Home About us Contact
|
Home About us Contact | ||
|
|
||
Epoxy Resin (epoxy + resin)
Kinds of Epoxy Resin Terms modified by Epoxy Resin Selected AbstractsNovel Phosphorus-Containing Poly(ether sulfone)s and Their Blends with an Epoxy Resin: Thermal Decomposition and Fire RetardancyMACROMOLECULAR CHEMISTRY AND PHYSICS, Issue 16 2006Ulrike Braun Abstract Summary: The decomposition of novel phosphorus-containing poly(oxyphenylene-sulfonyl-phenylene-oxy-diphenyl phenylene phosphine oxide) (PSU_I), 2,5-dihydroxy-1-biphenylene-phosphine oxide based polysulfone (PSU_II), poly(sulfonyl-diphenylphenylene phosphonate) (PSU_P) and bisphenol A-based polysulfone (PSU) is studied. The influence of the chemical structure, charring and phosphorus release is discussed based on the mass loss, kinetics and products. The pyrolysis and fire behaviour of blends with epoxy resin (EP) are studied. For EP-PSU_II, phosphorus initiates water elimination and changes the decomposition pathway of EP. The fire behaviour of EP-PSU shows some improvements, whereas the heat release rate is crucially reduced for EP-PSU_II due to simultaneous char formation and flame inhibition. Decomposition model of PSU_II. [source] Toughening of Epoxy Resin by Methyl Methacrylate/2-Ethylhexyl Acrylate Copolymers: The Effect of Copolymer CompositionMACROMOLECULAR MATERIALS & ENGINEERING, Issue 12 2007Soraia Zaioncz Abstract MMA-EHA copolymers with different compositions and with a low amount of AA were synthesized and used as impact modifier for epoxy networks. The effect of the copolymers on the tensile and dynamic mechanical properties as well as impact resistance of the epoxy network was evaluated. The addition of 10 phr of low-molar-mass MMA-EHA copolymer with defined composition resulted in a significant increase in impact resistance without any significant changes in the tensile strength, modulus, and glass transition temperature. The morphology of the modified epoxy network depends upon the copolymer composition. [source] Curing Behavior of Epoxy Resin Using Controllable Curing Agents Based on Nickel ComplexesMACROMOLECULAR MATERIALS & ENGINEERING, Issue 2 2006Abdollah Omrani Abstract Summary: The curing reaction kinetics and mechanism of the diglycidyl ether of bisphenol A (DGEBA) with three complexes of Ni(II) with diethylentriamine (Dien), Pyrazole (Pz) and Pyridine (Py) as ligands have been studied using differential scanning calorimetry (DSC). The curing reaction was characterized by high cure onset and peak maximum temperatures. The kinetics of the curing reaction were evaluated using the Ozawa method. The average values of activation energy for the three nickel complexes increased in the order: Dien-based curing agent,>,Pz-based curing agent,>,Py-based curing agent. Three main curing mechanisms (catalytic, complex cation and free ligand polymerization path) have been proposed depending on the cure temperature. It was also shown that the cure kinetics of DGEBA with Dien- and Py-based complexes could be described by the Sestak-Berggren equation. The water absorption, chemical resistance and thermal stability of the thermosets were also studied. The results showed that the thermoset obtained with the Py-based complex was more thermally stable than those obtained with the other two curing agents. Activation energy versus conversion plots for the epoxy systems studied. [source] Glass Transition Temperature Depression at the Percolation Threshold in Carbon Nanotube,Epoxy Resin and Polypyrrole,Epoxy Resin CompositesMACROMOLECULAR RAPID COMMUNICATIONS, Issue 5 2005Sophie Barrau Abstract Summary: The glass transition temperatures of conducting composites, obtained by blending carbon nanotubes (CNTs) or polypyrrole (PPy) particles with epoxy resin, were investigated by using both differential scanning calorimetry (DSC) and dynamical mechanical thermal analysis (DMTA). For both composites, dc and ac conductivity measurements revealed an electrical percolation threshold at which the glass transition temperature and mechanical modulus of the composites pass through a minimum. DC conductivity, ,dc, as a function of the conducting filler concentration of the CNT, (,) and PPy, (,) epoxy resin composites. [source] Modelling and Simulation of Curing Processes of Epoxy ResinPROCEEDINGS IN APPLIED MATHEMATICS & MECHANICS, Issue 1 2009Bülent Yagimli During the curing reaction, the adhesive changes its thermomechanical material behaviour from a viscous fluid to a viscoelastic solid. This phase transition is an exothermal chemical reaction which is accompanied by thermal expansion, chemical shrinkage and changes in temperature. In this work the numerical simulation of the curing process will be presented. The material model for the implementation is presented in [1]. For the implementation of the material model the consistent tangent operator has been derived. In the presentation, experimental data and simulation are shown. (© 2009 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim) [source] Production of Highly Loaded Nanocomposites by Dispersing Nanoparticles in Epoxy ResinCHEMICAL ENGINEERING & TECHNOLOGY (CET), Issue 9 2010H. Nolte Abstract The objective of this study was the investigation of techniques for dispersing alumina nanoparticles with different surface modifications in epoxy resin. In order to prepare the matrix suspension, high contents of fillers (up to 50,wt,%) were dispersed by conducting shear mixing techniques in a high performance laboratory kneader. The intention was to attain solutions that were stable against re-agglomeration, while the mass fraction and the product fineness were maintained as high as possible. Therefore, both the formulations and the dispersion parameters were varied systematically. An epoxy resin was used as a carrier fluid and a corresponding amine hardener system was chosen. Tests were performed using alumina particles and surface modified alumina particles at different particle concentrations. Furthermore, the effect of diluting the colloidal suspensions and the resulting long term stability were also examined. The matrix suspension was examined with respect to viscosity, stability and particle size distribution. [source] Vitrified Silica-Nanofiber Mats as Reinforcements for Epoxy ResinsADVANCED ENGINEERING MATERIALS, Issue 5 2009Oliver Weichold The effects of vitrified, electrospun silica nanofiber mats on the tensile and bending strength (see Figure) of epoxy resins are presented. The mats consist of randomly oriented, amorphous filaments of 600,800,nm diameter. The effects of annealing conditions and surface functionalization on the fiber/matrix adhesion is discussed. The results are compared to those of reference materials. [source] Effect of Biodegradable Epoxidized Castor Oil on Physicochemical and Mechanical Properties of Epoxy ResinsMACROMOLECULAR CHEMISTRY AND PHYSICS, Issue 15 2004Soo-Jin Park Abstract Summary: Biobased epoxy materials were prepared from diglycidyl ether of bisphenol A (DGEBA) and epoxidized castor oil (ECO) initiated by a latent thermal catalyst. The physicochemical and mechanical interfacial properties of the DGEBA/ECO blends were investigated. As a result, the thermal stability of the cured epoxy blends showed a maximum value in the presence of 10 wt.-% ECO content, which was attributed to the excellent network structure in the DGEBA/ECO blends. The storage modulus and glass transition temperature of the blends were lower than those of neat epoxy resins. The mechanical interfacial properties of the cured specimens were significantly increased with increasing the ECO content. This could be interpreted in terms of the addition of larger soft segments of ECO into the epoxy resins and thus reducing the crosslinking density of the epoxy network, which results in increasing toughness in the blends. KIC values of the DGEBA/ECO blends as a function of ECO content. [source] Application of Modified Natural Oils as Reactive Diluents for Epoxy ResinsMACROMOLECULAR SYMPOSIA, Issue 1 2006Piotr Czub Abstract Bisphenol A based low-molecular-weight epoxy resin was modified with epoxidized soybean oil, which exhibit viscosity reducing ability comparable to commercial grade active diluents. The studied compositions showed a non-Newtonian rheological behavior, typical for Bingham liquids. The values of the flow index (n) and the consistency index (k) for the compositions tested in the temperature range 25,65,°C were calculated from the Ostwald-de Waele rheological model and were used to calculate the flow-activation energy (Ea) using the Arhenius equation. Studies of co-crosslinking of mixed oil-resin compositions using isophorone diamine showed essential decrease of the reaction heat and peak maximum temperature. Mechanical properties, thermal stability, water absorption and chemical resistance of the epoxy resin modified with natural oil, were also investigated. Compositions of epoxy resin Ruetapox 0162, modified with the oil diluent, preserved very good mechanical properties of the epoxy resins and demonstrated relatively low water absorption as well as high chemical resistance. The compositions displayed even higher impact strength than pure epoxy resin due to plasticizing effect of the built-in oil. Compositions with the high contents (up to 60 weight %) of the oil were flexible materials with fast elastic recovery. [source] Functionalization of Copper Surfaces by Plasma Treatments to Improve Adhesion of Epoxy ResinsPLASMA PROCESSES AND POLYMERS, Issue S1 2009Juliano Nestor Borges Abstract Adhesion of epoxy resins on copper foils for printed circuit board (PCB) applications is improved by nearly a factor of 5, using surface cleaning and deposition of a 15-nm-thick film in a low-pressure remote plasma-enhanced chemical vapor deposition process. The cleaning pretreatment, using an N2,O2 oxidizing gas mixture with moderate heating (343 K), gives the best results. This pretreatment removes the carbonaceous contaminants present on the topmost surface of the sample and slightly oxidizes the copper into CuO. This oxide is then reduced during the deposition treatment, presumably by reaction with the aminopropyltrimethoxysilane (APTMS) precursor. The surface roughness is unchanged after treatment, thereby showing that the improvement of the copper/epoxy adhesion is only due to the chemistry of the plasma coating. Applying these results to dielectric barrier discharges allows us to achieve the same level of adhesion, which, therefore, does not depend on the process. [source] Delivery of Two-Part Self-Healing Chemistry via Microvascular NetworksADVANCED FUNCTIONAL MATERIALS, Issue 9 2009Kathleen S. Toohey Abstract Multiple healing cycles of a single crack in a brittle polymer coating are achieved by microvascular delivery of a two-part, epoxy-based self-healing chemistry. Epoxy resin and amine-based curing agents are transported to the crack plane through two sets of independent vascular networks embedded within a ductile polymer substrate beneath the coating. The two reactive components remain isolated and stable in the vascular networks until crack formation occurs in the coating under a mechanical load. Both healing components are wicked by capillary forces into the crack plane, where they react and effectively bond the crack faces closed. Healing efficiencies of over 60% are achieved for up to 16 intermittent healing cycles of a single crack, which represents a significant improvement over systems in which a single monomeric healing agent is delivered. [source] Analysis of stress due to shrinkage in a hardening process of liquid epoxy resinHEAT TRANSFER - ASIAN RESEARCH (FORMERLY HEAT TRANSFER-JAPANESE RESEARCH), Issue 3 2002Tetsuro Nishimura Abstract At present, epoxy resin is applied during the manufacturing of more compact and thinner components for the packaging of electronic and other devices. Epoxy resin has superior properties in terms of heat resistance, insulation, and strength; however, defects such as deformations and cracks often occur because of stress concentration. It is important to determine the inner stress of resin solidification for molding processes. Through a combination of numerical analyses of heat generated due to chemical reactions and experiments on shrinkage and strain that occur during hardening of epoxy resin, it becomes possible to analyze the stress generated due to hardening shrinkage. The developed analytical method can contribute to the realization of highly reliable components made of epoxy resin. © 2002 Wiley Periodicals, Inc. Heat Trans Asian Res, 31(3): 194,211, 2002; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/htj.10028 [source] Mechanical behavior of carbon nanofibre-reinforced epoxy compositesJOURNAL OF APPLIED POLYMER SCIENCE, Issue 4 2010Sohel Rana Abstract Epoxy resins are widely used in a variety of applications because of their high chemical and corrosion resistance and good mechanical properties. But few types of epoxy resins are brittle and possess low toughness which makes them unsuitable for several structural applications. In this work, carbon nanofibres have been dispersed uniformly into the epoxy resin at a very low concentration (0.07 vol. %). Improvement of 98% in Young modulus, 24% in breaking stress and 144% in work of rupture was achieved in the best sample. The emphasis is on achieving uniform dispersion of carbon nanofibers into epoxy resin using a combination of techniques such as ultrasonication, use of solvent and surfactants. The fracture surfaces of the specimens were studied under scanning electron microscope to see the fracture mechanism of nanocomposites under tensile load and correlate it to the enhancement in their properties. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010 [source] A reactive polymer for toughening epoxy resinJOURNAL OF APPLIED POLYMER SCIENCE, Issue 6 2010Hsu-Chiang Kuan Abstract Epoxy resins are hardly toughened by low weight content of tougheners. In this study, 5 wt % polyurea was adopted to significantly toughen piperidine-cured epoxy, as fracture toughness improved from 0.78 to 1.98 MPa m1/2. We focused on the reactions and morphology evolution of epoxy/polyurea mixture. The polyurea molecular weight was reduced by the exchange reactions of polyurea with epoxy during mixing, as evidenced by gel permeation chromatograph and Fourier transform infrared spectroscopy. As a result, epoxy molecules were chemically bonded with polyurea, improving particle content and interface thickness. Transmission electron microscope observation shows that (a) polyurea in situ formed nanoparticles in matrix which subsequently aggregate into micron-sized particles of thick interface with matrix; and (b) the particles became less stainable with increasing the mixing time, because the reactions promoted high levels of crosslink density of the particles which were thus more resistant to the diffusion of staining chemicals. Longer mixing time improved, obviously, the fracture toughness of epoxy/polyurea composite. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2010 [source] Epoxy resins from rosin acids: synthesis and characterizationPOLYMERS FOR ADVANCED TECHNOLOGIES, Issue 9 2004Ayman M. Atta Abstract A series of multifunctional cycloaliphatic glycidyl ester and ether epoxy resins were synthesized by reaction of condensed rosin acid-formaldehyde resins with epichlorohydrin. The chemical structure of the produced resins was determined by IR and 1H-NMR analysis. The molecular weight of the produced resins was determined by gel permeation chromatography (GPC). A series of poly- (amide-imide) hardeners were prepared from condensation of Diels,Alder adducts of rosin acid-maleic anhydride and acrylic acid with triethylene tetramine and pentaethylene hexamine. These amines were also condensed with Diels,Alder adducts of rosin ketones. The curing exotherms of the produced epoxy resins with poly(amide-imide) hardeners were investigated. The data of mechanical properties, solvent and chemical resistance indicate the superior adhesion of the cured epoxy resins. Copyright © 2004 John Wiley & Sons, Ltd. [source] Synthesis and physical properties of low-molecular-weight redistributed poly(2,6-dimethyl-1,4-phenylene oxide) for epoxy resinJOURNAL OF APPLIED POLYMER SCIENCE, Issue 3 2008Hann-Jang Hwang Abstract Low-molecular-weight poly(2,6-dimethyl-1,4-phenylene oxide) (PPO) was prepared by the redistribution of regular PPO with 4,4,-isopropylidenediphenol (bisphenol A) with benzoyl peroxide as an initiator in toluene. The redistributed PPO was characterized by proton nuclear magnetic resonance, mass spectra, and Fourier transform infrared spectroscopy. The redistributed PPO oligomers with terminal phenolic hydroxyl groups and low molecular weights (weight-average molecular weight = 800,4000) were used in the modification of a diglycidyl ether of bisphenol A/4,4,-diaminodiphenylmethane network system. The curing behaviors were investigated by differential scanning calorimetry and Fourier transform infrared spectroscopy. The effect of molecular weight and the amount of redistributed PPO oligomers incorporated into the network on the physical properties of the resulting systems were investigated. The thermal properties of the cured redistributed PPO/epoxy resins were studied by dynamic mechanical analysis, thermal mechanical analysis, thermogravimetric analysis, and dielectric analysis. These cured redistributed PPO/epoxy resins exhibited lower dielectric constants, dissipation factors, coefficients of thermal expansion, and moisture absorptions than those of the control diglycidyl ether of bisphenol A based epoxy. The effects of the composition on the glass-transition temperature and thermal stability are discussed. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008 [source] Contact allergy to epoxy (meth)acrylatesCONTACT DERMATITIS, Issue 1 2009Kristiina Aalto-Korte Background: Contact allergy to epoxy (meth)acrylates, 2,2-bis[4-(2-hydroxy-3-methacryloxypropoxy) phenyl]propane (bis-GMA), 2,2-bis[4-(2-hydroxy-3-acryloxypropoxy)phenyl]-propane (bis-GA), 2,2-bis[4-(methacryl-oxyethoxy)phenyl] propane (bis-EMA), 2,2-bis[4-(methacryloxy)phenyl]-propane (bis-MA), and glycidyl methacrylate (GMA) is often manifested together with contact allergy to diglycidyl ether of bisphenol A (DGEBA) epoxy resin. Objective: To analyse patterns of concomitant allergic reactions to the five epoxy (meth)acrylates in relation to exposure. Methods: We reviewed the 1994,2008 patch test files at the Finnish Institute of Occupational Health (FIOH) for reactions to the five epoxy (meth)acrylates, and examined the patients' medical records for exposure. Results: Twenty-four patients had an allergic reaction to at least one of the studied epoxy (meth)acrylates, but specific exposure was found only in five patients: two bis-GMA allergies from dental products, two bis-GA allergies from UV-curable printing inks, and one bis-GA allergy from an anaerobic glue. Only 25% of the patients were negative to DGEBA epoxy resin. Conclusions: The great majority of allergic patch test reactions to bis-GMA, bis-GA, GMA and bis-EMA were not associated with specific exposure, and cross-allergy to DGEBA epoxy resin remained a probable explanation. However, independent reactions to bis-GA indicated specific exposure. Anaerobic sealants may induce sensitization not only to aliphatic (meth)acrylates but also to aromatic bis-GA. [source] Concomitant contact allergy to the resins, reactive diluents and hardener of a bisphenol A/F-based epoxy resin in subway construction workersCONTACT DERMATITIS, Issue 3 2006Chia-Yu Chu An outbreak of suspected contact dermatitis among subway construction workers was suspected to be due to a new bisphenol A/F-based epoxy resin system (ERS). The construction workers used ERSs during the insertion of iron bars into concrete walls. The objective of the study was to determine the components (if any) of the ERS responsible for the contact allergy. Patch testing was performed on 20 of the 22 construction workers who had had contact with the ERS, and to the various subcomponents of component A on 5 of the 7 who reacted to this component. 9 patients (9/22, 40.9%) had clinical symptoms and signs of suspected contact dermatitis at presentation. 7 of these 9, but none of the 11 asymptomatic individuals, were positive to component A, while all were negative to component B. Of the 5 cases receiving further patch testing, all reacted to m -xylylene diamine, 4 to 1,6-hexanediol diglycidyl ether, 3 to epoxy resins of the bisphenol F-type and trimethylolpropane triglycidyl ether 0.25% petrolatum, and only 1 to epoxy resins of the bisphenol A-type. Contact allergy to ERSs may involve hardeners and diluents as well as resins, and patch testing for reaction to all components should be performed. [source] Epoxy-based production of wind turbine rotor blades: occupational dermatosesCONTACT DERMATITIS, Issue 6 2004A. Pontén Occupational dermatoses were investigated in a factory producing rotor blades for wind turbines by an epoxy-based process. In a blinded study design, 603 workers were first interviewed and thereafter clinically examined. Based on a history of work-related skin disease, clinical findings of dermatitis, or both, 325 (53.9%) of the workers were patch tested with a specially profiled occupational patch-test series and the European standard patch-test series. Calculated on all investigated workers, 17.1% of the workers were diagnosed with occupational dermatoses caused by work. Occupational allergic contact dermatitis was found in 10.9% of the workers. The estimated frequency of irritant contact dermatitis caused by work was 6.1%. Dermatitis on the hands was associated with contact allergy to epoxy resin (P = 0.017). The number of days on leave before the clinical examination was negatively associated with the presence of dermatitis (P = 0.001). Among workers employed 7,12 months, the frequency of occupational contact allergy was higher than that among workers employed for ,6 months (P = 0.004). Females both washed their hands more often (P < 0.001) and used more moisturizers/protection creams at work (P < 0.001) than males. No sex differences were found concerning dermatitis on the hands. [source] Differential Pulse Voltammetric Determination of Selected Nitro-Compounds on Silver, Solid Silver Composite, and Solid Graphite Composite ElectrodesELECTROANALYSIS, Issue 3-5 2009Navrátil Abstract Three different types of solid electrodes, namely silver electrode, silver composite electrode containing 20% (m/m) of silver powder, 20% (m/m) of graphite powder and 60% (m/m) of methacrylate resin and graphite composite electrode containing 30% (m/m) of graphite powder and 70% (m/m) of epoxy resin were tested for differential pulse voltammetric determination of selected genotoxic nitro-compounds using 2-nitronaphthalene, 6-nitroquinoline, and 5-nitrobenzimidazole as model compounds. It was found that all three electrodes can be used for the determination of micromolar concentrations of tested model substances, the limit of detection and other figures of merits being dependent both on the electrode used and the substance to be determined. [source] Voltammetric Determination of Phenylglyoxylic Acid in Urine Using Graphite Composite ElectrodeELECTROANALYSIS, Issue 2 2006Navrátil Abstract A composite electrode prepared from graphite powder and epoxy resin was applied as a working electrode for the determination of phenylglyoxylic acid (one of the metabolites of styrene) in human urine. Cathodic differential pulse stripping voltammetry was used and optimum conditions have been found giving the limit of determination about 5,mg L,1. All results were compared with those obtained using hanging mercury drop electrode. For the confirmation of suggested mechanism of the electrochemical reaction the elimination voltammetry with linear scan was used. [source] Asymmmetric Diamino Functionalization of Nanotubes Assisted by BOC Protection and Their Epoxy NanocompositesADVANCED FUNCTIONAL MATERIALS, Issue 18 2010Yao Zhao Abstract Homogenous dispersion and strong interfacial bonding are prerequisites for taking full advantage of the mechanical properties of nanotubes in a composite. In order to simultaneously achieve both conditions, a highly efficient and mechanically non-destructive functionalization of nanotubes is developed. With fluoronanotubes as the precursor, asymmetric diamine molecules, N -BOC-1,6-diaminohexane, are used to replace fluorines on the wall of fluoronanotubes and construct covalent bonding to the surface of the nanotubes. A BOC de-protection reaction is conducted and the resulting exposed amino groups create strong covalent bonds with the matrix in the course of epoxy ring-opening etherification and curing chemical reactions. In comparison with the conventional functionalization based on symmetric diamine molecules, the functionalized nanotubes derived from the BOC-protected diamine molecule are more dispersed within the epoxy matrix. Dynamic mechanical analysis shows that the functionalized nanotubes have better crosslinking with the matrix. The composites reinforced by the nanotubes demonstrate improvement in various mechanical properties. The Young's Modulus, ultimate tensile strength, and storage modulus of composites loaded with 0.5 wt% functionalized nanotubes are enhanced by 30%, 25%, and 10%, respectively, compared with the neat epoxy. The increase of the glass transition temperature, as much as 10 °C, makes the composites suited for engineering applications under higher temperatures. The new functionalization method allows for an competitive enhancement in the composite performance in use of relatively low cost raw nanotubes at a small loading level. The reinforcement mechanism of the functionalized nanotubes in the epoxy resin is discussed. [source] Pattern Formation of Silver Nanoparticles in 1-, 2-, and 3D Microstructures Fabricated by a Photo- and Thermal Reduction MethodADVANCED FUNCTIONAL MATERIALS, Issue 14 2010Jong-Jin Park Abstract One-, two-, and three-dimensional microstructures with dispersed silver nanoparticles are fabricated by a combination of photopatterning and thermal treatment from a silver salt containing photosensitive epoxy resin. Ultraviolet photo-irradiation and subsequent thermal treatment are combined to control the rate of silver salt reduction, the size and the arrangement of nanoparticles, as well as the reticulation of the epoxy resin. This approach allows the creation of high resolution 1-, 2-, and 3D patterns containing silver nanoparticles, with a homogeneous distribution of nanoparticles regardless of the irradiated area. [source] Self-Healing Chemistry: Delivery of Two-Part Self-Healing Chemistry via Microvascular Networks (Adv. Funct.ADVANCED FUNCTIONAL MATERIALS, Issue 9 2009Mater. Microvascular self-healing of a brittle coating is accomplished by supplying fluid healing agents from an underlying network of microchannels. Dual independent networks filled with a two-part healing chemistry (epoxy resin and curing agent) that repeatedly heal damage in the coating up to 16 consecutive times are reported by K. S. Toohey et al. on page 1399. [source] Analysis of stress due to shrinkage in a hardening process of liquid epoxy resinHEAT TRANSFER - ASIAN RESEARCH (FORMERLY HEAT TRANSFER-JAPANESE RESEARCH), Issue 3 2002Tetsuro Nishimura Abstract At present, epoxy resin is applied during the manufacturing of more compact and thinner components for the packaging of electronic and other devices. Epoxy resin has superior properties in terms of heat resistance, insulation, and strength; however, defects such as deformations and cracks often occur because of stress concentration. It is important to determine the inner stress of resin solidification for molding processes. Through a combination of numerical analyses of heat generated due to chemical reactions and experiments on shrinkage and strain that occur during hardening of epoxy resin, it becomes possible to analyze the stress generated due to hardening shrinkage. The developed analytical method can contribute to the realization of highly reliable components made of epoxy resin. © 2002 Wiley Periodicals, Inc. Heat Trans Asian Res, 31(3): 194,211, 2002; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/htj.10028 [source] Self-Healing Materials with Interpenetrating Microvascular NetworksADVANCED MATERIALS, Issue 41 2009Christopher J. Hansen Interpenetrating microvascular networks are embedded in an epoxy substrate via direct-write assembly. Each network is filled with one component of a two-part epoxy resin. This novel epoxy coating/substrate architecture enables repeated healing of at least 30 cycles of mechanical damage in the coating by independently supplying both healing agents to the damaged region(s). [source] Solubility of root-canal sealers in water and artificial salivaINTERNATIONAL ENDODONTIC JOURNAL, Issue 10 2003E. Schäfer Abstract Aim, To compare the weight loss of eight different root-canal sealers in water and in artificial saliva with different pH values. Methodology, For standardized samples (n = 12 per group), ring moulds were filled with epoxy resin (AH 26, AH Plus)-, silicone (RSA RoekoSeal)-, calcium hydroxide (Apexit, Sealapex)-, zinc oxide,eugenol (Aptal-Harz)-, glass-ionomer (Ketac Endo)- and polyketone (Diaket)-based sealers. These samples were immersed in double-distilled water or artificial saliva with different pH values (7.0, 5.7 and 4.5) for 30 s, 1 min, 2 min, 5 min, 10 min, 20 min, 1 h, 2 h, 10 h, 24 h, 48 h, 72 h, 14 days and 28 days. Mean loss of weight was determined and analysed statistically using a one-way anova and Student,Newman,Keuls test for all pairwise comparisons. Results, Most sealers were of low solubility, although Sealapex, Aptal-Harz and Ketac Endo showed a marked weight loss in all liquids. Even after 28 days of storage in water, AH 26, AH Plus, RSA RoekoSeal, and Diaket showed less than 3% weight loss. At exposure times greater than 14 days, Sealapex showed the significantly greatest weight loss of all sealers tested (P < 0.05). Aptal-Harz and Ketac Endo were significantly more soluble in saliva (pH 4.5) than in water (P < 0.05). Conclusions, Under the conditions of the present study, AH Plus showed the least weight loss of all sealers tested, independent of the solubility medium used. Sealapex, Aptal-Harz and Ketac Endo had a marked weight loss in all liquids. [source] Dissolution of root canal sealer cements in volatile solventsINTERNATIONAL ENDODONTIC JOURNAL, Issue 1 2000J. M. Whitworth Whitworth JM, Boursin EM. Dissolution of root canal sealer cements in volatile solvents. International Endodontic Journal, 33, 19,24, 2000. Aim There are few published data on the solubility profiles of endodontic sealers in solvents commonly employed in root canal retreatment. This study tested the hypothesis that root canal sealer cements are insoluble in the volatile solvents chloroform and halothane. Methodology Standardized samples (n=5) of glass ionomer (Ketac Endo), zinc oxide-eugenol (Tubli-Seal EWT), calcium hydroxide (Apexit) and epoxy resin (AH Plus) based sealers were immersed in chloroform or halothane for 30 s, 1 min, 5 min and 10 min. Mean loss of weight was plotted against time of exposure, and differences in behaviour assessed by multiple paired t-tests (P <0.01). Results Clear differences were shown in the solubility profiles of major classes of root canal sealer cements in two common volatile solvents. In comparison with other classes of material, Ketac Endo was the least soluble in chloroform and halothane (P <0.01), with less than 1% weight loss after 10 min exposure to either solvent. Apexit had low solubility with 11.6% and 14.19% weight loss after 10 min exposure to chloroform and halothane, respectively. The difference between solvents was not significant (P >0.01). Tubli-Seal EWT was significantly less soluble in halothane than chloroform (5.19% and 62.5% weight loss after 10 min exposure, respectively (P <0.01)). Its solubility in halothane was not significantly different from that of Apexit. AH Plus was significantly more soluble than all other materials in both chloroform and halothane (96% and 68% weight loss after 10 min exposure, respectively (P <0.01)). Conclusions There are significant differences in the solubility profiles of major classes of root canal sealer in common organic solvents. Efforts should continue to find a more universally effective solvent for use in root canal retreatment. [source] Kinetics and mechanism of esterification of epoxy resin in presence of triphenylphosphineINTERNATIONAL JOURNAL OF CHEMICAL KINETICS, Issue 5 2004Neelam Pal The kinetics of esterification of bisphenol-A based epoxy resin with acrylic acid in presence of triphenylphosphine has been studied. The reaction exhibits a first-order rate dependence with respect to [Epoxy] and [Catalyst]. A first-order dependence of rate with respect to [Acid] has been observed during a particular kinetic run. However, a retarding effect of [Acid] on the rate has been observed by increasing the initial concentration of acid. A suitable mechanism consistent with the kinetic data is proposed and discussed. © 2004 Wiley Periodicals, Inc. Int J Chem Kinet 36: 280,285, 2004 [source] Influence of resin viscosity and vacuum level on mechanical performance of sandwich structures manufactured by vacuum baggingADVANCES IN POLYMER TECHNOLOGY, Issue 1 2010A. Valenza Abstract The choice of process parameters is critical in optimizing the mechanical properties of sandwich structures produced using the vacuum bagging technique. The aim of this paper is to analyze how the viscosity of the resin/curing agent system and the vacuum level influence the morphology and the mechanical behavior of sandwich beams with composite faces (epoxy resin and glass fiber fabric named COMBI 900) and a PVC foam core. Four different sandwich structures were produced by varying the viscosity of the epoxy resin/curing agent at constant maximum vacuum pressure. Three further structures were manufactured by varying the strength of the vacuum with the resin viscosity maintained constant at the minimum level. Three point bending tests were carried out on all seven sandwiches. The analysis shows that although both parameters affect the mechanical characteristics of the structure, the viscosity of the resin system is clearly the more influential of the two. The morphological structure of the sandwiches was analyzed both by scanning electron microscope (SEM) and by muffle furnace ignition to calculate the percentage of fibers, matrices, and voids present in the different samples © 2010 Wiley Periodicals, Inc. Adv Polym Techn 29:20,30, 2010; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/adv.20172 [source] | |||||||||||||||||||||||||||||||||||||