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Crack Opening Displacement (crack + opening_displacement)
Selected AbstractsCrack opening displacement in plate with bonded repair patchFATIGUE & FRACTURE OF ENGINEERING MATERIALS AND STRUCTURES, Issue 6 2006M. M. RATWANI ABSTRACT Mathematical techniques are extended to compute crack opening displacements in a cracked plate with an adhesively bonded composite patch. The plate and the patch are considered as orthotropic materials. The problem is reduced to the solution of integral equations. A software program is written to compute shear stresses in adhesive, stress intensity factors in the plate and the crack openings at the centreline of the crack. The effects of adhesive thickness, adhesive modulus, patch thickness and plate thickness on crack openings are investigated. A test program is carried out to obtain crack opening displacements in plate with bonded patch. A good agreement with analytical predictions is obtained. The effects of patches bonded on one or both sides of a plate on stress intensity factors are evaluated. [source] Hypersingular integral equation method for three-dimensional crack problem in shear modeINTERNATIONAL JOURNAL FOR NUMERICAL METHODS IN BIOMEDICAL ENGINEERING, Issue 6 2004Y. Z. ChenArticle first published online: 19 APR 200 Abstract This paper presents the use of the hypersingular integral equation method for solving the flat crack problem in shear mode. In the method, the crack opening displacement (COD) functions are assumed to be polynomials with several undetermined coefficients. The involved hypersingular integral can be reduced into a repeat integral in a particular polar co-ordinate, and further integrated by a known quadrature rule. This technique considerably reduces the effort of derivation and computation to obtain the final solution. The undetermined coefficients in the COD functions are obtained from an algebraic equation. The stress intensity factors (SIF) along the boundary of the flat crack can then be easily calculated. Numerical examples are given to demonstrate the efficiency of the proposed method. Copyright 2004 John Wiley & Sons, Ltd. [source] Micromechanical analysis of silicon nitride: a comparative study by fracture mechanics and Raman microprobe spectroscopyJOURNAL OF RAMAN SPECTROSCOPY, Issue 9 2002Shigemi Tochino Raman microprobe spectroscopy was used to characterize in situ microstress fields which develop during fracture of a toughened silicon nitride (Si3N4) polycrystal. Maps of microscopic stress were collected in the neighborhood of a propagating crack both at zero and at critical loading conditions. Micromechanics results by Raman spectroscopy were analyzed and compared with conventional fracture mechanics assessments, such as the evaluation of rising R -curve behavior and crack opening displacement. Outcomes of these assessments illustrate that, despite the approximations involved in the piezo-spectroscopic equations used for calculating the microstress field from a local Raman shift, Raman microprobe spectroscopy is a viable method for semi-quantitative investigations of microfracture mechanisms in advanced ceramic materials. Copyright © 2002 John Wiley & Sons, Ltd. [source] Effects of Matrix Cracks on the Thermal Diffusivity of a Fiber-Reinforced Ceramic CompositeJOURNAL OF THE AMERICAN CERAMIC SOCIETY, Issue 9 2001Kathleen R. McDonald Effects of matrix cracks and the attendant interface debonding and sliding on both the longitudinal and the transverse thermal diffusivities of a unidirectional Nicalon/MAS composite are investigated. The diffusivity measurements are made in situ during tensile testing using a phase-sensitive photothermal technique. The contribution to the longitudinal thermal resistance from each of the cracks is determined from the longitudinal diffusivity along with measurements of crack density. By combining the transverse measurements with the predictions of an effective medium model, the thermal conductance of the interface (characterized by a Biot number) is determined and found to decrease with increasing crack opening displacement, from an initial value of ,1 to ,0.3. This degradation is attributed to the deleterious effects of interface sliding on the thermal conductance. Corroborating evidence of degradation in the interface conductance is obtained from the inferred crack conductances coupled with a unit cell model for a fiber composite containing a periodic array of matrix cracks. Additional notable features of the material behavior include: (i) reductions of ,20% in both the longitudinal and the transverse diffusivities at stresses near the ultimate strength, (ii) almost complete recovery of the longitudinal diffusivity following unloading, and (iii) essentially no change in the transverse diffusivity following unloading. The recovery of the longitudinal diffusivity is attributed to closure of the matrix cracks. By contrast, the degradation in the interface conductance is permanent, as manifest in the lack of recovery of the transverse diffusivity. [source] Thermal Conductance of Delamination Cracks in a Fiber-Reinforced Ceramic CompositeJOURNAL OF THE AMERICAN CERAMIC SOCIETY, Issue 3 2000Kathleen R. McDonald The thermal conductance of delamination cracks in a unidirectionally reinforced ceramic composite is investigated. A phase-sensitive photothermal technique is used to measure the crack conductance in situ under load. Special emphasis is given to the effects of the local crack opening displacement (,). A crack conductance model that considers the contributions from both the air and the fibers within the crack is developed and compared with the measurements. Despite considerable scatter in the experimental data, the model adequately predicts the increased conductance that is associated with fiber bridging, as well as the overall trend that is observed with ,. [source] Crack opening displacement in plate with bonded repair patchFATIGUE & FRACTURE OF ENGINEERING MATERIALS AND STRUCTURES, Issue 6 2006M. M. RATWANI ABSTRACT Mathematical techniques are extended to compute crack opening displacements in a cracked plate with an adhesively bonded composite patch. The plate and the patch are considered as orthotropic materials. The problem is reduced to the solution of integral equations. A software program is written to compute shear stresses in adhesive, stress intensity factors in the plate and the crack openings at the centreline of the crack. The effects of adhesive thickness, adhesive modulus, patch thickness and plate thickness on crack openings are investigated. A test program is carried out to obtain crack opening displacements in plate with bonded patch. A good agreement with analytical predictions is obtained. The effects of patches bonded on one or both sides of a plate on stress intensity factors are evaluated. [source] Dual boundary element method for anisotropic dynamic fracture mechanicsINTERNATIONAL JOURNAL FOR NUMERICAL METHODS IN ENGINEERING, Issue 9 2004E. L. Albuquerque Abstract In this work, the dual boundary element method formulation is developed for effective modelling of dynamic crack problems. The static fundamental solutions are used and the domain integral, which comes from the inertial term, is transformed into boundary integrals using the dual reciprocity technique. Dynamic stress intensity factors are computed from crack opening displacements. Comparisons are made with quasi-isotropic as well as anisotropic results, using the sub-region technique. Several examples are presented to assess the accuracy and efficiency of the proposed method. Copyright © 2004 John Wiley & Sons, Ltd. [source] | |||||||||||||