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Conductive Adhesives (conductive + adhesive)

Distribution by Scientific Domains
Polymers and Materials Science100%

Selected Abstracts

The role of a third component on the conductivity behavior of ternary epoxy/Ag conductive composites

POLYMER COMPOSITES, Issue 4 2002
W. Jia
Conductive adhesives, based on highly filled silver particles dispersed in a liquid epoxy resin, with an aliphatic amine [diethyltriamine (DETA)] as a curing agent, were investigated. A third component was added to the epoxy/Ag system to obtain composites of better conductivity, or similar conductivity but at lower silver contents, to modify the conductive adhesive properties, and also to reduce cost. Epoxy/Ag/carbon black (CB), epoxy/Ag/carbon fibrils (CF), epoxy/Ag/SiO2 and epoxy/Ag/dispersant composites were thus studied. The effect of high curing temperature on the uniformity and resulting conductivity level was also studied. The studied systems, excluding the epoxy/Ag/CB composite, exhibited enhanced conductivities. The microstructure of most of the systems was studied by scanning electron microscopy (SEM). The micrographs produced have served to establish structure-property relations for better understanding of the observed phenomena. [source]

Foldable Printed Circuit Boards on Paper Substrates

ADVANCED FUNCTIONAL MATERIALS, Issue 1 2010
Adam C. Siegel
Abstract This paper describes several low-cost methods for fabricating flexible electronic circuits on paper. The circuits comprise i) metallic wires (e.g., tin or zinc) that are deposited on the substrate by evaporation, sputtering, or airbrushing, and ii) discrete surface-mountable electronic components that are fastened with conductive adhesive directly to the wires. These electronic circuits,like conventional printed circuit boards,can be produced with electronic components that connect on both sides of the substrate. Unlike printed circuit boards made from fiberglass, ceramics, or polyimides, however, paper can be folded and creased (repeatedly), shaped to form three-dimensional structures, trimmed using scissors, used to wick fluids (e.g., for microfluidic applications) and disposed of by incineration. Paper-based electronic circuits are thin and lightweight; they should be useful for applications in consumer electronics and packaging, for disposable systems for uses in the military and homeland security, for applications in medical sensing or low-cost portable diagnostics, for paper-based microelectromechanical systems, and for applications involving textiles. [source]

Silver Surface Iodination for Enhancing the Conductivity of Conductive Composites

ADVANCED FUNCTIONAL MATERIALS, Issue 16 2010
Cheng Yang
Abstract The electrical conductivity of a silver microflake-filled conductive composites is dramatically improved after a filler surface treatment. By a simple iodine solution treatment, nonstoichiometric silver/silver iodide nanoislands form on the silver filler surface. Evidence of the decrease of surface silver oxide species is provided by TOF-SIMS and the redox property of the nanoclusters is studied using cyclic voltammetry and TOF-SIMS depth profile analyses. The redox property of the nanoclusters on silver flakes helps enhance the electrical conductivity of the conductive composites. The electrical resistivity of the improved conductive composites is measured by four-point probe method; the reliability of the printed thin film resistors is evaluated by both the 85 °C/85% relative humidity moisture exposure and the ,40 , 125 °C thermal cycling exposure. The conductive composite printed radio frequency identification (RFID) antennas with 27.5 wt% of the modified silver flake content show comparable performance in the RFID tag read range versus copper foil antennas, and better than those commercial conductive adhesives that require much higher silver content (i.e., 80 wt%). This work suggests that a surface chemistry method can significantly reduce the percolation threshold of the loading level of the silver flakes and improve the electrical conductivity of an important printed electronic passive component. [source]

Silver Surface Iodination for Enhancing the Conductivity of Conductive Composites

ADVANCED FUNCTIONAL MATERIALS, Issue 16 2010
Cheng Yang
Abstract The electrical conductivity of a silver microflake-filled conductive composites is dramatically improved after a filler surface treatment. By a simple iodine solution treatment, nonstoichiometric silver/silver iodide nanoislands form on the silver filler surface. Evidence of the decrease of surface silver oxide species is provided by TOF-SIMS and the redox property of the nanoclusters is studied using cyclic voltammetry and TOF-SIMS depth profile analyses. The redox property of the nanoclusters on silver flakes helps enhance the electrical conductivity of the conductive composites. The electrical resistivity of the improved conductive composites is measured by four-point probe method; the reliability of the printed thin film resistors is evaluated by both the 85 °C/85% relative humidity moisture exposure and the ,40 , 125 °C thermal cycling exposure. The conductive composite printed radio frequency identification (RFID) antennas with 27.5 wt% of the modified silver flake content show comparable performance in the RFID tag read range versus copper foil antennas, and better than those commercial conductive adhesives that require much higher silver content (i.e., 80 wt%). This work suggests that a surface chemistry method can significantly reduce the percolation threshold of the loading level of the silver flakes and improve the electrical conductivity of an important printed electronic passive component. [source]