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Thermal Resistance (thermal + resistance)
Selected AbstractsDetergent and Sanitizer Stresses Decrease the Thermal Resistance of Enterobacter sakazakii in Infant Milk FormulaJOURNAL OF FOOD SCIENCE, Issue 3 2008T.M. Osaili ABSTRACT:, This study determined the effect of acid, alkaline, chlorine, and ethanol stresses on the thermal inactivation of Enterobacter sakazakii in infant milk formula. Unstressed or stressed cells were mixed with reconstituted powdered infant milk formula (PIMF) at temperatures between 52 and 58 °C for various time periods or mixed with PIMF prior to reconstitution with hot water between 50 and 100 °C. D - and z -values were determined using liner regression analysis. In general, detergent and sanitizer stresses decreased the thermal resistance of E. sakazakii in infant milk formula. The results of this study may be of use to regulatory agencies, manufacturers, and infant caregivers to design heating processes to eliminate E. sakazakii. [source] Determination of the Thermal Resistance of the Polymer,Ceramic Interface of Alumina-Filled Polymer CompositesJOURNAL OF THE AMERICAN CERAMIC SOCIETY, Issue 10 2004Richard F. Hill To model the thermal conductivity of polymer composites that are filled with ceramic powders, the conductivity of each component as well as the interfacial resistance at each ceramic,polymer boundary must be known. An indirect method to determine this interfacial boundary resistance is proposed by preparing large-scale "macromodel" simulations of the polymer,ceramic interface. Macromodels, prepared by spin-coating a polymer layer onto sapphire wafers, were formed in a sapphire,polymer,sapphire sandwich type structure. The interfacial boundary thermal resistance was calculated from thermal resistance measurements made on the macromodels. [source] Inverse Problem for Composites with Imperfect Interface: Determination of Interfacial Thermal Resistance, Thermal Conductivity of Constituents, and Microstructural ParametersJOURNAL OF THE AMERICAN CERAMIC SOCIETY, Issue 4 2000Ce-Wen Nan An explicit method is introduced to solve inverse problems for composites with imperfect interfaces. We apply the method to determine the thermal conductivity of constituents and the interfacial thermal resistance in SiC-particulate-reinforced aluminum-matrix composites and to estimate the whisker thermal conductivity, the interfacial thermal resistance, and the whisker alignment distribution in two types of SiC-whisker-reinforced lithium aluminosilicate glass-ceramic composites from their measured effective thermal conductivity reported in the literature. Certain bounds for these three properties of both SiC-whisker-reinforced glass-ceramic composites are obtained, and reasonable estimates for their exact values from room temperature to 500°C are made. The inverse problem is quite sensitive to noise in the measurements. We also comment on existing estimates. [source] Characterization of Powder Beds by Thermal Conductivity: Effect of Gas Pressure on the Thermal Resistance of Particle Contact PointsPARTICLE & PARTICLE SYSTEMS CHARACTERIZATION, Issue 4 2004Michael Shapiro Abstract The thermal conductivity of ceramic powder packed beds was measured at temperatures below 100,°C for various powder sizes and compositions and under different gas atmospheres. Measurements at low pressures (down to 10,Pa) combined with a theoretical model allowed the elucidation of geometrical and thermal resistance parameters for the contact points between granules. The gap thickness and contact point size were found to be well correlated with the mean particle size. The thermal conductivities of all powders at low pressure were found to differ at most by a factor of two, whereas the solid-phase conductivities of the powder materials differed by more than one order of magnitude. A theoretical model accounting for the size-dependence of contact point conductivity is incorporated to rationalize this trend. [source] Thermal analysis of GaN-based laser diode packagePHYSICA STATUS SOLIDI (C) - CURRENT TOPICS IN SOLID STATE PHYSICS, Issue 6 2006W. J. Hwang Abstract This paper reports on the thermal behavior of GaN-based laser diode (LD) package as functions of cool-ing systems, die attaching materials, and chip loading conditions. Thermal resistance and junction tem-perature was determined by electrical-thermal transient method. Significant change of thermal resistance with input current was observed under natural cooling condition due to the sensitive change of heat trans-fer coefficient (h ) with temperature. Employment of PbSn as a die attachment was more advantageous over Ag-paste in thermal behavior of LD package. Compare the thermal resistance of LD packages epi-down and epi-up structures. The partial thermal resistance from junction to submount is 4.68 K/W for epi-down structure, and 9.65 K/W to epi-up structure. The results demonstrate that the total thermal resistance of LD package be controlled mainly by the packaging design rather than the chip structure itself. (© 2006 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [source] Dynamics of heat-induced thermal stress resistance and hsp70 expression in the springtail, Orchesella cinctaFUNCTIONAL ECOLOGY, Issue 2 2009Simon Bahrndorff Summary 1The relationship between thermal resistance and expression of inducible heat shock proteins, especially Hsp70, depends on the species and temperature treatments. The induction of Hsp70 has been shown to be essential for heat stress survival in a number of species, yet the maximum protein expression levels do not coincide with peak survival after heat hardening in Drosophila. 2Here we study the functional relationship between heat-induced expression of the heat shock protein Hsp70, and thermal resistance in adult Orchesella cincta by comparing thermal resistance (survival of 37·4 °C for 60 min) with Hsp70 gene and protein expression levels, all three measured at time points 2, 4, 6, 23, 27, 49 h after a heat hardening treatment (35·4 °C for 60 min). 3Thermotolerance increased over time after heat hardening until 49 h after exposure when the experiment ended. On the other hand the expression of hsp70 messenger RNA reached a peak within the first 2 h and then sharply decreased after 6 h. Within 23 h hsp70 expression was back to control levels. 4Surprisingly, protein levels of Hsp70 followed thermotolerance and reached the highest levels 49 h after heat hardening. A significant positive association was found between thermotolerance and Hsp70 protein levels, but not with hsp70 mRNA levels. 5Our results support a strong correlation between Hsp70 expression levels and thermal resistance following a heat hardening treatment. They also show that gene and protein expression follow different dynamics, a difference that may be important for our understanding of the role of candidate genes in functional studies. [source] Modelled changes in arctic tundra snow, energy and moisture fluxes due to increased shrubsGLOBAL CHANGE BIOLOGY, Issue 1 2002Glen E. Liston Abstract In arctic tundra, shrubs can significantly modify the distribution and physical characteristics of snow, influencing the exchanges of energy and moisture between terrestrial ecosystems and the atmosphere from winter into the growing season. These interactions were studied using a spatially distributed, physically based modelling system that represents key components of the land,atmosphere system. Simulations were run for 4 years, over a 4-km2 tundra domain located in arctic Alaska. A shrub increase was simulated by replacing the observed moist-tundra and wet-tundra vegetation classes with shrub-tundra; a procedure that modified 77% of the simulation domain. The remaining 23% of the domain, primarily ridge tops, was left as the observed dry-tundra vegetation class. The shrub enhancement increased the averaged snow depth of the domain by 14%, decreased blowing-snow sublimation fluxes by 68%, and increased the snowcover's thermal resistance by 15%. The shrub increase also caused significant changes in snow-depth distribution patterns; the shrub-enhanced areas had deeper snow, and the non-modified areas had less snow. This snow-distribution change influenced the timing and magnitude of all surface energy-balance components during snowmelt. The modified snow distributions also affected meltwater fluxes, leading to greater meltwater production late in the melt season. For a region with an annual snow-free period of approximately 90 days, the snow-covered period decreased by 11 days on the ridges and increased by 5 days in the shrub-enhanced areas. Arctic shrub increases impact the spatial coupling of climatically important snow, energy and moisture interactions by producing changes in both shrub-enhanced and non-modified areas. In addition, the temporal coupling of the climate system was modified when additional moisture held within the snowcover, because of less winter sublimation, was released as snowmelt in the spring. [source] Estimating error in measuring thermal conductivity using a T-type nanosensorHEAT TRANSFER - ASIAN RESEARCH (FORMERLY HEAT TRANSFER-JAPANESE RESEARCH), Issue 5 2009Yohei Ito Abstract We discuss the measurement error caused by fabrication and measurement of a T-type nanosensor with a suspended sub-micrometer Pt hot film that was developed to measure the thermal properties of individual nanowire materials. Comparison of numerical simulation and one-dimensional analysis revealed that the thermal conductivity of nanowire material such as a carbon nanotube is calculated to be 17% lower. As an example, the thermal conductivity measurement result for a SiC nanowire is reported. The error caused by contact thermal resistance is found to depend on the contact length and can be as great as 20%. It can be said that future measuring can have higher reliability by correcting the estimated measurement error. © 2009 Wiley Periodicals, Inc. Heat Trans Asian Res; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/htj.20228 [source] Effect of the plate thermal resistance on the heat transfer performance of a corrugated thin plate heat exchangerHEAT TRANSFER - ASIAN RESEARCH (FORMERLY HEAT TRANSFER-JAPANESE RESEARCH), Issue 3 2006Hiroshi Iwai Abstract Two-dimensional conjugate conduction/convection numerical simulations were carried out for flow and thermal fields in a unit model of a counter-flow-type corrugated thin plate heat exchanger core. The effects of the thermal resistance of the solid plate, namely the variation of the plate thickness and the difference of the plate material, on the heat exchanger performance were examined in the Reynolds number range of 100 Study on constant stress: Accelerated life tests of fouling thermal resistanceHEAT TRANSFER - ASIAN RESEARCH (FORMERLY HEAT TRANSFER-JAPANESE RESEARCH), Issue 2 2006Yang Shan-rang Abstract To shorten the time of fouling tests, fouling life was defined. The statistical analysis method for type II-censored exponential life data under constant-stress accelerated life testing models and the accelerated coefficients a and b were obtained. By using an accelerated model, the estimators of the fouling life under usual stress could be obtained. A computing example was given. Results indicated that it is credible and feasible to perform accelerated life tests of asymptotic fouling thermal resistance, and will be of important value to experimental research of fouling. © 2006 Wiley Periodicals, Inc. Heat Trans Asian Res, 35(2): 110,114, 2006; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/htj.20105 [source] Analysis of the parameters of the sintered loop heat pipeHEAT TRANSFER - ASIAN RESEARCH (FORMERLY HEAT TRANSFER-JAPANESE RESEARCH), Issue 8 2004K.J. Zan Abstract The purpose of this paper is to establish an experimental formula for sintered dendritic nickel powder. For this reason, wick structures with different porosity ranging from 65 to 80% were fabricated by cold pressing sintering process at fixed porosity and their parameters that included porosity, pore radius, and permeability were also measured. According to both the capillary limitation and the present experimental formula of the sintered dendritic nickel powder, the wick structure parameters that would affect the heat transfer capacity of the loop heat pipe (LHP) were analyzed theoretically and then investigated experimentally. The results showed that there exists an optimal combination of wick structure parameters by which the performance of the LHP would achieve optimization. The maximum heat transfer capacity was up to 500 W and the thermal resistance was 0.12°C/W at the allowable working temperature 80°C. © 2004 Wiley Periodicals, Inc. Heat Trans Asian Res, 33(8): 515,526, 2004; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/htj.20034 [source] Ground water level influence on thermal response test in Adana, TurkeyINTERNATIONAL JOURNAL OF ENERGY RESEARCH, Issue 7 2008. Bozda Abstract For optimum design of borehole thermal energy storage (BTES) and ground sources heat pump (GSHP) applications, determination of underground thermal properties is required. The design and economic feasibility (number and depth of boreholes) of these systems need thermal conductivity of geological structure, , (W,m,1,K,1), and thermal resistance of ground heat exchanger, R (K,W,1,m). Thermal properties measured in laboratory experiments do not coincide with data of in situ conditions. Therefore, in situ thermal response test equipment has been developed and used in Canada, England, Germany, Norway, U.K., U.S.A. and Sweden to ensure precise designing of BTES systems. This paper describes the results and evaluations of the Adana continual thermal response test measurements. Copyright © 2007 John Wiley & Sons, Ltd. [source] Thermal performance of aluminium-foam CPU heat exchangersINTERNATIONAL JOURNAL OF ENERGY RESEARCH, Issue 11 2006H. Mahdi Abstract This study investigates the performance of existing central processing unit (CPU) heat exchangers and compares it with aluminium-foam heat exchangers in natural convection using an industrial set-up. Kapton flexible heaters are used to replicate the heat produced by a computer's CPU. A number of thermocouples are connected between the heater and the heat sink being used to measure the component's temperature. The thermocouples are also connected to a data-acquisition card to collect the data using LabVIEW program. The values obtained for traditional heat exchangers are compared to published data to validate experiments and set-up. The validated set-up was then utilized to test the aluminium-foam heat exchangers and compare its performance to that of common heat sinks. It is found that thermal resistance is reduced more than 70% by employing aluminium-foam CPU heat exchangers. The results demonstrate that this material provides an advantage on thermal dissipation under natural convection over most available technologies, as it considerably increases the surface-area-to-volume ratio. Furthermore, the aluminium-foam heat exchangers reduce the overall weight. Copyright © 2005 John wiley & Sons, Ltd. [source] Thermal conductivity of wool and wool,hemp insulationINTERNATIONAL JOURNAL OF ENERGY RESEARCH, Issue 1 2006Z. Ye Abstract Measurements have been obtained for the thermal resistance of sheep-wool insulation and wool,hemp mixtures, both in the form of bonded insulation batts, using a calibrated guarded hot-box. The density was 9.6,25.9 kg m,3 for the wool and 9.9,18.1 kg m,3 for the wool,hemp mixtures. The measurements were made at a mean sample temperature of 13.3°C using a calibrated guarded hot-box. The estimated uncertainly in the resistance measurements was of the order of ±7%. The thermal conductivity of the samples, derived from the thermal resistance measurements on the basis of the measured thickness, was well correlated with the density, although the variation with density was larger than that obtained in previous studies. The conductivity of the wool,hemp samples was not significantly different from that of the wool samples at the same density. Moisture uptake produced an increase of less than 5% in the conductivity of the bonded wool insulation for an increase in absorbed moisture content of 20%. The thermal resistance was 1.6% lower on average for samples oriented in the horizontal plane rather than the vertical plane, but this difference is not significant. Copyright © 2005 John Wiley & Sons, Ltd. [source] Modelling of a pin-fin heat converter with fluid cooling for power semiconductor modulesINTERNATIONAL JOURNAL OF ENERGY RESEARCH, Issue 11 2003Igor Khorunzhii Abstract This paper presents a way to design a finite-element computer model of cooling system with a complicated geometry. The computer model is developed on the basis of a commercial software package ABAQUS. The steady state forced-convective fluid cooling of a pin-fin heat converter for power (,1 kW heat power) semiconductor module has been investigated on the basis of computer simulation. A phenomenological equation has been used for calculation of the local value of the heat transfer coefficient for the liquid-solid interface. The impacts of the thermal conductivity of the pin-fin sink material, volume flow rate of the cooling liquid and geometrical design of the pin-fin sink on the thermal resistance of the converter are shown. Copyright © 2003 John Wiley & Sons, Ltd. [source] The effect of culture growth phase on induction of the heat shock response in Yersinia enterocolitica and Listeria monocytogenesJOURNAL OF APPLIED MICROBIOLOGY, Issue 2 2000C.M.M. McMahon The effect of culture growth phase on induction of the heat shock response in Yersinia enterocolitica and Listeria monocytogenes, was examined. Exponential or stationary preconditioned cultures were heat shocked and survivor numbers estimated using selective and overlay/resuscitation recovery techniques. The results indicate that prior heat shock induced increased heat resistance in both micro-organisms to higher heat treatments. Heat-shocked cells of each micro-organism were able to survive much longer than non-heat-shocked cells when heated at 55 °C. The size of the change in heat resistance between heat-shocked and non-heat-shocked cells was greatest for exponential cultures (X:X). Results indicate that the overall relative thermal resistance of each pathogen was dependent on cell growth phase. Stationary cultures (S:S) were significantly (P < 0·01) more thermotolerant than exponential cultures (X:X) under identical processing conditions. Under most conditions, the use of an overlay/resuscitation recovery medium resulted in higher D -values (P < 0·05) compared with a selective recovery medium. [source] Tensile and lignocellulosic properties of Prosopis chilensis natural fabricJOURNAL OF APPLIED POLYMER SCIENCE, Issue 5 2010G. Venkata Reddy Abstract The uniaxial natural fabric Prosopis chilensis was treated with NaOH (alkali), poly (vinyl alcohol) (PVA), and polycarbonate (PC) solutions. The Prosopis chilensis fabric belongs to Leguminosae family. The properties of ligno-cellulosic fabric and the effect of sodium hydroxide (NaOH) treatment were evaluated using thermal analysis by means of thermogravimetric and differential scanning calorimetry analysis, Autonated total reflection-fourier transform infrared spectroscopy, X-ray diffraction (XRD), and field emission scanning electron microscopy. Tensile properties of the untreated and fabric treated with NaOH, PVA, and PC were also studied to assess their performance. The fabric has good thermal resistance on alkali treatment. The FTIR method indicates lowering the hemi cellulose and lignin content by alkali treatment. Further, the XRD studies reveal that crystallinity of the fabric increases on alkali treatment. Tensile properties of the fabric were enhanced on treatments with NaOH, PVA, and PC treatments. © 2010 Wiley Periodicals, Inc. J Appl Polym Sci, 2010 [source] Effective thermal conductivity behavior of filled vulcanized perfluoromethyl vinyl ether rubberJOURNAL OF APPLIED POLYMER SCIENCE, Issue 5 2008Li Wang Abstract The effective thermal conductivity behavior of vulcanized perfluoromethyl vinyl ether (PMVE) rubber filled with various inorganic fillers was investigated and analyzed with thermal conductivity models. Experimental results showed that there was no significant improvement in the thermal conductivity of PMVE rubber if the intrinsic thermal conductivity of the fillers was greater than 100 times that of the rubber matrix, and this agreed with the prediction of Maxwell's equation. The thermal conductivity of PMVE rubber filled with larger size silicon carbide (SiC) particles was greater than that of PMVE filled with smaller size SiC because of the lower interfacial thermal resistance, and there existed a transition filler loading at about 60 vol %. It was also found that flocculent graphite was the most effective thermally conductive filler among the fillers studied. A modified form of Agari's equation with a parameter independent on the units used was proposed. © 2008 Wiley Periodicals, Inc. J Appl Polym Sci, 2008 [source] THERMAL DEATH TIMES OF ESCHERICHIA COLI IN YOUNG COCONUT ENDOSPERM BEVERAGEJOURNAL OF FOOD PROCESSING AND PRESERVATION, Issue 2009ALONZO A. GABRIEL ABSTRACT The decimal reduction times (D values) of Escherichia coli (American Type Culture Collection 25922) were established in a young coconut endosperm beverage, a famous local drink in the Philippines and in many tropical countries. Artificially inoculated cells were heated to 60, 70 and 80C at various heating times prior to survivor enumeration by surface plating onto pre-solidified Eosine Methylene Blue Agar. Results showed that the surviving populations significantly (P < 0.05) decreased with increasing exposure time and temperature. The calculated D values ranged from 0.26 ± 0.01 to 0.56 ± 0.08 min. Validation of the results by establishing the thermal resistance of other E. coli isolates in the coconut beverage medium was recommended. PRACTICAL APPLICATION The study established the thermal inactivation rates of Escherichia coli (American Type Culture Collection 25922) in a young coconut endosperm beverage medium in various heating temperatures. The results obtained from this study may be used in the calculations of appropriate thermal process schedules for the test beverage against the test organism. [source] Hydrodynamic Cavitation: Characterization of a Novel Design with Energy Considerations for the Inactivation of Saccharomyces cerevisiae in Apple JuiceJOURNAL OF FOOD SCIENCE, Issue 6 2008P.J. Milly ABSTRACT:, A Shockwave PowerÔ Reactor consisting of an annulus with a rotating pock-marked inner cylinder was used to induce hydrodynamic cavitation in calcium-fortified apple juice flowing in the annular space. Lethality on Saccharomyces cerevisiae was assessed at processing temperatures of 65 and 76.7 °C. Details of the novel equipment design were presented and energy consumption was compared to conventional and pulsed electric fields processing technologies. The mean log cycle reduction of S. cerevisiae was 6.27 CFU/mL and all treatments resulted in nonrecoverable viable cells. Induced lethality from hydrodynamic cavitation on S. cerevisiae exceeded the predicted values based on experimentally determined thermal resistance. Rotation of 3000 and 3600 rpm at flow rates greater than 1.0 L/min raised product temperature from 20 to 65.6 or 76.7 °C, respectively, and energy input was less than 220 kJ/kg. Conversion efficiency from electrical to thermal was 55% to 84%. Hydrodynamic cavitation enhanced lethality of spoilage microorganisms in minimally processed juices and reduced energy usage. [source] Detergent and Sanitizer Stresses Decrease the Thermal Resistance of Enterobacter sakazakii in Infant Milk FormulaJOURNAL OF FOOD SCIENCE, Issue 3 2008T.M. Osaili ABSTRACT:, This study determined the effect of acid, alkaline, chlorine, and ethanol stresses on the thermal inactivation of Enterobacter sakazakii in infant milk formula. Unstressed or stressed cells were mixed with reconstituted powdered infant milk formula (PIMF) at temperatures between 52 and 58 °C for various time periods or mixed with PIMF prior to reconstitution with hot water between 50 and 100 °C. D - and z -values were determined using liner regression analysis. In general, detergent and sanitizer stresses decreased the thermal resistance of E. sakazakii in infant milk formula. The results of this study may be of use to regulatory agencies, manufacturers, and infant caregivers to design heating processes to eliminate E. sakazakii. [source] Heat-moisture Treatments of Cowpea Flour and Their Effects on Phytase InactivationJOURNAL OF FOOD SCIENCE, Issue 2 2005Nicole S. Affrifah ABSTRACT: Samples of finely ground cowpea flour with moisture content adjusted to 10%, 25%, 35% (dry basis) were heated in sealed retort pouches at 70 to 95°C for periods of 2 to 32 min. Phytase showed a high thermal resistance with residual activity ranging between 50% and 95%. Thermal inactivation of cowpea phytase was adequately described by a fractional conversion model based on a 1st-order rate equation. Overall, increasing temperature and initial moisture content resulted in increased enzyme inactivation. Estimated activation energies between 70 and 95°C were 33.3, 37.9, and 43.4 kJ/mol at 10%, 25%, and 35% moisture, respectively. The kinetic models generated were successfully used to predict phytase activity in cowpea flour. [source] Effects of Matrix Cracks on the Thermal Diffusivity of a Fiber-Reinforced Ceramic CompositeJOURNAL OF THE AMERICAN CERAMIC SOCIETY, Issue 9 2001Kathleen R. McDonald Effects of matrix cracks and the attendant interface debonding and sliding on both the longitudinal and the transverse thermal diffusivities of a unidirectional Nicalon/MAS composite are investigated. The diffusivity measurements are made in situ during tensile testing using a phase-sensitive photothermal technique. The contribution to the longitudinal thermal resistance from each of the cracks is determined from the longitudinal diffusivity along with measurements of crack density. By combining the transverse measurements with the predictions of an effective medium model, the thermal conductance of the interface (characterized by a Biot number) is determined and found to decrease with increasing crack opening displacement, from an initial value of ,1 to ,0.3. This degradation is attributed to the deleterious effects of interface sliding on the thermal conductance. Corroborating evidence of degradation in the interface conductance is obtained from the inferred crack conductances coupled with a unit cell model for a fiber composite containing a periodic array of matrix cracks. Additional notable features of the material behavior include: (i) reductions of ,20% in both the longitudinal and the transverse diffusivities at stresses near the ultimate strength, (ii) almost complete recovery of the longitudinal diffusivity following unloading, and (iii) essentially no change in the transverse diffusivity following unloading. The recovery of the longitudinal diffusivity is attributed to closure of the matrix cracks. By contrast, the degradation in the interface conductance is permanent, as manifest in the lack of recovery of the transverse diffusivity. [source] Inverse Problem for Composites with Imperfect Interface: Determination of Interfacial Thermal Resistance, Thermal Conductivity of Constituents, and Microstructural ParametersJOURNAL OF THE AMERICAN CERAMIC SOCIETY, Issue 4 2000Ce-Wen Nan An explicit method is introduced to solve inverse problems for composites with imperfect interfaces. We apply the method to determine the thermal conductivity of constituents and the interfacial thermal resistance in SiC-particulate-reinforced aluminum-matrix composites and to estimate the whisker thermal conductivity, the interfacial thermal resistance, and the whisker alignment distribution in two types of SiC-whisker-reinforced lithium aluminosilicate glass-ceramic composites from their measured effective thermal conductivity reported in the literature. Certain bounds for these three properties of both SiC-whisker-reinforced glass-ceramic composites are obtained, and reasonable estimates for their exact values from room temperature to 500°C are made. The inverse problem is quite sensitive to noise in the measurements. We also comment on existing estimates. [source] Thermal tolerance of acid-adapted and unadapted Salmonella, Escherichia coli O157:H7, and Listeria monocytogenes in cantaloupe juice and watermelon juiceLETTERS IN APPLIED MICROBIOLOGY, Issue 6 2005M. Sharma Abstract Aims:, A study was performed to determine D values of acid-adapted and unadapted cells of Salmonella, Escherichia coli O157:H7, and Listeria monocytogenes in cantaloupe juice and watermelon juice. Methods and Results:,Salmonella enterica serotype Poona, S. enterica serotype Saphra, two strains of E. coli O157:H7, and two strains of L. monocytogenes were grown in tryptic soy broth (TSB) and TSB supplemented with 1% glucose for 24 h at 37°C. Decimal reduction times (D values) of cells suspended in unpasteurized cantaloupe juice and watermelon juice were determined. Acid-adapted cells of Salmonella and E. coli O157:H7, but not L. monocytogenes, had increased thermal tolerance compared with cells that were not acid-adapted. There was no correlation between soluble solids content of the two types of juice and thermal resistance. Conclusions:, Growth of Salmonella and E. coli O157:H7 in cantaloupe juice, watermelon juice, or other acidic milieu, either in preharvest or postharvest environments, may result in cross protection to heat. The pasteurization conditions necessary to achieve elimination of pathogens from these juices would consequently have to be more severe if cells are habituated to acidic environments. Significance and Impact of the Study:, Insights from this study provide guidance to developing pasteurization processes to eliminate Salmonella, E. coli O157:H7, and L. monocytogenes in cantaloupe juice and watermelon juice. [source] Finite-element heat-transfer analysis of a PEEK-steel sliding pair in a pin-on-disc configurationLUBRICATION SCIENCE, Issue 1 2001László Kónya Abstract Finite-element (FE) thermal models have been developed in order to study the temperature distribution in a sliding pair comprising a poly(ether ether ketone) (PEEK) pin and a steel disc in a pin-on-disc configuration. First, a moving heat source model for the disc was created. An alternative distributed heat source model was also produced in order to reduce computing time for the evaluation of the moving heat source model by some orders of magnitude. This latter model gave the same results as the moving heat source model, except for a small region just below the moving heat source. On the basis of the distributed heat source approach, a complete axisymmetric FE model for the disc side (taking the effect of thermal resistance between the assembled components into consideration) and a steady-state quarter model for the pin were developed. Water cooling and air cooling of the steel shaft were also compared. It was found that air cooling allowed a higher temperature in the contact region of the two sliding partners. The experimental results obtained with thermocouples and a thermal camera showed good agreement with the model predictions. [source] Roles of the two ClpC ATP binding sites in the regulation of competence and the stress responseMOLECULAR MICROBIOLOGY, Issue 3 2001Kürsad Turgay MecA targets the competence transcription factor ComK to ClpC. As a consequence, this factor is degraded by the ClpC/ClpP protease. ClpC is a member of the Clp/HSP100 family of ATPases and possesses two ATP binding sites. We have individually modified the Walker A motifs of these two sites and have also deleted a putative substrate recognition domain of ClpC at the C-terminus. The effects of these mutations were studied in vitro and in vivo. Deletion of the C-terminal domain resulted in a decreased binding affinity for MecA, a decreased ATPase activity in response to MecA addition and decreased degradative activity in vitro. In vivo, this deletion resulted in a failure to degrade ComK and in a decrease in thermal resistance for growth. Mutation of the N-terminal Walker A box (K214Q) caused a drastically decreased ATPase activity in vitro, but did not interfere with MecA binding. In vivo, this mutation had no effect on thermal resistance, but had a clpC null phenotype with respect to competence. Mutation of the C-terminal Walker A motif (K551Q) caused essentially the reverse phenotype both in vivo and in vitro. Although binding to MecA was only moderately impaired with 2 mM ATP, this mutant protein displayed no response to 0.2 mM ATP, unlike the wild-type ClpC and the K214Q mutant protein. The ATPase activity of the K551Q mutant protein, induced by the addition of MecA plus ComS, was decreased about 10-fold but was not eliminated. In vivo, the K551Q mutation showed a partial defect with respect to competence and a profound loss of thermal resistance. Sporulation was reduced drastically by the K551Q and less so by the K214Q mutation, but remained unaffected by deletion of the C-terminal domain. Although the evidence suggests that the functions of the two ATP-binding domains overlap, it appears that the N-terminal nucleotide-binding domain of ClpC is particularly concerned with MecA-related functions, whereas the C-terminal domain plays a more general role in the activities of ClpC. [source] Practical mathematical model to predict the performance of insulating packagesPACKAGING TECHNOLOGY AND SCIENCE, Issue 6 2007Seung-Jin Choi Abstract Thermal insulation is used in a variety of applications to protect temperature-sensitive products from thermal damage. Several factors affect the performance of insulating packages. These factors include the packaging material, the geometry of the package, the geometry of the product, and the degree of contact between the product and the package. In this study, a comprehensive model which includes all of these factors was developed to predict the performance of the insulating package. First, an equation was derived for the calculation of the thermal resistance of a multilayered wall. The wall resistance was then used in a mathematical model which included the aforementioned factors. Basic heat transfer principles covering conduction, convection and radiation were applied to the model and the package heat penetration rate was calculated. Based on this model, several factors affecting the performance of the insulating package were discussed. Examples of the use of this model for ice requirement calculations were also included. Copyright © 2007 John Wiley & Sons, Ltd. [source] Low thermal resistance, high-speed 980 nm asymmetric intracavity-contacted oxide-aperture VCSELsPHYSICA STATUS SOLIDI (A) APPLICATIONS AND MATERIALS SCIENCE, Issue 7 2009Y. M. Song Abstract We demonstrated high-speed characteristics of an oxide-aperture vertical-cavity surface-emitting laser (VCSEL) with intracavity structures for both p- and n-contacts, based on InGaAs/GaAs multiple quantum wells operating at , , 980 nm, indicating a low thermal resistance (Rth). The asymmetric current injection scheme is employed for reducing current crowding around the rim of the oxide aperture. A high aluminium content undoped Al0.88Ga0.12As and GaAs distributed Bragg reflector (DBR) mirror is used for efficient heat dissipation. The VCSEL with a 7 ,m oxide aperture exhibited an output power of 2.5 mW and a threshold current of 0.8 mA with a slope efficiency of 0.39 mW/mA at 20 °C under continuous-wave operation and it still worked with 1.3 mW at 90 °C. The temperature tuning coefficient of 0.081 nm/°C and dissipated electrical power tuning coefficient of 0.104 nm/mW were observed, leading to a low Rth of 1.28 °C/mW. A high modulation bandwidth up to 13 GHz with a modulation current efficiency factor of 6.1 GHz/mA1/2 was achieved. (© 2009 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [source] Thermal characterization of light-emitting diodes in the frequency domainPHYSICA STATUS SOLIDI (C) - CURRENT TOPICS IN SOLID STATE PHYSICS, Issue S2 2009Pranci, kus Vitta Abstract We report on a method for measurement of thermal relaxation time constants within light-emitting diodes (LEDs) using harmonic modulation of the driving current. The method is based on the phase shift of the forward voltage waveform in respect to that of the modulated current. The phase shift is due to the sensitivity of the forward voltage to junction temperature, which responds to the modulation of the heat generation depending on the thermal relaxation rate. The frequency dependence of the phase shift was shown to exhibit characteristic dips at angular frequencies equal to inverse thermal time constants. Such an approach for thermal characterization was demonstrated for common GaP, AlGaAs, AlInGaP, and InGaN LEDs. In particular, low-power p-n and double-heterostructure LEDs as well as high-power truncated-inverted-pyramid and flip-chip LEDs were investigated. The measured thermal time constants (, 0.1,100 ms) were tentatively assigned to heat flows within the multilayer structure of the LEDs and collated with the numerical estimates based on thermal resistance and heat capacitance of the LED components. (© 2009 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [source]
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