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Device Modelling (device + modelling)

Distribution by Scientific Domains
Engineering75%

Selected Abstracts

A two-dimensional stochastic algorithm for the solution of the non-linear Poisson,Boltzmann equation: validation with finite-difference benchmarks,

INTERNATIONAL JOURNAL FOR NUMERICAL METHODS IN ENGINEERING, Issue 1 2006
Kausik Chatterjee
Abstract This paper presents a two-dimensional floating random walk (FRW) algorithm for the solution of the non-linear Poisson,Boltzmann (NPB) equation. In the past, the FRW method has not been applied to the solution of the NPB equation which can be attributed to the absence of analytical expressions for volumetric Green's functions. Previous studies using the FRW method have examined only the linearized Poisson,Boltzmann equation. No such linearization is needed for the present approach. Approximate volumetric Green's functions have been derived with the help of perturbation theory, and these expressions have been incorporated within the FRW framework. A unique advantage of this algorithm is that it requires no discretization of either the volume or the surface of the problem domains. Furthermore, each random walk is independent, so that the computational procedure is highly parallelizable. In our previous work, we have presented preliminary calculations for one-dimensional and quasi-one-dimensional benchmark problems. In this paper, we present the detailed formulation of a two-dimensional algorithm, along with extensive finite-difference validation on fully two-dimensional benchmark problems. The solution of the NPB equation has many interesting applications, including the modelling of plasma discharges, semiconductor device modelling and the modelling of biomolecular structures and dynamics. Copyright © 2005 John Wiley & Sons, Ltd. [source]

Integral evaluation in semiconductor device modelling using simulated annealing with Bose,Einstein statistics

INTERNATIONAL JOURNAL OF NUMERICAL MODELLING: ELECTRONIC NETWORKS, DEVICES AND FIELDS, Issue 4 2007
E.A.B. Cole
Abstract Fermi integrals arise in the mathematical and numerical modelling of microwave semiconductor devices. In particular, associated Fermi integrals involving two arguments arise in the modelling of HEMTs, in which quantum wells form at the material interfaces. The numerical evaluation of these associated integrals is time consuming. In this paper, these associated integrals are replaced by simpler functions which depend on a small number of optimal parameters. These parameters are found by optimizing a suitable cost function using a genetic algorithm with simulated annealing. A new method is introduced whereby the transition probabilities of the simulated annealing process are based on the Bose,Einstein distribution function, rather than on the more usual Maxwell,Boltzmann statistics or Tsallis statistics. Results are presented for the simulation of a four-layer HEMT, and show the effect of the approximation for the associated Fermi integrals. A comparison is made of the convergence properties of the three different statistics used in the simulated annealing process. Copyright © 2007 John Wiley & Sons, Ltd. [source]

Iterative versus direct parallel substructuring methods in semiconductor device modelling

NUMERICAL LINEAR ALGEBRA WITH APPLICATIONS, Issue 1 2005
L. Giraud
Abstract The numerical simulation of semiconductor devices is extremely demanding in term of computational time because it involves complex embedded numerical schemes. At the kernel of these schemes is the solution of very ill-conditioned large linear systems. In this paper, we present the various ingredients of some hybrid iterative schemes that play a central role in the robustness of these solvers when they are embedded in other numerical procedures. On a set of two-dimensional unstructured mixed finite element problems representative of semiconductor simulation, we perform a fair and detailed comparison between parallel iterative and direct linear solution techniques. We show that iterative solvers can be robust enough to solve the very challenging linear systems that arise in those simulations. Copyright © 2004 John Wiley & Sons, Ltd. [source]

General temperature dependence of solar cell performance and implications for device modelling

PROGRESS IN PHOTOVOLTAICS: RESEARCH & APPLICATIONS, Issue 5 2003
Martin A. Green
Solar cell performance generally decreases with increasing temperature, fundamentally owing to increased internal carrier recombination rates, caused by increased carrier concentrations. The temperature dependence of a general solar cell is investigated on the basis of internal device physics, producing general results for the temperature dependence of open-circuit voltage and short-circuit current, as well as recommendations for generic modelling. Copyright © 2003 John Wiley & Sons, Ltd. [source]