Home About us Contact
|
Home About us Contact | ||
|
|
||
Cure Temperature (cure + temperature)
Selected AbstractsPorous epoxies by reaction induced phase separation of removable alcohols: Control of spheroidal pore size by mass fraction, cure temperature, and reaction rate,JOURNAL OF APPLIED POLYMER SCIENCE, Issue 6 2010Robert J. Klein Abstract Porous organic and inorganic materials with both random and controlled microstructures have utility in a variety of fields including catalysis, sensors, separations, optical platforms, tissue engineering, hydrogen storage, micro-electronics, medical diagnostics, as well as other applications. This work highlights a simple and general technique for tuning the pore size in crosslinking polymeric systems by adding a solvent poragen that phase separates during the curing process (reaction induced phase separation). The pore size can be controlled over large length scales ranging from microns to well below 100 nanometers. In this system an amine cured epoxy resin was reacted in the presence of the sacrificial poragen octadecanol, which is removed by vacuum-assisted evaporation once the epoxy components have reacted to form a solid, porous matrix. The importance of the present approach is based on the simplicity of the chemical formulation, the ease by which other epoxide or amine chemistries may be substituted for the two reactive components, and the control of pore size down to the nanometer scale by the addition of a small amount of catalyst. © 2010 Wiley Periodicals, Inc., J Appl Polym Sci, 2010 [source] New type of phenolic resin,The curing reaction of bisphenol A based benzoxazine with bisoxazoline and the properties of the cured resin.JOURNAL OF APPLIED POLYMER SCIENCE, Issue 2 2008Abstract The curing reaction of a bisphenol A based benzoxazine [2,2-bis(3,4-dihydro-3-phenyl-1,3-benzoxazine) propane (Ba)] and bisoxazoline with a latent curing agent and the properties of the cured resins were investigated. With a latent curing agent, the ring-opening reaction of the benzoxazine ring occurred more rapidly, and then the phenolic hydroxyl group generated by the ring-opening reaction of the benzoxazine ring also reacted with the oxazoline ring more rapidly. The cure time of molten resins from Ba and bisoxazoline with a latent curing agent was reduced, and the cure temperature was lowered, in comparison with those of resins from Ba and bisoxazoline without a latent curing agent. The melt viscosity of molten resins from Ba and bisoxazoline with a latent curing agent was kept around 50 Pa s at 80°C even after 30 min, and molten resins from Ba and bisoxazoline with a latent curing agent showed good thermal stability below 80°C. However, above 170°C, the curing reaction of Ba with bisoxazoline with a latent curing agent proceeded rapidly. Cured resins from Ba and bisoxazoline with a latent curing agent showed good heat resistance, flame resistance, mechanical properties, and electrical insulation in comparison with cured resins from Ba and bisoxazoline without a latent curing agent. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2008 [source] Some factors influencing exfoliation and physical property enhancement in nanoclay epoxy resins based on diglycidyl ethers of bisphenol A and FJOURNAL OF APPLIED POLYMER SCIENCE, Issue 1 2007S. Ingram Abstract An investigation of the factors influencing the degree of exfoliation of an organically modified clay in a series of epoxy resins is reported. The use of sonication, choice of curing agent, effect of the moisture content of the clay, and the cure temperature were examined. The dispersion was characterized using a combination of rheological measurements, X-ray diffraction, and dynamic mechanical thermal analysis. Rheological analysis of the clay dispersion in the epoxy monomer indicated that at high clay loads Herschel,Bulkley type behavior is followed. Higher cure temperatures and higher levels of clay moisture were found to influence the extent of exfoliation. Improvements in physical properties were observed through the addition of nanocomposites. The DGEBA/DDM and DEGEBA/DDS exhibited 2 and 4°C increase, respectively, in Tg per wt % of added clay. DGEBF showed virtually no enhancement. © 2007 Wiley Periodicals, Inc. J Appl Polym Sci, 2007 [source] Recent advancement on polybenzoxazine,A newly developed high performance thermosetJOURNAL OF POLYMER SCIENCE (IN TWO SECTIONS), Issue 21 2009Yusuf Yagci Abstract Polybenzoxazine is a newly developed addition polymerized phenolic system, having a wide range of interesting features and the capability to overcome several shortcomings of conventional novolac and resole type phenolic resins. They exhibit (i) near zero volumetric change upon curing, (ii) low water absorption, (iii) for some polybenzoxazines Tg much higher than cure temperature, (iv) high char yield, (v) no strong acid catalysts required for curing, (vi) release of no byproduct during curing and also possess thermal and flame retarding properties of phenolics along with the mechanical performance. Though benzoxazine based materials possess several advantages, they have not yet became very attractive to the industries. To improve the mechanical properties and processibility several strategies have been reported including (i) synthesis of benzoxazine monomers with additional functionality, (ii) incorporation of benzoxazine in polymer chain, and (iii) benzoxazine based composites or alloys. In this article, we have discussed about the recent development of benzoxazine chemistry. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 5565,5576, 2009 [source] Curing Behavior of Epoxy Resin Using Controllable Curing Agents Based on Nickel ComplexesMACROMOLECULAR MATERIALS & ENGINEERING, Issue 2 2006Abdollah Omrani Abstract Summary: The curing reaction kinetics and mechanism of the diglycidyl ether of bisphenol A (DGEBA) with three complexes of Ni(II) with diethylentriamine (Dien), Pyrazole (Pz) and Pyridine (Py) as ligands have been studied using differential scanning calorimetry (DSC). The curing reaction was characterized by high cure onset and peak maximum temperatures. The kinetics of the curing reaction were evaluated using the Ozawa method. The average values of activation energy for the three nickel complexes increased in the order: Dien-based curing agent,>,Pz-based curing agent,>,Py-based curing agent. Three main curing mechanisms (catalytic, complex cation and free ligand polymerization path) have been proposed depending on the cure temperature. It was also shown that the cure kinetics of DGEBA with Dien- and Py-based complexes could be described by the Sestak-Berggren equation. The water absorption, chemical resistance and thermal stability of the thermosets were also studied. The results showed that the thermoset obtained with the Py-based complex was more thermally stable than those obtained with the other two curing agents. Activation energy versus conversion plots for the epoxy systems studied. [source] In situ monitoring of reaction-induced phase separation with modulated temperature DSCMACROMOLECULAR SYMPOSIA, Issue 1 2003Steven Swier Abstract A linearly polymerizing and network forming epoxy-amine system, DGEBA-aniline and DGEBA-MDA, respectively, will be modified with 20 wt% and 50 wt% of a high- Tg thermoplastic poly(ether sulphone) (Tg=223°C), respectively, both showing LCST-type demixing behavior. Reaction-induced phase separation (RIPS) in these modified systems is studied using Modulated Temperature DSC (MTDSC) as an in situ tool. Phase separation in the linear system can be probed by vitrification of the PES-rich phase, occurring at a higher conversion than the actual cloud point from light scattering measurements. The negative slope of the cloud point curve in a temperature-conversion-transformation diagram unambiguously shows the LCST-type demixing behavior of this system, while the relation between the composition/glass transition of the PES-rich phase and the cure temperature is responsible for the positive slope of its vitrification line. Phase separation in the network forming system appears as reactivity increases at the cloud point due to the concentration of reactive groups. Different mixture compositions alter the ratio between the rate of phase separation and the rate of reaction, greatly affecting the morphology. Information about this in situ developed structure can be obtained from the heat capacity evolutions in non-isothermal post-cures. [source] Interfacial adhesion and molecular diffusion in melt lamination of wood sawdust/ebonite NR and EPDMPOLYMER COMPOSITES, Issue 3 2009W. Yamsaengsung Adhesion mechanisms and peel strengths of wood/ebonite NR-EPDM laminates were investigated. Three different chemical coupling agents: namely; N-(, aminoethyl)-,-aminopropyl-triethoxysilane (AAS), 3-methacryloxypropyl trimethoxysilane (ACS), and Bis-(3-triethoxylpropyl) tetrasulfan (Si69) were introduced into the wood/NR composites to enhance an interaction between wood sawdust (SD) particles and NR molecules, and to improve the adhesion strength between the SD/NR and EPDM layers. The quantitative evidences were given to explain the changes in the adhesion or peel strengths of the SD/NR-EPDM laminates through scanning electron microscopy with energy dispersive X-ray analysis (SEM-EDS). The experimental results indicated that the suitable cure time and cure temperature for SD/NR-EPDM melt-laminates were the tc90 of SD/NR composites and 140°C, respectively. The Si69 coupling agent was found to be the most effective coupling agent as compared with AAS and ACS coupling agents. The Si69 of 0.5 wt% was recommended for the optimizations of the tensile modulus of the SD/NR composites and the peel strength of the SD/NR-EPDM laminates. The diffusion level between the SD/NR and EPDM layers could be quantitatively substantiated by determining the sulfur content transfer from the SD/NR layer to the EPDM layer. The diffusion and entanglement of molecular chains from the SD/NR to the EPDM layer initiated the co-crosslinking reaction which played an important role on the changes in the interfacial strength in the SD/NR-EPDM melt-laminates. POLYM. COMPOS., 2009. © 2008 Society of Plastics Engineers [source] An alternative model for predicting the cure kinetics of a high temperature cure epoxy adhesive,POLYMER ENGINEERING & SCIENCE, Issue 1 2003Angela D. Rogers The purpose of this work was to develop a cure kinetics model for a commercially available high temperature cure epoxy adhesive commonly used in the aerospace industry. While there are several phenomenological cure kinetic models commonly used in the literature for describing the rate of conversion of thermosetting epoxy adhesives as a function of degree of conversion, none of these models adequately depicts the adhesive used in this work over the entire range of conversion. Hence, by curve fitting empirical data collected using differential scanning calorimetry and refinement of existing models, an alternative model is proposed. The form of the present model suggests that chemical curing is the result of the combination of two autocatalytic reactions. The model is able to account for both the chemically controlled and diffusion controlled regimes of the cure. This paper also describes a novel iterative approach for predicting kinetics parameters as a function of isothermal cure temperature. Excellent agreement between experimental measurements and model predictions has been demonstrated over the entire range of conversion. [source] Time-cure-temperature superposition for the prediction of instantaneous viscoelastic properties during curePOLYMER ENGINEERING & SCIENCE, Issue 6 2000Yongsung Eom The relative sequence of shrinkage and evolution of modulus of a thermoset resin during cure leads to the build-up of internal stresses, especially if the resin is constrained by the presence of other materials in the form of a substrate or reinforcing fibers. To enable prediction of the levels of internal stress generated during processing and to determine appropriate processing windows, the evolution of the modulus of an epoxy-amine system during cure has been characterized and described with a phenomenological model. A combined reaction kinetics model is used to determine the degree of conversion of the epoxy over any complete range of cure. The chemorheological properties of the resin are measured as a function of curing temperature with a torsional parallel plate rheometer. A new phenomenological approach for time-cure-temperature superposition is proposed for predicting the relaxation modulus at any moment during cure and at any cure temperature. The combination of these two models provides a full description of the instantaneous viscoelastic properties during cure. This approach, which can be adapted to any curing resin, provides suitable tools for the analysis of viscoelastic stress build-up following any industrially relevant cure cycle. [source] Dielectric monitoring of curing of liquid oligomer-modified epoxy matricesPOLYMER INTERNATIONAL, Issue 9 2001G Kortaberria Abstract Dielectric measurements were performed in ,real-time' at several temperatures to follow polymerization reactions on blends of a diglycidyl ether of bisphenol A (DGEBA) epoxy resin with 4, 4,-diaminodiphenylmethane (DDM) hardener and different amounts of polyoxypropylenetriamine (POPTA) oligomer. These systems exhibit phase separation induced by molar mass increasing through curing of the resin. Monitoring of phase separation and vitrification (related to the ,-relaxation) was performed by this technique. The results are compared with those for the unmodified resin,hardener mixture. The change of the main ,-relaxation with cure time, cure temperature, and amount of modifier was measured for the mixtures. This change of the main relaxation through curing in the frequency domain was indicative of the cure reaction advancement, because of its dependence on the viscosity of the medium. The change of the ionic conductivity during curing was also analysed, showing its dependence upon cure temperature. © 2001 Society of Chemical Industry [source] Microwave and conventional curing of thick-section thermoset composite laminates: Experiment and simulationPOLYMER COMPOSITES, Issue 2 2001Erik T. Thostenson In conventional processing, thermal gradients cause differential curing of thick laminates and undesirable outside-in solidification. To reduce thermal gradients, thick laminates are processed at lower cure temperatures and heated with slow heating rates, resulting in excessive cure times. Microwaves can transmit energy volumetrically and instantaneously through direct interaction of materials with applied electromagnetic fields. The more efficient energy transfer of microwaves can alleviate the problems associated with differential curing, and the preferred inside-out solidification can be obtained. In this work, both microwave curing and thermal curing of 24.5 mm (1 inch) thick-section glass/epoxy laminates are investigated through the development of a numerical process simulation and conducting experiments in processing thick laminates in a conventional autoclave and a microwave furnace. Outside-in curing of the autoclave-processed laminate resulted in visible matrix cracks, while cracks were not visible in the microwave-processed laminate. Both numerical and experimental results show that volumetric heating due to microwaves promotes an inside-out cure and can dramatically reduce the overall processing time. [source] Effects of organically modified clay loading on rate and extent of cure in an epoxy nanocomposite systemPOLYMER INTERNATIONAL, Issue 11 2008Sharon E Ingram Abstract BACKGROUND: Cloisite 30B was added to diglycidyl ether of bisphenol F and cured with diaminodiphenylsulfone to investigate how the organoclay influenced the extent of cure. RESULTS: A substantial increase in the extent of cure was found with the addition of Cloisite 30B, when lower cure temperatures were employed. Cloisite 30B at 2 wt% resulted in a 40 °C increase in glass transition temperature and an increase in the magnitude of the bending modulus even though a high level of intercalated material was detected. CONCLUSIONS: It was observed that the addition of Cloisite 30B to the epoxy system increased the level of cure in the polymer, and was particularly prominent at low cure temperatures. Copyright © 2008 Society of Chemical Industry [source] Preparation and thermal properties of bismaleimide blends based on hydroxyphenyl maleimidePOLYMER INTERNATIONAL, Issue 8 2005BS Rao Abstract N -(4-hydroxyphenyl)maleimide was melt-blended with the glycidyl ether of bisphenol-A and various mole percentages of 4, 4,-(diaminodiphenylsulfone) bismaleimide. The cure behaviour of the resins was evaluated by differential scanning calorimetry (DSC) and dynamic mechanical thermal analysis (DMTA). The blends showed distinct reductions in the onset of cure (To) and peak exothermic (Texo) temperatures. The blends cured at low temperatures exhibited glass transition temperatures (Tgs) higher than the cure temperatures. The cured blends showed high moduli, glass transition temperatures in excess of 250 °C and good thermal stabilities up to 400 °C. Copyright © 2005 Society of Chemical Industry [source] | ||||||||||