Home About us Contact
|
Home About us Contact | ||
|
|
||
Embedded Sensors (embedded + sensor)
Selected AbstractsTemperature-Gradient Effects in Thermal Barrier Coatings: An Investigation Through Modeling, High Heat Flux Test, and Embedded SensorJOURNAL OF THE AMERICAN CERAMIC SOCIETY, Issue 10 2010Yang Tan The harsh thermal environment in gas turbines, including elevated temperatures and high heat fluxes, induces significant thermal gradients in ceramic thermal barrier coatings (TBCs), which are used to protect metallic components. However, the thermal conductivity of plasma-sprayed TBC increases with exposure at high temperatures mainly due to sintering phenomena and possible phase transformation, resulting in coating performance degradation and potential thermal runaway issues. An analytical thermal model and experimentally obtained coating thermal conductivity data are used to determine the coating through-thickness temperature profile and effective thermal conductivity under gradient conditions at high temperatures. High heat flux tests are then performed on TBCs to evaluate coating thermal behavior under temperature gradients close to service conditions. Coating internal temperature during the tests was also measured by thermally sprayed embedded thermocouples within the top coat. This combined approach provides a sintering map with a new model and allows for the assessment of temperature-gradient effects on the thermal performance of plasma-sprayed TBCs. [source] Children's interactions with interactive toy technologyJOURNAL OF COMPUTER ASSISTED LEARNING, Issue 2 2003R. Luckin Abstract Digital toys offer the opportunity to explore software scaffolding through tangible interfaces that are not bound to the desktop computer. This paper describes the empirical work completed by the CACHET (Computers and Children's Electronic Toys) project team investigating young children's use of interactive toy technology. The interactive toys in question are plush and cuddly cartoon characters with embedded sensors that can be squeezed to evoke spoken feedback from the toy. In addition to playing with the toy as it stands, the toy can be linked to a desktop PC with compatible software using a wireless radio connection. Once this connection is made the toy offers hints and tips to the children as they play with the accompanying software games. If the toy is absent, the same hints and tips are available through an on-screen animated icon of the toy's cartoon character. The toys as they stand are not impressive as collaborative learning partners, as their help repertoire is inadequate and even inappropriate. However, the technology has potential: children can master the multiple interfaces of toy and screen and, when the task requires it and the help provided is appropriate, they will both seek and use it. In particular, the cuddly interface experience can offer an advantage and the potential for fun interfaces that might address both the affective and the effective dimensions of learners' interactions. [source] Effects of tool-embedded dielectric sensors on heat transfer phenomena during composite curePOLYMER COMPOSITES, Issue 2 2007A.A. Skordos The present study examines the effects that placement of tool-mounted dielectric sensors in the composite cure assembly has on the local thermal and degree-of-cure fields. A nonlinear heat transfer model, incorporating appropriate thermoset cure and thermal property submodels, is used to simulate the cure of carbon and glass composites of various thicknesses. The model is validated against experimental data obtained during the cure of composite samples in a resin-transfer molding tool. The results of the simulations show that embedding a sensor can have a significant effect on the thermal field, because of the thermal conductivity mismatch between the metal tool and the sensor substrate material. In the heating-up stage of the cure profile, sensors embedded in the heated tool side intensify thermal gradients, which causes a corresponding lag in the progress of the reaction in the area adjacent to the sensor. Exothermic effects are also intensified by the sensor presence, especially in the case of thick composite curing. These results suggest that control strategies based on the utilization of embedded sensors should take these effects into account. POLYM. COMPOS., 28:139,152, 2007. © 2007 Society of Plastics Engineers. [source] Flow front measurements and model validation in the vacuum assisted resin transfer molding processPOLYMER COMPOSITES, Issue 4 2001R. Mathuw Through-thickness measurements were recorded to experimentally investigate the through thickness flow and to validate a closed form solution of the resin flow during the vacuum assisted resin transfer molding process (VARFM). During the VART'M process, a highly permeable distribution medium is incorporated into the preform as a surface layer and resin is inftised Into the mold, under vacuum. During Infusion, the resin flaws preferentially across the surface and simultaneously through the thickness of the preform, giving rise to a three dimensional-flow front. The time to fill the mold and the shape of the flow front, which plays a key role in dry spot formation, are critical for the optimal manufacture of large composite parts. An analytical model predicts the flow times and flow front shapes as a function of the properties of the preform, distribution media and resin. It was found that the flow front profile reaches a parabolic steady state shape and the length of the region saturated by resin is proportional to the square root of the time elapsed. Experimental measurements of the flow front in the process were carried out using embedded sensors to detect the flow of resin through the thickness of the preform layer and the progression of flow along the length of the part. The time to fill the part, the length of flow front and its shapes show good agreement between experiments and the analytical model. The experimental study demonstrates the need for control and optimization of resin injection during the manufacture of large parts by VARTM. [source] | ||||||||||