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Electron Mobility Transistors (electron + mobility_transistor)
Kinds of Electron Mobility Transistors Selected AbstractsA physics-based model of DC and microwave characteristics of GaN/AlGaN HEMTsINTERNATIONAL JOURNAL OF RF AND MICROWAVE COMPUTER-AIDED ENGINEERING, Issue 3 2007Jonathan C. Sippel Abstract A physics-based model of AlGaN/GaN High Electron Mobility Transistor (HEMT) is developed for the analysis of DC and microwave characteristics. Large- and small-signal parameters are calculated for a given device dimensions and operating conditions. Spontaneous and piezoelectric polarizations at the heterointerface and finite effective width of the 2DEG gas have been incorporated in the analysis. The model predicts a maximum drain current of 523 mA/mm and transconductance of 138 mS/mm for a 1 ,m × 75 ,m device, which are in agreement with the experimental data. © 2007 Wiley Periodicals, Inc. Int J RF and Microwave CAE, 2007. [source] Excitation of millimeter-wave oscillations in InAlAs/InGaAs heterostructuresPHYSICA STATUS SOLIDI (C) - CURRENT TOPICS IN SOLID STATE PHYSICS, Issue 1 2008S. Pérez Abstract We study the origin of strong Terahertz (THz) oscillations taking place in InAlAs/InGaAs slot diodes - base of High Electron Mobility Transistor (HEMT) devices - when bias surpasses 0.5 V. To this end we perform a microscopic analysis of current fluctuations, calculated by means of an ensemble Monte Carlo (MC) simulator. The millimeter and submillimeter waves are caused by the presence of Gunn-like oscillations whose dynamics is controlled by ballistic , valley electrons in the channel. These carriers are capable to reach extremely high velocities due to the influence of degeneracy effects (preventing scattering mechanisms) and the presence of a recessed geometry. The dependence of this process on the recess and recess-drain lengths is analyzed in order to improve the frequency and magnitude of the oscillations. (© 2008 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [source] AlGaN/GaN high electron mobility transistor structures for pressure and pH sensingPHYSICA STATUS SOLIDI (C) - CURRENT TOPICS IN SOLID STATE PHYSICS, Issue 7 2005B. S. Kang Abstract Nitride High Electron Mobility Transistor(HEMT) structures are excellent candidates for polar liquid detectors, pressure sensors and piezoelectric-related applications. The changes in conductance of the channel of AlGaN/GaN high electron mobility transistor structures during application of both tensile and compressive strain are reported. For fixed Al mole fraction, the changes in conductance were roughly linear over the range up to 2.7 × 108 N.cm,2 , with coefficients for planar devices of ,6.0 +/,2.5 × 10,10 S.N,1 m,2 for tensile strain and +9.5+/,3.5 × 10,10 S.N,1m,2 for compressive strain . The large changes in conductance demonstrate that simple AlGaN/GaN heterostructures are promising for pressure and strain sensor applications. A gateless HEMT structure was also used for sensing different liquids present in the gate region. The forward current showed significant decreases upon exposure of the gate area to solvents (water, acetone) or acids (HCl). Milli ampere changes in the source-drain current are observed relative to the value measured in air ambient . The pH sensitivity is due to changes in net surface charge that affects the relative depletion in the channel of the transistor. (© 2005 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [source] Advanced mHEMT MMICs for 220 GHz high-resolution imaging systemsPHYSICA STATUS SOLIDI (C) - CURRENT TOPICS IN SOLID STATE PHYSICS, Issue 6 2009Sébastien Chartier Abstract The development of advanced millimeter-wave monolithic integrated circuits for application in active and passive high-resolution imaging systems operating beyond 200 GHz is presented. A wideband 210 GHz Low Noise Amplifier has been successfully realized using one of our three metamorphic high electron mobility transistor (mHEMT) technologies in combination with grounded coplanar circuit topology (GCPW). Additionally, a 200 GHz voltage controlled oscillator (VCO) MMIC demonstrating good output power over a wide bandwidth was fabricated, using our 100 nm mHEMT technology. Finally, a high resolution 220 GHz radiometer was realized and shows very promising performance. (© 2009 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [source] Advanced buffers for AlGaN/GaN HEMT and InGaN/GaN MQW on silicon substratesPHYSICA STATUS SOLIDI (C) - CURRENT TOPICS IN SOLID STATE PHYSICS, Issue 6 2006Y. Dikme Abstract GaN growth was carried out on silicon (Si) substrates by metalorganic vapor phase epitaxy (MOVPE). A layer structure starting with HT (high-temperature) AlN and containing AlGaN and GaN as interlayers was employed for the subsequent deposition of GaN buffer layers. At first, the influence of the in-situ Al pre-deposition at the process start with different durations was investigated. Each time, the pre-deposition was followed by the same layer sequence and with thin AlGaN and GaN grown on top to form a high electron mobility transistor (HEMT). A significant enhancement could be observed in the properties of the investigated samples by reducing the pre-deposition time from 8 s to 2 s. Based on these results, multiple quantum well structures (MQW) and HEMT were grown on these buffers. For the MQW, the well thickness was increased and a shift to higher wavelengths was observed. The HEMT structures have shown enhanced properties by optimizing the growth temperatures of the top AlGaN layer. (© 2006 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [source] Hot-electron numerical modelling of short gate length pHEMTs applied to novel field plate structuresINTERNATIONAL JOURNAL OF NUMERICAL MODELLING: ELECTRONIC NETWORKS, DEVICES AND FIELDS, Issue 1 2003Shahzad Hussain Abstract Hot-electron numerical simulations were carried out in order to simulate the DC parameters of pseudomorphic high electron mobility transistors (pHEMTs). The hot-electron effects were studied by simulating several HEMT device structures. Hot-carrier injection in the substrate and the formation of the peak of electric field in the channel were studied in detail. The inclusion of a field-plate contact in a multiple recessed pHEMT structure lowered the peak value of the electric field by 24% compared with the conventional pHEMT. These devices were modelled by solving the two-dimensional Poisson, current continuity and energy transport equations consistently with the time-independent Schrödinger wave equation. Appropriate Ohmic boundaries are discussed here and implemented in the simulations of pHEMT structures. A new integral approximation is used to calculate electron densities and electron energy densities for degenerate approximations. Copyright © 2002 John Wiley & Sons, Ltd. [source] Optimization of AlGaN/GaN HEMTs for high frequency operationPHYSICA STATUS SOLIDI (A) APPLICATIONS AND MATERIALS SCIENCE, Issue 7 2006T. Palacios In the article [1] featured at Editor's Choice, the structure and processing of AlGaN/GaN high electron mobility transistors (HEMTs) have been optimized for maximum small signal gain at high frequencies. The cover picture combines the sample structure , shown schematically and in a scanning electron microscopy image , with the band diagram of the sample with an InGaN back-barrier used to increase the electron confinement in comparison to a standard HEMT. The first author, Tomás Palacios, is currently a Project Scientist at UCSB. His research interest focuses on the search of novel GaN-based transistors for mm-wave applications and biological sensors. He is one of the winners of the physica status solidi Young Researcher Awards for his outstanding presentation at the 6th International Conference on Nitride Semiconductors held in Bremen, Germany, in 2005. Further articles from ICNS-6 will also be published in phys. stat. sol. (b) 243, No. 7 (2006) and phys. stat. sol. (c) 3, No. 6 (2006). The present issue of phys. stat. sol. (a) as well as phys. stat. sol. (c) 3, No. 5 (2006) also contain papers presented at the International Conference on Nanoscale Magnetism (ICNM-2005) in Gebze, Turkey. [source] Reliability and degradation mechanism of AlGaAs/InGaAs and InAlAs/InGaAs HEMTsPHYSICA STATUS SOLIDI (A) APPLICATIONS AND MATERIALS SCIENCE, Issue 1 2003M. Dammann Abstract The long-term stability of AlGaAs/GaAs and InAlAs/InGaAs high electron mobility transistors (HEMTs), tested under high drain voltage and/or high temperature operation is reported. HEMTs with high In content in the active channel, alternatively fabricated on InP substrates and on GaAs substrates covered by a metamorphic buffer (MHEMT), are compared. Despite the high dislocation density in the buffer layer MHEMTs and InP based HEMTs exhibit comparable reliability. AlGaAs/GaAs HEMTs are more reliable than their InAlAs/InGaAs counterparts, especially when operated at high drain voltage. Failure mechanisms are thermally activated gate sinking, Ohmic contact degradation and hot electron induced degradation. [source] Normally-on/off AlN/GaN high electron mobility transistorsPHYSICA STATUS SOLIDI (C) - CURRENT TOPICS IN SOLID STATE PHYSICS, Issue 10 2010C. Y. Chang Abstract We report on the novel normally-on/off AlN/GaN high electron mobility transistors (HEMTs) grown by plasma-assisted molecular beam epitaxy. With simple oxygen exposure, the threshold voltage can be tuned from -2.76 V to +1.13 V depending on the treatment time. The gate current was reduced and current-voltage curves show metal-oxide semiconductor diode-like characteristics after oxygen plasma exposure. The extrinsic transconductance of HEMTs decrease with increasing oxygen plasma exposure time due to the thicker Al oxide formed on the gate area. The unity current gain cut-off frequency, fT, and maximum frequency of oscillation, fmax, were 20.4 GHz and 36.5 GHz, respectively for an enhancement-mode HEMT with the gate dimension of 0.4 × 100 ,m2. (© 2010 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [source] Optimization of the ohmic contact processing in InAlN//GaN high electron mobility transistors for lower temperature of annealingPHYSICA STATUS SOLIDI (C) - CURRENT TOPICS IN SOLID STATE PHYSICS, Issue 1 2010Karol Abstract In this article, we optimized the ohmic contact processing in InAlN/GaN high electron mobility transistors for the lower temperature of annealing by recessing of metalliza-tion to approach the 2DEG at the InAlN/GaN interface. The ohmic contacts which were recessed down to 5 nm depth and annealed at 700 °C 2 min. exhibited the contact resistance of 0,39 ,mm while the channel sheet resistance was 210 ,/square. These values are comparative to values of contacts processed at more conventional an-nealing conditions (800 °C, 2 min). Moreover we applied the recessed ohmic contact technology to fabricate Schottky barrier (SB) HEMTs and MOSHEMTs with Al2O3 dielectric film. For MOSHEMTs, we measured the maximal reduction of the gate leakage current by about 6 orders of magnitude if compared with SB HEMTs. The maximal drain current of MOSHEMTs was about 750 mA/mm at VGS = 0 V and the maximal extrinsic transconductance (gme) reached 101 mS/mm. (© 2010 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [source] Off-state breakdown in InAlN/AlN/GaN high electron mobility transistorsPHYSICA STATUS SOLIDI (C) - CURRENT TOPICS IN SOLID STATE PHYSICS, Issue S2 2009J. Kuzmik Abstract Unpassivated InAlN/AlN/GaN high electron mobility transistors off-state breakdown is analyzed for different gate-to-drain distances. The breakdown voltage linearly increases with the gate to drain distance reaching 350 V for a 10 ,m contact separation; the sub-threshold leakage current is < 10,5 A/mm. Similar breakdown voltages and leakage current are obtained on GaN buffer for two Ohmic contacts if their distance is the same. It is suggested that the breakdown is governed by injection/avalanche processes in the GaN buffer layer and is basically not affected by InAlN barrier. Our conclusions are further supported by measuring all currents in the three-terminal configuration of the transistors before and during the breakdown and by using a drain current injection technique. (© 2009 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [source] Analysis of minority carrier lifetime for InAlAs/InGaAs high electron mobility transistors by using 1.55-,m femto-second pulse laserPHYSICA STATUS SOLIDI (C) - CURRENT TOPICS IN SOLID STATE PHYSICS, Issue 9 2008Hirohisa Taguchi Abstract The minority carrier lifetime (,) of High electron mobility transistors (HEMTs) made using the InAlAs/InGaAs material system lattice-matched to the InP substrate had been obtained from optical response measurements with a 1.55-,m femto-second pulse laser where the laser was illuminated onto the backside of a wafer. The drain current of HEMTs associated with the optical pulse was detected using a digitizing oscilloscope, and , was estimated from the exponential dependence of drain current on time. In our current investigation, we found that , is dominated by the following modes: (1) the amount of time required for holes to transit across the channel toward the source, and (2) the amount of time required for the holes accumulated in the source region to recombine with two-dimensional electron gas (2DEG) through the Auger mechanism. Because the sheet concentration (ps) of holes accumulated in source region is low at a low source-to-drain voltage (VDS), Auger recombination is not predominant, and , was only dominated by the hole transit time. At a high VDS, ps became high enough for Auger recombination to occur and dominate ,. Furthermore, we investigated the optical power dependence of , where the optical power was supplied in a continuous wave (CW) to generate photo-excited holes in a steady state. The value of , decreased monotonically as VDS increased and saturated in as little as 6x10,10 s when the optical power was increased. The theoretical investigation was made to understand this saturation phenomenon. (© 2008 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [source] Realization of AlGaN/GaN HEMTs on 3C-SiC/Si(111) substratesPHYSICA STATUS SOLIDI (C) - CURRENT TOPICS IN SOLID STATE PHYSICS, Issue 6 2008Y. Cordier Abstract Cubic SiC/Si (111) template is an interesting alternative for growing GaN on silicon. As compared with silicon, this substrate allows reducing the stress in GaN films due to both lower lattice and thermal expansion coefficient mismatch, and can provide better heat dissipation. In this work, we first developed the epitaxial growth of 3C-SiC films on 50 mm Si(111) substrates using chemical vapor deposition. AlGaN/GaN high electron mobility transistors were grown by molecular beam epitaxy on these films. Both the structural quality and the behavior of transistors realized on these structures show the feasibility of this approach. (© 2008 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [source] Formation of ohmic contacts to ultra-thin channel AlN/GaN HEMTsPHYSICA STATUS SOLIDI (C) - CURRENT TOPICS IN SOLID STATE PHYSICS, Issue 6 2008Tom Zimmermann Abstract AlN/GaN-based high electron mobility transistors with ultra-thin AlN barriers of 2.3 - 5 nm are attractive candidates for very high speed applications owing to the aggressive scalability such structures afford. We report the first study on formation of ohmic contacts to these high quality ultra-thin channel heterostructures (ns > 1x1013 cm,2 and , > 900 cm2/Vs) with systematically varying barrier thicknesses. While the conventional ohmic contacts to AlGaN/GaN structures generally require high temperature annealing, these ohmic contacts were found to behave ohmic or near ohmic as-deposited. Annealing (400-860 0C) improves the contact resistance to a range of 0.8 - 2 ohm-mm but the annealing conditions strongly depend on the AlN thickness as well as the heterostructure quality (,). All alloyed contacts show smooth morphology, making them suitable for e-beam lithographically defined gate patterning. (© 2008 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [source] Experimental and theoretical investigation of terahertz optical-beating detection by plasma waves in high electron mobility transistorsPHYSICA STATUS SOLIDI (C) - CURRENT TOPICS IN SOLID STATE PHYSICS, Issue 1 2008H. Marinchio Abstract A photomixed laser beam of two 1.55 mm cw lasers is used to obtain interband photoexcitation at the difference frequency and at room temperature in submicron gate-length InAlAs/InGaAs transistors. Results show the clear excitation of plasma oscillation modes in the transistor channel. Fundamental plasma resonant frequency and its odd harmonics can be tuned with the applied gate voltage. Numerical simulations have also been performed using a hydrodynamic approach coupled to a pseudo-2D Poisson equation. Numerical results are in qualitative agreement with experiments and confirm optical beating detection at terahertz frequencies. (© 2008 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [source] AlGaN/GaN dual-gate high electron mobility transistors on SiC substrates for high-power mixersPHYSICA STATUS SOLIDI (C) - CURRENT TOPICS IN SOLID STATE PHYSICS, Issue 7 2005K. Shiojima Abstract We have demonstrated dual-gate AlGaN/GaN high-electron-mobility transistors on SiC substrates for high-power mixers and examined DC and up-conversion RF measurements with drain-source bias voltages (VDS) to analyze the possible output level. The 0.7 × 300 µm-gate device exhibited the maximum transconductance of 47 mS, maximum RF power of 19.6 dBm and up-conversion gain of 11 dB at 2 GHz when VDS = 15 V. For VDS of over 15 V, the devices occasionally broke down, because, although the device can handle more drain current, but the voltage swing reached the breakdown voltage of about 30 V. These results indicate that a Watt-class output mixer can be easily achieved with this simple dual-gate structure. (© 2005 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [source] | |||||||||||||