Conductive Material (conductive + material)

Distribution by Scientific Domains


Selected Abstracts


Leakage field distribution of a transformer for conventional and superconducting conditions

EUROPEAN TRANSACTIONS ON ELECTRICAL POWER, Issue 4 2002
P. Raitsios
The overall distribution of leakage field and current density in a transformer model with cylindrical windings in proximity to the core yokes is investigated from a different viewpoint than that of Kapp or Rogowski, i.e. by taking into consideration the conductivity of the conductive material. Using Maxwell's differential equations and the vector potential and by considering the conductivity of the conductive material, general equations are obtained for the components of the magnetic induction in a two dimensional space. From these components the leakage inductance is calculated and its application for conventional and superconducting conditions is examined. The distribution of current density in the windings is obtained from the vector potential. [source]


The assessment of microscopic charging effects induced by focused electron and ion beam irradiation of dielectrics

MICROSCOPY RESEARCH AND TECHNIQUE, Issue 3 2007
Marion A. Stevens-Kalceff
Abstract Energetic beams of electrons and ions are widely used to probe the microscopic properties of materials. Irradiation with charged beams in scanning electron microscopes (SEM) and focused ion beam (FIB) systems may result in the trapping of charge at irradiation induced or pre-existing defects within the implanted microvolume of the dielectric material. The significant perturbing influence on dielectric materials of both electron and (Ga+) ion beam irradiation is assessed using scanning probe microscopy (SPM) techniques. Kelvin Probe Microscopy (KPM) is an advanced SPM technique in which long-range Coulomb forces between a conductive atomic force probe and the silicon dioxide specimen enable the potential at the specimen surface to be characterized with high spatial resolution. KPM reveals characteristic significant localized potentials in both electron and ion implanted dielectrics. The potentials are observed despite charge mitigation strategies including prior coating of the dielectric specimen with a layer of thin grounded conductive material. Both electron- and ion-induced charging effects are influenced by a delicate balance of a number of different dynamic processes including charge-trapping and secondary electron emission. In the case of ion beam induced charging, the additional influence of ion implantation and nonstoichiometric sputtering from compounds is also important. The presence of a localized potential will result in the electromigration of mobile charged defect species within the irradiated volume of the dielectric specimen. This electromigration may result in local modification of the chemical composition of the irradiated dielectric. The implications of charging induced effects must be considered during the microanalysis and processing of dielectric materials using electron and ion beam techniques. Microsc. Res. Tech., 2007. © 2007 Wiley-Liss, Inc. [source]


Selection of the eddy currents frequency for conductivity measurements in two-layer structures

PROCEEDINGS IN APPLIED MATHEMATICS & MECHANICS, Issue 1 2009
Leszek Dziczkowski
Conductance measurements of conductive parts can serve as a background for conclusion about structure of material and possible defects (e.g. fractures, fissures, delamination, flaking, etc.) that may occur in examined parts. When the need arises to test surfaces of parts that are made of a conductive but non-ferromagnetic material, the method of eddy currents offers unsurpassed advantages. The problem refers to application of the eddy current method to examination of conductive material coated with conductive films. The major outcome consists in development of a very simple and useful mathematical model that can be used to determine conductivity of the deep layer for the needs of non-destructive tests. (© 2009 Wiley-VCH Verlag GmbH & Co. KGaA, Weinheim) [source]


Nanosized Glass Frit as an Adhesion Promoter for Ink-Jet Printed Conductive Patterns on Glass Substrates Annealed at High Temperatures,

ADVANCED FUNCTIONAL MATERIALS, Issue 19 2008
Daehwan Jang
Abstract Ink-jet printed metal nanoparticle films have been shown to anneal at high temperatures (above 500,°C) to highly conductive metal films on glass or ceramic substrates, but they suffer from cracking and inadequate substrate adhesion. Here, we report printable conductive materials, with added nanosized glass frit that can be annealed at 500,°C to form a crack-free dense microstructure that adheres well to glass substrates. This overcomes the previous challenges while still retaining the desired high film conductivity. Controlling the particle characteristics and dispersion behavior plays an important role in successfully incorporating the glass frit into the conductive inks. [source]