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TEM Samples (tem + sample)
Selected AbstractsCrack initiation in the brittle fracture of ferritic steelsFATIGUE & FRACTURE OF ENGINEERING MATERIALS AND STRUCTURES, Issue 9-10 2006M. COATES ABSTRACT Fracture in many steels is thought to initiate from fractured carbides. It is often supposed that in pre-cracked specimens, many carbides fracture in the plastic zone of the pre-crack, and that eventually fracture propagates from one of these to cause fracture of the whole specimen. Sources of fracture initiation in steels were investigated using a modified A533B steel as a model material. Specimens were annealed to produce a distribution of micron-sized carbides in a ferrite matrix. Four-point bend tests were carried out in the temperature range 77,373K to determine the material's ductile brittle transition. Pre-cracked samples were loaded up to 90% of the fracture strength at temperatures on the lower shelf (163K) and at the mid point of the transition region (243K). The samples were then sectioned and polished to produce SEM and TEM samples containing the crack tip. Other samples were made of areas some distance from the crack tip and out of the plastic zone. An extensive search for fracture initiation sites found no evidence for fracture initiation originating from fractured carbides. [source] Nanoscale Structuring and InvestigationIMAGING & MICROSCOPY (ELECTRONIC), Issue 4 2006Crossbeam Tool with Ultra High Resolution FIB Technology Recent developments in nano- and semiconductor technology have substantially increased the demand for accurate and efficient site specific cross-sectioning of specimens and preparation of TEM samples. Moreover, nano-research is facing new challenges for manipulation, observation, and modification of devices on a submicron scale. [source] Combining Ar ion milling with FIB lift-out techniques to prepare high quality site-specific TEM samplesJOURNAL OF MICROSCOPY, Issue 3 2004Z. HUANG Summary Focused ion beam (FIB) techniques can prepare site-specific transmission electron microscopy (TEM) cross-section samples very quickly but they suffer from beam damage by the high energy Ga+ ion beam. An amorphous layer about 20,30 nm thick on each side of the TEM lamella and the supporting carbon film makes FIB-prepared samples inferior to the traditional Ar+ thinned samples for some investigations such as high resolution transmission electron microscopy (HRTEM) and electron energy loss spectroscopy (EELS). We have developed techniques to combine broad argon ion milling with focused ion beam lift-out methods to prepare high-quality site-specific TEM cross-section samples. Site-specific TEM cross-sections were prepared by FIB and lifted out using a Narishige micromanipulator onto a half copper-grid coated with carbon film. Pt deposition by FIB was used to bond the lamellae to the Cu grid, then the coating carbon film was removed and the sample on the bare Cu grid was polished by the usual broad beam Ar+ milling. By doing so, the thickness of the surface amorphous layers is reduced substantially and the sample quality for TEM observation is as good as the traditional Ar+ milled samples. [source] Laser-based in situ techniques: Novel methods for generating extreme conditions in TEM samples,MICROSCOPY RESEARCH AND TECHNIQUE, Issue 3 2009Mitra L. Taheri Abstract The dynamic transmission electron microscope (DTEM) is introduced as a novel tool for in situ processing of materials. Examples of various types of dynamic studies outline the advantages and differences of laser-based heating in the DTEM in comparison to conventional (resistive) heating in situ TEM methods. We demonstrate various unique capabilities of the drive laser, namely, in situ processing of nanoscale materials, rapid and high temperature phase transformations, and controlled thermal activation of materials. These experiments would otherwise be impossible without the use of the DTEM drive laser. Thus, the potential of the DTEM as a new technique to process and characterize the growth of a myriad of micro and nanostructures is demonstrated. Microsc. Res. Tech., 2009. Published 2009 Wiley-Liss, Inc. [source] |