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Curing Reaction (curing + reaction)
Selected AbstractsThe effect of ageing on the elastic modulus and degree of conversion of two multistep adhesive systemsEUROPEAN JOURNAL OF ORAL SCIENCES, Issue 3 2010Giulio Marchesi Marchesi G, Navarra CO, Cadenaro M, Carrilho MR, Codan B, Sergo V, Di Lenarda R, Breschi L. The effect of ageing on the elastic modulus and degree of conversion of two multistep adhesive systems. Eur J Oral Sci 2010; 118: 304,310. © 2010 The Authors. Journal compilation © 2010 Eur J Oral Sci During the curing reaction, the monomers of dentine bonding systems should cross-link sufficiently to strengthen an adhesive so that it is clinically reliable. This study evaluated how different storage conditions (air vs. water storage) affect the elastic modulus (E-modulus) and degree of conversion (DC) of a three-step etch-and-rinse adhesive and a two-step self-etch adhesive. The biaxial flexural test and Raman microscopy were performed on resin disks made from the bonding agents Adper Scotchbond Multi-Purpose (SBMP; 3M ESPE) and Clearfil Protect Bond (CPB; Kuraray). The measurements were repeated after storage in either air or water for 15 and 30 min and for 1, 24, and 72 h. At time 0, the E-modulus was not affected by the adhesive system, whilst the degree of cure of CPB was higher than that of SBMP. Air storage increased the E-modulus at each ageing interval. Storage in water increased the E-modulus until it reached a maximum at 24 h, after which it decreased significantly at 72 h. No linear correlation between the percentage DC and E-modulus of the two adhesives was found when stored in water. The results of this study indicate that the mechanical properties and polymerization kinetics of SBMP and CPB are affected by storage time and medium. [source] Curing kinetics of boron-containing phenol,formaldehyde resin formed from paraformaldehydeINTERNATIONAL JOURNAL OF CHEMICAL KINETICS, Issue 11 2002Yanfang Liu A boron-containing phenol,formaldehyde resin (BPFR) was synthesized from boric acid, phenol, and paraformaldehyde. The curing reaction of BPFR was studied by Fourier-transform infrared spectrometry and differential scanning calorimetry. According to the heat evolution behavior during the curing process, several influencing factors on isothermal curing reaction were evaluated. The results show that the isothermal kinetic reaction of BPFR follows autocatalytic kinetics mechanism, and kinetic parameters m, n, k1, and k2, were derived, respectively. In the latter reaction stage, the curing reaction becomes controlled mainly by diffusion. © 2002 Wiley Periodicals, Inc. Int J Chem Kinet 34: 638,644, 2002 [source] Reactive mold filling in resin transfer molding processes with edge effectsJOURNAL OF APPLIED POLYMER SCIENCE, Issue 6 2009Yanyu Ding Abstract Reactive mold filling is one of the important stages in resin transfer molding processes, in which resin curing and edge effects are important characteristics. On the basis of previous work, volume-averaging momentum equations involving viscous and inertia terms were adopted to describe the resin flow in fiber preform, and modified governing equations derived from the Navier,Stokes equations are introduced to describe the resin flow in the edge channel. A dual-Arrhenius viscosity model is newly introduced to describe the chemorheological behavior of a modified bismaleimide resin. The influence of the curing reaction and processing parameters on the resin flow patterns was investigated. The results indicate that, under constant-flow velocity conditions, the curing reaction caused an obvious increase in the injection pressure and its influencing degree was greater with increasing resin temperature or preform permeability. Both a small change in the resin viscosity and the alteration of the injection flow velocity hardly affected the resin flow front. However, the variation of the preform permeability caused an obvious shape change in the resin flow front. The simulated results were in agreement with the experimental results. This study was helpful for optimizing the reactive mold-filling conditions. © 2009 Wiley Periodicals, Inc. J Appl Polym Sci, 2009 [source] Thermal and dielectric properties of bismaleimide-triazine resins containing octa(maleimidophenyl)silsesquioxaneJOURNAL OF APPLIED POLYMER SCIENCE, Issue 5 2008Hongwei Cao Abstract Octa(maleimidophenyl)silsesquioxane (OMPS) was synthesized, characterized, and employed to modify the BT resin which composed of 4,4,-bismaleimidodiphenylmethane (BMI) and 2,2,-bis(4-cyanatophenyl)propane (BCE). The curing reaction between OMPS and BT resin was first investigated. It was found that OMPS accelerate the curing reaction of BCE, and the onset temperature of the cyclotrimerization was reduced up to 95.5°C (by DSC). As demonstrated by DSC and FTIR, there was no evidence that indicated the coreaction between maleimide and cyanate ester. 2,2,-diallyl bisphenol A (DBA) and diglycidyl ether of bisphenol A (E-51) (Wuxi Resin Factory, Jiangsu Province, China) were also used to enhance the toughness of BT resin, and the formulated BTA (containing DBA) and BTE (containing E-51) resins were obtained. The thermal properties of BT, BTA, and BTE resins incorporated with OMPS were then investigated. The results of DMA and TG showed that the BT, BTA, and BTE resins containing 1 wt % of OMPS exhibit enhanced thermal properties in comparison with their pristine resins respectively, while more contents of OMPS may impair the thermal properties of the polymer matrix, though the effect of OMPS was slight. Finally, the dielectric constant of these hybrid materials were detected, and their dielectric constant were distinctly reduced by the incorporation of OMPS, while overmuch contents of OMPS were disadvantageous for dielectric constant because of the aggregation of OMPS. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci 2008 [source] Structure and metal type effects on cure kinetics of DGEBA with benzil bisthiosemicarbazone complexesJOURNAL OF APPLIED POLYMER SCIENCE, Issue 6 2008Mousa Ghaemy Abstract The curing reaction kinetics of the diglycidyl ether of bisphenol A- (DGEBA) based epoxy was investigated according to the change of curing agents. Complex curing agents based on Ni(II) and Cu(II) chelates with benzil bisthiosemicarbazone (LH6) as a ligand was studied using differential scanning calorimetry. The curing reaction was characterized by high-activation energies (Ea), cure onset (Ti), and peak maximum (Tp) temperatures. Dynamic kinetic parameters were calculated by using Kissinger and Ozawa methods. For the NiLH6Cl2, CuLH6Cl2, and LH6 the average values of Ea were calculated to be 165.16, 165.92, and 115.75 kJ/mol, respectively. For the NiLH6Cl2 systems, their activation energies at 40 and 30 phr are equal. The Ti and Tp of the DGEBA/NiLH6Cl2 system are lower than those of DGEBA/CuLH6Cl2 system. These results indicate that NiLH6Cl2 has a higher reactivity toward epoxy resin at the beginning of the curing reaction. The effect of hardener concentration, heating rate, and type of metal ion on the cure kinetic parameters and the shape of DSC thermograms were investigated. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008 [source] Properties of phenol,formaldehyde resin modified with organic acid estersJOURNAL OF APPLIED POLYMER SCIENCE, Issue 5 2008Rados, aw Mirski Abstract Properties of liquid and cured phenol,formaldehyde (PF) resin modified with esters were analyzed in this study. Esters with different carbon chain lengths, both in the acid and alcohol groups, were applied in the experiments. It was found that the modification of phenolic resin with applied esters does not deteriorate its pot life at the temperature of 20°C. It results in an increase of its reactivity at higher temperatures, manifested in the shortening of gel time at 130°C and a decrease of activation energy. Results of FTIR tests of polycondensed modified PF resin showed that products of alkali hydrolysis of esters not only catalyze the curing reaction of resin, but also become embedded in its structure. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008 [source] New type of phenolic resin,The curing reaction of bisphenol A based benzoxazine with bisoxazoline and the properties of the cured resin.JOURNAL OF APPLIED POLYMER SCIENCE, Issue 2 2008Abstract The curing reaction of a bisphenol A based benzoxazine [2,2-bis(3,4-dihydro-3-phenyl-1,3-benzoxazine) propane (Ba)] and bisoxazoline with a latent curing agent and the properties of the cured resins were investigated. With a latent curing agent, the ring-opening reaction of the benzoxazine ring occurred more rapidly, and then the phenolic hydroxyl group generated by the ring-opening reaction of the benzoxazine ring also reacted with the oxazoline ring more rapidly. The cure time of molten resins from Ba and bisoxazoline with a latent curing agent was reduced, and the cure temperature was lowered, in comparison with those of resins from Ba and bisoxazoline without a latent curing agent. The melt viscosity of molten resins from Ba and bisoxazoline with a latent curing agent was kept around 50 Pa s at 80°C even after 30 min, and molten resins from Ba and bisoxazoline with a latent curing agent showed good thermal stability below 80°C. However, above 170°C, the curing reaction of Ba with bisoxazoline with a latent curing agent proceeded rapidly. Cured resins from Ba and bisoxazoline with a latent curing agent showed good heat resistance, flame resistance, mechanical properties, and electrical insulation in comparison with cured resins from Ba and bisoxazoline without a latent curing agent. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008 [source] Curing behavior of a novel polytriazole resinJOURNAL OF APPLIED POLYMER SCIENCE, Issue 3 2007Liqiang Wan Abstract The curing behavior of a novel low temperature curing polytriazole resin, prepared from p -xylylene diazide and N,N,N,,N, -tetrapropargyl- p,p, -diaminodiphenylmethane, was investigated by DSC and rheological analyses. The kinetics of the curing of the resin was studied by nonisothermal and isothermal DSC measurements and the kinetics parameters were obtained. The values of apparent activation energy Ea of the curing reaction obtained by nonisothermal and isothermal DSC are 80.7 and 75.3 kJ/mol, respectively. The curing of the resin was traced by the isothermal rheological analysis. The gelation times of the resin at 70, 75, 80, and 85°C are about 200, 150, 110, and 75 min, respectively. The viscosity equation for the resin was found as follows: © 2007 Wiley Periodicals, Inc. J Appl Polym Sci 2007 [source] Nonisothermal cure kinetics of DGEBA with novel aromatic diamineJOURNAL OF APPLIED POLYMER SCIENCE, Issue 5 2007M. Ghaemy Abstract The effect of the molar ratio of diglycidyl ether of a bisphenol-A based epoxy (DGEBA) and synthesized 4-phenyl-2,6-bis(4-aminophenyl)pyridine (PAP) as curing agent during nonisothermal cure reaction by the Kissinger, Ozawa, and isoconversional equations was studied. The cure mechanism was studied by FTIR analysis. Kinetic analysis of the curing reaction of DGEBA at two different concentrations (42 and 32 phr) of the curing agent was studied by using DSC analysis. With an increasing PAP content, the pre-exponential factor increased by increasing collision probability between epoxide and primary or secondary amine groups in noncataltyic or catalytic modes. The activation energy also increased because of the increasing content of crosslink density. The activation energies obtained from three equations were in good agreement. © 2006 Wiley Periodicals, Inc. J Appl Polym Sci 103: 3076,3083, 2007. [source] Thermally dissociable pseudo -polyrotaxane as a supramolecular shrinkage suppressor for epoxy,amine curing systemJOURNAL OF POLYMER SCIENCE (IN TWO SECTIONS), Issue 6 2008Yukio Isobe Addition of pseudo -polyrotaxanes (PPRtxs) consisting of cyclodextrins (CDs) and amine-terminated polyethers to epoxy,amine curing system remarkably suppressed the volume shrinkage on the curing reaction. The PPRtx underwent thermal dissociation with creation of free volume, which efficiently contributed to the suppression of volume shrinkage. [Color figure can be viewed in the online issue, which is available at www.interscience.wiley.com.] [source] Synthesis of novel moisture-curable polyurethanes end-capped with trialkoxysilane and their application to one-component adhesivesJOURNAL OF POLYMER SCIENCE (IN TWO SECTIONS), Issue 13 2007Yukihiro Nomura Abstract Novel silane endcappers and novel polyurethanes end-capped with trimethoxysilane (silylated polyurethanes) were developed as water-curable materials in which the curing reaction occurred under humid conditions in the presence of dioctyltin diversatate as a curing catalyst. A variety of amine-terminated trimethoxysilane compounds were synthesized by the Michael addition reaction of commercially available 3-aminopropyltrimethoxysilane with acrylates, and the resulting silane endcappers were used to react with isocyanate-terminated polyurethanes, providing the silylated polyurethanes. The moisture-curable silylated polyurethanes were used for the preparation of novel one-component and solvent-free adhesives. The evaluated properties were the curing speed, the tensile shear bond strength, and the adherence to some substrates. The longer alkyl chains of the silane endcappers derived from various acrylates led to a slower curing speed, lower tensile strength at break, and longer elongation at break of the silylated polyurethanes. The tensile shear bond strength of the silylated polyurethane-based adhesive decreased with decreasing the trimethoxysilane end-capping ratio, whereas an increase in the adherence was observed. The adherence to the acrylic substrate was improved by changes in the main-chain structure of the polyurethane based on the composition of poly(propylene oxide) and poly(ethylene oxide). © 2007 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 45: 2689,2704, 2007 [source] Nonaqueous synthesis of nanosilica in epoxy resin matrix and thermal properties of their cured nanocompositesJOURNAL OF POLYMER SCIENCE (IN TWO SECTIONS), Issue 2 2006Tzong-Ming Lee Abstract Nonaqueous synthesis of nanosilica in diglycidyl ether of bisphenol-A epoxy (DGEBA) resin has been successfully achieved in this study by reacting tetraethoxysilane (TEOS) directly with DGEBA epoxy matrix, at 80 °C for 4 h under the catalysis of boron trifluoride monoethylamine (BF3MEA). BF3MEA was proved to be an effective catalyst for the formation of nanosilica in DGEBA epoxy under thermal heating process. FTIR and 29Si NMR spectra have been used to characterize the structures of nanosilica obtained from this direct thermal synthetic process. The morphology of the nanosilica synthesized in epoxy matrix has also been analyzed by TEM and SEM studies. The effects of both the concentration of BF3MEA catalyst and amount of TEOS on the diameters of nanosilica in the DGEBA epoxy resin have been discussed in this study. From the DSC analysis, it was found that the nanosilica containing epoxy exhibited the same curing profile as pure epoxy resin, during the curing reaction with 4,4,-diaminodiphenysulfone (DDS). The thermal-cured epoxy,nanosilica composites from 40% of TEOS exhibited high glass transition temperature of 221 °C, which was almost 50 °C higher than that of pure DGEBA,DDS,BF3MEA-cured resin network. Almost 60 °C increase in thermal degradation temperature has been observed during the TGA of the DDS-cured epoxy,nanosilica composites containing 40% of TEOS. © 2005 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 757,768, 2006 [source] Synthesis, characterization, and thermal properties of ladderlike polyepoxysiloxanesJOURNAL OF POLYMER SCIENCE (IN TWO SECTIONS), Issue 13 2001Yuhui Lin Abstract Starting from trichlorosilanes and using 1,4-phenylenediamine as a template, we have synthesized some ladderlike poly(glycidyl- co -alkyl/aryl)siloxanes (polyepoxysiloxanes or polyepoxies for short). The structures of copolymers were confirmed through IR, 1H NMR, elemental analyses, and gel permeation chromatography. Curing behaviors of these polyepoxies in the absence and presence of a curing agent have been studied with DSC. It was shown that these epoxies could be cured without any curing agent. Copolymers having aromatic groups showed higher curing reactivity than those having alkyl groups. The experimental results also demonstrate that the curing reaction occurred solely via epoxy functionality, not via the condensation reaction of the hydroxy groups located at the end of polymer main chains. The thermal stability of the cured polymers was examined by thermogravimetric analysis. The results confirm that polyepoxies with aromatic groups had better thermal stability than those with alkyl groups. It was also found that polyepoxies cured with a diamine have a higher thermal stability than those cured in the absence of a curing agent. © 2001 John Wiley & Sons, Inc. J Polym Sci Part A: Polym Chem 39: 2215,2222, 2001 [source] Curing Behavior of Epoxy Resin Using Controllable Curing Agents Based on Nickel ComplexesMACROMOLECULAR MATERIALS & ENGINEERING, Issue 2 2006Abdollah Omrani Abstract Summary: The curing reaction kinetics and mechanism of the diglycidyl ether of bisphenol A (DGEBA) with three complexes of Ni(II) with diethylentriamine (Dien), Pyrazole (Pz) and Pyridine (Py) as ligands have been studied using differential scanning calorimetry (DSC). The curing reaction was characterized by high cure onset and peak maximum temperatures. The kinetics of the curing reaction were evaluated using the Ozawa method. The average values of activation energy for the three nickel complexes increased in the order: Dien-based curing agent,>,Pz-based curing agent,>,Py-based curing agent. Three main curing mechanisms (catalytic, complex cation and free ligand polymerization path) have been proposed depending on the cure temperature. It was also shown that the cure kinetics of DGEBA with Dien- and Py-based complexes could be described by the Sestak-Berggren equation. The water absorption, chemical resistance and thermal stability of the thermosets were also studied. The results showed that the thermoset obtained with the Py-based complex was more thermally stable than those obtained with the other two curing agents. Activation energy versus conversion plots for the epoxy systems studied. [source] Reactive processing of syndiotactic polystyrene with an epoxy/amine solvent systemMACROMOLECULAR SYMPOSIA, Issue 1 2003Jaap Schut Abstract Syndiotactic polystyrene (sPS) is a new semi-crystalline thermoplastic which is believed to fill the price-performance gap between engineering and commodity plastics. In order to reduce the high processing temperature of sPS (>290°C), an epoxy-amine model system was used as a reactive solvent. Such a processing aid can be used to achieve a 50 to 500 fold lowering of the melt viscosity. When initially homogeneous solutions of sPS in a stoechiometric epoxy-amine mixture are thermally cured, Reaction Induced Phase Separation (RIPS) takes place, leading to phase separated thermoplastic-thermoset polymer blends. We focus our study on low (wt% sPS < 20%) and high concentration blends (wt% sPS > 60%) prepared by two processing techniques (mechanical stirring in a laboratory reactor or internal mixer/ reactive extrusion respectively). These blends have different potential interests. Low concentration blends (sPS domains in an epoxy-amine matrix) are prepared to create new, tunable blend morphologies by choosing the nature of the phase separation process, i.e. either crystallisation followed by polymerization or polymerization followed crystallisation. High concentration blends (sPS matrix containing dispersed epoxy-amine particles after RIPS) are prepared to facilitate the extrusion of sPS. In this case, the epoxy amine model system served as a reactive solvent. The time to the onset of RIPS is in the order of 7-9 min for low concentration blends, while it increases to 20-45 min for high concentration samples, as the reaction rates are substantially slowed down due to lower epoxy and amine concentrations. During the curing reaction the melting temperature of sPS in the reactive solvent mixture evolves back from a depressed value to the level of pure sPS. This indicates a change in the composition of the sPS phase, caused by (complete) phase separation upon reaction. We conclude that our epoxy amine system is suited for reactive processing of sPS, where final properties depend strongly on composition and processing conditions. [source] Kinetics and thermodynamics of isothermal curing reaction of epoxy-4, 4,-diaminoazobenzene reinforced with nanosilica and nanoclay particlesPOLYMER COMPOSITES, Issue 8 2010M. Barghamadi The kinetics of the cure reaction for a system of bisphenol-A epoxy resin (DGEBA), with 4, 4,-diaminoazobenzene (DAAB), reinforced with nanosilica (NS), and nanoclay (NC) by means of isothermal technique of differential scanning calorimetry were studied. The Kamal autocatalytic-like kinetic model was used to estimate the reaction orders (m, n), rate constants (k1, k2), and also active energies (Ea) and pre-exponential factors (A) of the curing reaction. However, the existence of NS and NC with hydroxyl groups in the structure improves the cure reaction and influence the rate of reaction and therefore kinetics parameters. The Ea of cure reaction of DGEBA/DAAB system showed a decrease when nanoparticles were present and therefore the rate of the reaction was increased. Using the rate constants from the kinetic analysis and transition state theory, thermodynamic parameters such as enthalpy (,H#), entropy (,S#), and Gibbs free energy (,G#) changes were also calculated. The thermodynamic functions were shown to be very sensitive parameters for evaluation of the cure reaction. POLYM. COMPOS., 31:1442,1448, 2010. © 2009 Society of Plastics Engineers [source] Cure kinetics, phase behaviors, and fracture properties of bismaleimide resin toughened by poly(phthalazinone ether ketone)POLYMER ENGINEERING & SCIENCE, Issue 12 2009Yongjin Han Poly(phthalazinone ether ketone)s (PPEK) were used to toughen bismaleimide (BMI) resin composed of 4,4,-bismaleimidodiphenyl methane (BMDM) and O,O, -diallyl bisphenyl A (DABPA). Dynamic differential scanning calorimetry (DSC) of the blends was carried out for kinetic analysis of the curing reaction. The reaction activation energy indicated that the reaction mechanism remained the same even after the incorporation of PPEK. The reaction-induced phase separation process in BMI/PPEK blends was investigated by optical microscopy (OM). The primary phase structure of the blends was fixed at the early stage of phase separation, and a secondary phase separation was observed as a result of the high viscosity of the blends. Scanning electron microscope (SEM) graphs showed that the morphology of the cured resin changed from a dispersed structure to a phase-inverted structure with the increase of PPEK content. Compared with the neat resin, the fracture toughness of the modified resin exhibits a moderate increase when PPEK was incorporated. Several toughening mechanisms, such as local plastic deformation, crack deflection, and branches, presumably took part in improving the toughness of BMI/PPEK blends on the basis of the morphology. POLYM. ENG. SCI., 2009. © 2009 Society of Plastics Engineers [source] Curing of diglycidyl ether of bisphenol-A epoxy resin using a poly(aryl ether ketone) bearing pendant carboxyl groups as macromolecular curing agentPOLYMER INTERNATIONAL, Issue 8 2009Fuhua Liu Abstract BACKGROUND: Reactive thermoplastics have received increasing attention in the field of epoxy resin toughening. This paper presents the first report of using a novel polyaryletherketone bearing one pendant carboxyl group per repeat unit to cure the diglycidyl ether of bisphenol-A epoxy resin (DGEBA). The curing reactions of DGEBA/PEK-L mixtures of various molar ratios and with different catalysts were investigated by means of dynamic differential scanning calorimetry and Fourier transform infrared (FTIR) spectroscopy methods. RESULTS: FTIR results for the DGEBA/PEK-L system before curing and after curing at 135 °C for different times demonstrated that the carboxyl groups of PEK-L were indeed involved in the curing reaction to form a crosslinked network, as evidenced by the marked decreased peak intensities of the carboxyl group at 1705 cm,1 and the epoxy group at 915 cm,1 as well as the newly emerged strong absorptions of ester bonds at 1721 cm,1 and hydroxyl groups at 3447 cm,1. Curing kinetic analysis showed that the value of the activation energy (Ea) was the highest at the beginning of curing, followed by a decrease with increasing conversion (,), which was attributed to the autocatalytic effect of hydroxyls generated in the curing reaction. CONCLUSION: The pendant carboxyl groups in PEK-L can react with epoxy groups of DGEBA during thermal curing, and covalently participate in the crosslinking network. PEK-L is thus expected to significantly improve the fracture toughness of DGEBA epoxy resin. Copyright © 2009 Society of Chemical Industry [source] Modelling and Simulation of Curing Processes of Epoxy ResinPROCEEDINGS IN APPLIED MATHEMATICS & MECHANICS, Issue 1 2009Bülent Yagimli During the curing reaction, the adhesive changes its thermomechanical material behaviour from a viscous fluid to a viscoelastic solid. This phase transition is an exothermal chemical reaction which is accompanied by thermal expansion, chemical shrinkage and changes in temperature. In this work the numerical simulation of the curing process will be presented. The material model for the implementation is presented in [1]. For the implementation of the material model the consistent tangent operator has been derived. In the presentation, experimental data and simulation are shown. (© 2009 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim) [source] Synthesis and characterization of a cured epoxy resin with a benzoxazine monomer containing allyl groupsJOURNAL OF APPLIED POLYMER SCIENCE, Issue 6 2010Shiao-Wei Kuo Abstract Vinyl-terminated benzoxazine (VB-a), which can be polymerized through ring-opening polymerization, was synthesized through the Mannich condensation of bisphenol A, formaldehyde, and allylamine. This VB-a monomer was then blended with epoxy resin and then concurrently thermally cured to form an epoxy/VB-a copolymer network. To understand the curing kinetics of this epoxy/VB-a copolymer, dynamic differential scanning calorimetry measurements were performed by the Kissinger and Flynn,Wall,Ozawa methods. Fourier transform infrared (FTIR) analyses revealed the presence of thermal curing reactions and hydrogen-bonding interactions of the epoxy/VB-a copolymers. Meanwhile, a significant enhancement of the ring-opening and allyl polymerizations of the epoxy was observed. For these interpenetrating polymer networks, dynamic mechanical analysis and thermogravimetric analysis results indicate that the thermal properties increased with increasing VB-a content in the epoxy/VB-a copolymers. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010 [source] Catalytic reactions of oxetanes with protonic reagents and aprotic reagents leading to novel polymersJOURNAL OF POLYMER SCIENCE (IN TWO SECTIONS), Issue 5 2007Hiroto Kudo Abstract This paper reports new addition reactions of oxetanes with certain protonic reagents such as carboxylic acid, phenol, and thiol, and with certain aprotic reagents such as acyl chloride, thioester, phosphonyl dichloride, silyl chloride, and chloroformate using quaternary onium salts as catalysts. The kinetic study of the addition reactions of oxetanes was also investigated. These new addition reactions were applicable to the synthesis of new polymers. These polyaddition systems could also construct both polymer main chains and reactive side chains. The alternating copolymerization of oxetanes with carboxylic anhydride was performed. Furthermore, it was found that anionic ring-opening polymerization of oxetanes containing hydroxy groups proceeded to afford the hyperbranched polymer (HBP) with an oxetanyl group and many hydroxy groups at the ends of the polymer chains. Alkali developable photofunctional HBPs were synthesized by the polyaddition of bis(oxetane)s or tris(oxetane)s, and their patterning properties were examined, too. The photo-induced cationic polymerization of the polymers with pendant oxetanyl groups and the thermal curing reactions of polyfunctional oxetanes (oxetane resins) were also examined to give the crosslinking materials quantitatively. © 2007 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 709,726, 2007 [source] Analysis of heat transfer in autoclave technologyPOLYMER COMPOSITES, Issue 5 2001Vincenza Antonucci In autoclave technology, polymer based composites are manufactured under the application of pressure and heat. The heat transferred between the energy carrying fluid and the bag-composite-tool element activates exothermic curing reactions, leading to composite consolidation. The convective heat transfer mechanism is the most relevant aspect controlling the rate of chemical and physical transformations associated with composite curing. Moreover, the fluidodynamic regime that results from the interactions between the autoclave and the tool geometry, even if totally predictable in theory, is unattainable in practice. In this study, the heat transfer phenomena occurring during the autoclave manufacturing cycle have been analyzed. The assumption of a negligible through-the-thickness thermal gradient led to simplified energy balance equations. In this case, the thermal evolution of the manufacturing elements has been completely determined by two parameters: the global convective heat exchange coefficient, setting the rate of the heat transfer between the autoclave environment and the bag-composite-tool element, and the adiabatic temperature rise, establishing the relevance of the polymerization exotherm. A scaling analysis has been performed in order to identify the dimensionless parameters controlling the autoclave process. The developed semitheoretical methodology has been extensively tested by comparison with experimental data from an industrial autoclave. [source] | |||||||||||||