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Passive Circuits (passive + circuit)

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Engineering100%

Selected Abstracts

Third-order passive load identification under non-sinusoidal conditions

EUROPEAN TRANSACTIONS ON ELECTRICAL POWER, Issue 2 2002
P. Mattavelli
This paper presents an extension of the well known load identification method, valid under non-sinusoidal conditions, which makes use of a 2nd -order passive circuit and an auxiliary voltage or current generator. The proposed solution is similar, but uses a 3rd -order passive circuit. This allows to identify the passive circuit components with positive or negative parameters, according to the aim of the identification (load modeling or compensation). Moreover, the proposed approach keeps the orthogonality between current/voltage components and removes the indetermination which occurs, with the 2nd -order approach, in the case of sinusoidal operation. As an application example, the proposed approach is applied to the design of a hybrid compensation system including active and passive filtering. [source]

Size reduction of microwave and millimeter-wave passive circuits by UC-PBG in standard 0.18-,m CMOS technology

MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, Issue 9 2008
Shuiyang Lin
Abstract Size reduction of microwave and millimeter-wave (mm-wave) passive circuits incorporating a defective uniplanar compact photonic bandgap (UC-PBG) slow-wave structure is investigated. Benefited from the multilayer mental technology of the standard 0.18-,m CMOS process, thin film microstrip structure is properly constructed on the lossy silicon substrate to reduce substrate loss. Defected periodic patterns on the ground plane are used to contribute to an enhancement of the effective dielectric constant and the slow-wave factor is 14% increased by the use of UC-PBG ground. Microwave and mm-wave passive circuits including resonator and filter are designed and fabricated. Measured results show that the use of UC-PBG ground has induced a frequency drop of 14% and validate the size reduction concept by using UC-PBG. © 2008 Wiley Periodicals, Inc. Microwave Opt Technol Lett 50: 2251,2254, 2008; Published online in Wiley InterScience (www.interscience.wiley.com).DOI 10.1002/mop.23643 [source]

LTCC broadband deep embedded interconnects (DEI) with application for embedded bandpass filter

MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, Issue 3 2003
J. J. Yu
Abstract Careful design of via transitions intended for use in practical microwave applications is needed to realize the advantages of low-temperature co-fired ceramic (LTCC), such as highly integrated buried passive circuits. Grounded coplanar waveguide (GCPW) to asymmetrical stripline vertical interconnects is optimized for thick LTCC substrate. The focus is to develop a vertical transition through thick substrate supporting deep embedded interconnects (DEI). The measured results demonstrate vertical transitions with good performance up to 20 GHz. Embedded LTCC bandpass filter with such vertical transition has been demonstrated with an insertion loss of 2.2 dB and return loss better than ,20 dB at 16.2 GHz. © 2003 Wiley Periodicals, Inc. Microwave Opt Technol Lett 38: 179,181, 2003; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.11007 [source]