, 4,4,-biphenyltetracarboxylic dianhydride(1), 4,4,-oxydiphthalic anhydride(2), 3,3,,4,4,-benzophenonetetracarboxylic dianhydride (3), 4,4,-sulfonyldiphthalic anhydride(4), and 4,4,-hexafluoroisopropylidene-diphathalic anhydride(5). The fluoro-polyimides exhibited low dielectric constants between 2.46 and 2.98, light color, and excellent high solubility. They exhibited glass transition temperatures between 227 and 253°C, and possessed a coefficient of thermal expansion (CTE) of 60-88 ppm/°C. Polymers PI-2, PI-3, PI-4, PI-5 showed excellent solubility in the organic solvents: N -methyl-2-pyrrolidinone (NMP), N,N -dimethylacetamide (DMAc), N,N -dimethylformamide (DMF), dimethyl sulfoxide (DMSO), pyridkie and tetrahydrofuran (THF). Inherent viscosity of the polyimides were found to range between 0.58 and 0.72 dLg-1. Thermogravimetric analysis of the polyimides revealed a high thermal stability decomposition temperature in excess of 500°C in nitrogen. Temperature at 10 % weight loss was found to be in the range 506-563°C and 498-557°C in nitrogen and air, respectively. The polyimide films had a tensile strength in the range 75-87 MPa; tensile modulus, 1.5-2.2 GPa; and elongation at break, 6-7%. [source] Modeling particle inflation from poly(amic acid) powdered precursors.POLYMER ENGINEERING & SCIENCE, Issue 5 2007Morphological characteristics of polyimide microstructures obtained by solid-state powder foaming determine the geometric properties of the unit cell, in polyimide foams prepared by this process. Morphological analysis of precursor particles has shown that particle size and shape, as well as the presence of embedded microvoids, exert a strong influence on the final microstructure morphology. Of equal importance in the morphological development are processing conditions such as heating rate and primary blowing agent content in the particles, prior to thermal treatment. In the present paper, the first of two numerical schemes is presented. A numerical model has been developed to study the preliminary stages that lead to particle inflation. Based on this model, a parametric analysis is performed for pertinent governing parameters, with the purpose of determining their effect on the onset of particle inflation and the potential morphological characteristics of polyimide microstructures. It has been found that precursor particle morphology and nuclei density are the key parameters in determining the potential morphology of the microstructures, by limiting the number of bubbles that grow within each particle. POLYM. ENG. SCI., 47:560,571, 2007. © 2007 Society of Plastics Engineers. [source] Polyimide nanocomposites: Comparison of their properties with precursor polymer nanocompositesPOLYMER ENGINEERING & SCIENCE, Issue 12 2001Jin-Hae Chang A precursor poly(amic acid) was obtained by solution polymerization of pyromellitic dianhydride and benzidine in N, N-dimethylacetamide. Poly(amic acid)/Organoclay hybrids were prepared by the solution intercalation method with dodecylamine-montmorillonite. A polyimide hybrid was obtained from poly(amic acid) hybrid by heat treatment at various temperatures. The film type polyimide hybrids showed better thermal properties than poly(amic acid) hybrids. Also, the thermal stability of the two polymer hybrids were enhanced linearly with increasing clay content from 0 to 8 wt%. Tensile properties and gas barriers of the hybrids, however, were enhanced remarkably compared to pristine polymers. Intercalations of the polymer chains in clar were examined through wide angle X-ray diffraction (XRD) and electron microscopy (SEM and TEM). Transmission electron microscopy revealed that a partially exfoliated structure had been obtained from polyimide/organo-clay hybrids. [source] Characteristics of polyimide ultrafine fibers prepared through electrospinningPOLYMER INTERNATIONAL, Issue 3 2003Changwoon Nah Abstract A novel route for making polyimide sub-micron fibers is described. The ultrafine fibers are prepared by electrospinning a poly(amic acid) solution, a precursor of polyimide, followed by thermal imidization. The fiber diameters, which are much smaller than conventionally spun fibers, range from a few tens of nanometers to several micrometers. A rectangular cross-section is observed in the case of sub-micron fibers with a cross-sectional dimension below ,500,nm. © 2003 Society of Chemical Industry [source] Preparation and characterization of a polyimide nanofoam through grafting of labile poly(propylene glycol) oligomerPOLYMERS FOR ADVANCED TECHNOLOGIES, Issue 7 2004Sang Hyub Han Abstract Preparation of a polyimide nanofoam (PI-F) for microelectronic applications was carried out using a polyimide precursor synthesized from poly[(amic acid)-co-(amic ester)] and grafted with a labile poly(propylene glycol) (PPG) oligomer. Polyimide precursor was synthesized by partial esterification of poly(amic acid) (PAA) derived from pyromellitic dianhydride (PMDA) and 4,4,-oxydianiline (ODA). The precursor was then grafted with bromide-terminated poly(propylene glycol) in the presence of K2CO3 in hexamethylphosphoramide and N -methylpyrrolidone, imidized at 200°C in nitrogen and the product was subsequently decomposed in air at 300°C to eliminate the labile PPG oligomer to produce PMDA/ODA polyimide nanofoam. Nuclear magnetic resonance spectroscopy (1H-NMR) and Fourier transform infrared spectroscopy (FT-IR) techniques were used to characterize the formation of polyimide precursor and extent of grafting of PPG with polyimide. The results of thermogravimetric analysis (TGA) showed three step decomposition of nanofoam with the removal of PPG at 350°C and decomposition of polyimide at around 600°C. The polyimide nanofoams were also characterized by small angle X-ray scattering (SAXS), field-emission scanning electron microscopy (FE-SEM) and transmission electron microscopy (TEM). The morphology showed nanophase-separated structures with uniformly distributed and non-interconnected pores of 20,40,nm in size. Dynamic mechanical analysis (DMA) indicated higher storage modulus for the foamed structure compared to the pure PI with reduction in loss tangent for the former system. Copyright © 2004 John Wiley & Sons, Ltd. [source] Anisotropy in optical transmittance and molecular chain orientation of silver- dispersed uniaxially drawn polyimide filmsPOLYMERS FOR ADVANCED TECHNOLOGIES, Issue 7 2003Sho-ichi Matsuda Abstract The anisotropy in optical transmittance in the visible and near-infrared region observed for uniaxially drawn and silver-dispersed polyimide (PI) films was investigated. The films were prepared in a one-step operation that consists of thermal curing and simultaneous uniaxial drawing of poly(amic acid) (PAA) films dissolving 5.7,,,20 mol% of silver nitrate. The PAA was converted to PI by heating, and the PI chains were orientated along the drawing direction during curing. Silver nanoparticles were precipitated in the films when they were cured in air and under nitrogen. In particular, silver nanoparticles aggregated along drawing direction and spheroidal nanoparticles (size of longer axis: 10,25,nm, aspect ratio: ca. 1.5) were observed in the films cured in air, and distinct anisotropy in optical transmittance was observed. The maximum optical anisotropy was obtained with a specific holding time at the final curing temperature (320,°C). In addition, the anisotropy can be controlled by polymer chain orientation when films are cured with the optimal holding time. In optimized preparing conditions, anisotropies in transmittance larger than 500,:,1 were obtained at the wavelengths between 700 and 900,nm, and its optical properties were retained after annealing at 150,°C for 1,hr. The PI films thus obtained can be used as thermally stable thin-film polarizers. Copyright © 2003 John Wiley & Sons, Ltd. [source] Plasma polymerization and deposition of glycidyl methacrylate on Si(100) surface for adhesion improvement with polyimidePOLYMERS FOR ADVANCED TECHNOLOGIES, Issue 10 2001X. P. Zou Abstract Thin polymer films were deposited on Si(100) surfaces by plasma polymerization of glycidyl methacrylate (GMA) under different glow discharge conditions. The FT-IR, X-ray photoelectron spectroscopy (XPS), and amine treatment results suggested that the epoxide functional groups of the deposited films had been preserved to various extents, depending on the plasma deposition conditions. The use of a low radio frequency power (, 5 W) and a relatively high system pressure (100,400 Pa) readily resulted in the deposition of thin films having nearly the same composition of the epoxide functional groups as that of the GMA homopolymer. The plasma-polymerized GMA (PP-GMA) thin films deposited on the Ar plasma-pretreated Si(100) surfaces were retained to a large extent after acetone extraction, suggesting the presence of covalent bonding between the PP-GMA layer and the Si surface. Thermal imidization of the poly(amic acid) precursor of polyimide on the GMA plasma-polymerized Si(100) surface resulted in a strongly adhered polyimide film. The adhesion results further suggested that the GMA polymer had been grafted on the Si(100) surface and the epoxide functional groups had undergone reactive interaction (curing) with the carboxylic and amine groups of the poly(amic acid) during thermal imidization. Copyright © 2001 John Wiley & Sons, Ltd. [source] | ||||||||||