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Deposition Methods (deposition + methods)
Selected AbstractsRelationship between Condition of Deposition and Properties of W-Ti-N Thin Films Prepared by Reactive Magnetron Sputtering,ADVANCED ENGINEERING MATERIALS, Issue 3 2006V. Kuchuk A correlation between the film properties of nitrides, oxides etc., and their structure, is of fundamental importance , not only for thin solid films physics but also for practical applications. The structure of the films depends on deposition methods and their parameters. The relationship between properties (chemical and phase compositions, surface morphology, and electrical resistivity) and nitrogen partial pressure of reactive magnetron sputtered W-Ti-N thin films has been discussed here in detail. [source] Nanoparticle Arrays on Surfaces Fabricated Using Anodic Alumina Films as Templates,ADVANCED FUNCTIONAL MATERIALS, Issue 5 2003M.S. Sander Abstract High density nanoparticle arrays on surfaces have been created using a template-assisted approach. Templates were produced by evaporating aluminum onto substrates and subsequently anodizing the aluminum to produce nanoporous alumina films. The resulting templates have a narrow distribution of pore sizes tunable from ,,25 to ,,70 nm. To demonstrate the flexibility of this approach for producing nanoparticle arrays on various substrates, templates have been fabricated on silicon oxide, silicon, and gold surfaces. In all cases, a final chemical etching step yielded pores that extended completely through the template to the underlying substrate. Because the templates remain in intimate contact with the substrate throughout processing, they may be used with either vacuum-based or wet chemical deposition methods to direct the deposition of nanoparticles onto the underlying substrates. Here we have produced gold nanodot arrays using evaporation and gold nanorod arrays by electrodeposition. In each case, the diameter and height of the nanoparticles can be controlled using the confining dimensions of the templates, resulting in high density (,,1010,cm,2) arrays of nanoparticles over large areas (>,1 cm2). [source] Implant Surface Modification Using Laser Guided Coatings: In Vitro Comparison of Mechanical PropertiesJOURNAL OF PROSTHODONTICS, Issue 5 2008Asvin Vasanthan DDS Abstract Purpose: Plasma-sprayed hydroxyapatite (HA)-coated implants show failures along the coating,substrate interface due to poor bond strength. We analyzed HA coatings obtained by pulsed laser deposition (PLD) and compared them to commercially used plasma-sprayed coatings with respect to their bond strength to titanium alloy (Ti-6Al-4V), as well as surface roughness alterations produced by each of the two deposition methods. Materials and Methods: Twelve titanium alloy disks were plasma-sprayed under commercial implant coating conditions, and 24 titanium alloy disks were coated using PLD. All coatings were characterized by the presence of the different calcium phosphate (CaP) phases. The plasma-sprayed coatings (n = 12) were predominantly HA, and the pulsed laser-deposited coatings were hydroxydyapatite (n = 12) and HA coating with a tetra calcium phosphate (TTCP) phase (n = 12). The surface roughness was analyzed before and after the coating processes to assess roughness changes to the surface by the coatings. The adhesive bond strengths of these coatings to the substrate titanium alloy was tested and compared. Scheffé's test was used to analyze the statistical significance of the data. Results: The surface roughness alteration following PLD was a decrease of 0.2 ,m, whereas following plasma spraying the decrease was 1.0 ,m. Bond strengths were as follows [mean (SD) in MPa]: pulsed laser-deposited HA coatings: 68.3 (17.8); pulsed laser-deposited HA with tetra-CaP: 55.2 (21.1); plasma-sprayed HA 17.0 (2.8). The multivariate Scheffé's test revealed that HA coatings obtained by PLD had significantly increased bond strengths compared with the plasma sprayed ones (p, 0.05). Conclusions: HA coatings obtained by PLD showed greater adherence to titanium alloy. PLD offers an alternative method to produce thinner coatings with better adherence properties, along with precise control over the deposition process. [source] Fabrication of a n -type ZnO/p -type Cu,Al,O heterojunction diode by sputtering deposition methodsPHYSICA STATUS SOLIDI (C) - CURRENT TOPICS IN SOLID STATE PHYSICS, Issue 5 2009Satoru Takahata Abstract CuAlO2 polycrystalline films were deposited by the helicon-wave-excited plasma sputtering (HWPS) method at 700 °C. The best full-width at half-maximum value of the (006) CuAlO2 X-ray diffraction peak was 0.19 degrees, which was similar to those reported previously using other deposition methods. While, noncrystalline Cu,Al,O films were deposited by a conventional RF sputtering method. Using this p -type transparent conducting oxide (TCO) film and an n -type ZnO film deposited by HWPS, a n -type ZnO/p -type Cu,Al,O heterojunction diode was fabricated. Optical transmittance of the device was approximately 80% in the near infrared region. The rectifying current,voltage characteristics with a threshold forward voltage approximately 1.4 V were obtained. These results are the first step toward realizing an electrical/optical device using p -type CuAlO2 or Cu-Al-O films. (© 2009 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [source] The effect of crystallization technology and gate insulator deposition method on the performance and reliability of polysilicon TFTsPHYSICA STATUS SOLIDI (C) - CURRENT TOPICS IN SOLID STATE PHYSICS, Issue 12 2008Despina C. Moschou Abstract Polysilicon TFTs were fabricated using solid phase crystallization (SPC) and also two different excimer laser annealing techniques (ELA) for polysilicon crystallization. Moreover, we tried two different gate oxide deposition methods, using PECVD or TEOS LPCVD. Comparing the characteristics of the fabricated TFTs, we were able to probe the effects of the polysilicon crystallization techniques and the gate oxide deposition methods on TFT performance and reliability. This way, an optimization of the TFT fabrication procedure could be possible. (© 2008 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim) [source] Trends in Combining Techniques for the Deposition of New Application-Tailored Thin FilmsPLASMA PROCESSES AND POLYMERS, Issue 3 2007Gheorghe Dinescu Abstract A modern approach for the development of thin film deposition technology is to combine the classical principles of PVD and CVD techniques, and to assist them with the recent progress in plasma sources and reactors. The power of inter-combining the deposition methods with new ideas and tools is discussed for a particular number of cases, such as the combination of magnetron sputtering with pulsed ion implantation, of pulsed laser deposition with low-pressure radiofrequency directional plasma beams, and of magnetron sputtering with plasma-beam-enhanced chemical vapor deposition. The discussed cases are complemented with examples from literature, highlighting the recent trends in combining plasma based deposition techniques, and the need for an improvement in the terminology. [source] Development of thin-film Cu(In,Ga)Se2 and CdTe solar cellsPROGRESS IN PHOTOVOLTAICS: RESEARCH & APPLICATIONS, Issue 2-3 2004A. Romeo Abstract Cu(In,Ga)Se2 and CdTe heterojunction solar cells grown on rigid (glass) or flexible foil substrates require p -type absorber layers of optimum optoelectronic properties and n -type wide-bandgap partner layers to form the p,n junction. Transparent conducting oxide and specific metal layers are used for front and back electrical contacts. Efficiencies of solar cells depend on various deposition methods as they control the optoelectronic properties of the layers and interfaces. Certain treatments, such as addition of Na in Cu(In,Ga)Se2 and CdCl2 treatment of CdTe have a direct influence on the electronic properties of the absorber layers and efficiency of solar cells. Processes for the development of superstrate and substrate solar cells are reviewed. Copyright © 2004 John Wiley & Sons, Ltd. [source] | ||||||||||